Patents by Inventor Bihua He

Bihua He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate interconnections for packaged semiconductor device
    Patent number: 9997445
    Abstract: A “universal” substrate for a semiconductor device is formed of a non-conductive substrate material. A uniform array of conductive pillars is formed in the substrate material. The pillars extend from a top surface of the substrate material to a bottom surface of the substrate material. A die flag may be formed on the top surface of the substrate material. Pillars underneath the die flag are connected to pillars beyond a perimeter of the die flag with wires. Power and ground rings may be formed by connecting rows of pillars that surround the die flag.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: June 12, 2018
    Assignee: NXP USA, INC.
    Inventors: Kai Yun Yow, Chee Seng Foong, Bihua He, Navas Khan Oratti Kalandar, Lan Chu Tan, Yuan Zang
  • SUBSTRATE INTERCONNECTIONS FOR PACKAGED SEMICONDUCTOR DEVICE
    Publication number: 20180114748
    Abstract: A “universal” substrate for a semiconductor device is formed of a non-conductive substrate material. A uniform array of conductive pillars is formed in the substrate material. The pillars extend from a top surface of the substrate material to a bottom surface of the substrate material. A die flag may be formed on the top surface of the substrate material. Pillars underneath the die flag are connected to pillars beyond a perimeter of the die flag with wires. Power and ground rings may be formed by connecting rows of pillars that surround the die flag.
    Type: Application
    Filed: December 15, 2016
    Publication date: April 26, 2018
    Inventors: Kai Yun Yow, Chee Seng Foong, Bihua He, Navas Khan Oratti Kalandar, Lan Chu Tan, Yuan Zang