Patents by Inventor Bii-Junq Chang

Bii-Junq Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8129762
    Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: March 6, 2012
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
  • Publication number: 20100164040
    Abstract: A microlens structure and a method of fabrication thereof are provided. The method comprises forming a layer of microlens material over a substrate, which has photo-sensitive elements formed therein. The microlens material, which comprises a photo-resist material, is exposed in accordance with a desired pattern a plurality of times. The energy used with each exposure process is less than the energy required if a single exposure is used. Furthermore, the masks used for each exposure may differ. In an embodiment, the masks are varied so as to create a notch in the upper corner of the microlens. The microlens structure may have a height less than about 0.5 um and/or a gap between microlenses less than about 0.2 um. In an embodiment, one or more dielectric layers having a combined thickness greater than about 3.5 um are interposed between the photo-sensitive elements and the microlenses.
    Type: Application
    Filed: March 11, 2010
    Publication date: July 1, 2010
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Chang Kao, Chih-Kung Chang, Fu-Tien Weng, Bii-Junq Chang
  • Patent number: 7704778
    Abstract: A microlens structure and a method of fabrication thereof are provided. The method comprises forming a layer of microlens material over a substrate, which has photo-sensitive elements formed therein. The microlens material, which comprises a photo-resist material, is exposed in accordance with a desired pattern a plurality of times. The energy used with each exposure process is less than the energy required if a single exposure is used. Furthermore, the masks used for each exposure may differ. In an embodiment, the masks are varied so as to create a notch in the upper corner of the microlens.
    Type: Grant
    Filed: July 14, 2005
    Date of Patent: April 27, 2010
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Chang Kao, Chih-Kung Chang, Fu-Tien Weng, Bii-Junq Chang
  • Publication number: 20090104547
    Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
    Type: Application
    Filed: December 31, 2008
    Publication date: April 23, 2009
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
  • Patent number: 7507598
    Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
    Type: Grant
    Filed: June 20, 2005
    Date of Patent: March 24, 2009
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
  • Patent number: 7505206
    Abstract: A method of manufacturing a microlens device by depositing a microlens material layer over a substrate that includes photo-sensors. The microlens material layer is then exposed and developed to define microlens material elements, including first microlens material elements and second microlens material elements. Each second microlens material element is substantially greater in thickness relative to each first microlens material element. The microlens material elements are then heated to form a microlens array that includes first microlens array elements, each corresponding to a first microlens material element, and second microlens array elements, each corresponding to a second microlens material element. Each first microlens array element has a substantially greater focal length relative to each second microlens array element. For example, each second microlens array element is substantially greater in thickness relative to each first microlens array element.
    Type: Grant
    Filed: July 10, 2006
    Date of Patent: March 17, 2009
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Jack Deng, Chih-Kung Chang, Chin Chen Kuo, Ming-Chang Kao, Fu-Tien Weng, Bii-Junq Chang
  • Publication number: 20080007839
    Abstract: A method of manufacturing a microlens device by depositing a microlens material layer over a substrate that includes photo-sensors. The microlens material layer is then exposed and developed to define microlens material elements, including first microlens material elements and second microlens material elements. Each second microlens material element is substantially greater in thickness relative to each first microlens material element. The microlens material elements are then heated to form a microlens array that includes first microlens array elements, each corresponding to a first microlens material element, and second microlens array elements, each corresponding to a second microlens material element. Each first microlens array element has a substantially greater focal length relative to each second microlens array element. For example, each second microlens array element is substantially greater in thickness relative to each first microlens array element.
    Type: Application
    Filed: July 10, 2006
    Publication date: January 10, 2008
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jack DENG, Chih-Kung CHANG, Chin Chen KUO, M. C. KAO, Fu-Tien WENG, Bii-Junq CHANG
  • Patent number: 7264976
    Abstract: A method of manufacturing a plurality of microlenses on a substrate comprises forming a grid having raised ridges defining a plurality of openings on the substrate and forming a plurality of patterned photoresist features each disposed within one of the plurality of openings. The plurality of patterned photoresist features can then be reflowed inside the grid.
    Type: Grant
    Filed: February 23, 2005
    Date of Patent: September 4, 2007
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jack Deng, Chin Chen Kuo, Fu-Tien Weng, Chih-Kung Chang, Bii-Junq Chang
  • Publication number: 20060189062
    Abstract: A method of manufacturing a plurality of microlenses on a substrate comprises forming a grid having raised ridges defining a plurality of openings on the substrate and forming a plurality of patterned photoresist features each disposed within one of the plurality of openings. The plurality of patterned photoresist features can then be reflowed inside the grid.
    Type: Application
    Filed: February 23, 2005
    Publication date: August 24, 2006
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jack Deng, Chin Kuo, Fu-Tien Weng, Chih-Kung Chang, Bii-Junq Chang
  • Publication number: 20060189024
    Abstract: A microlens structure and a method of fabrication thereof are provided. The method comprises forming a layer of microlens material over a substrate, which has photo-sensitive elements formed therein. The microlens material, which comprises a photo-resist material, is exposed in accordance with a desired pattern a plurality of times. The energy used with each exposure process is less than the energy required if a single exposure is used. Furthermore, the masks used for each exposure may differ. In an embodiment, the masks are varied so as to create a notch in the upper corner of the microlens.
    Type: Application
    Filed: July 14, 2005
    Publication date: August 24, 2006
    Inventors: Ming-Chang Kao, Chih-Kung Chang, Fu-Tien Weng, Bii-Junq Chang
  • Publication number: 20060019424
    Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
    Type: Application
    Filed: June 20, 2005
    Publication date: January 26, 2006
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
  • Patent number: 6582988
    Abstract: The present invention features a method for forming micro lens arrays on light-sensitive or light-emitting semiconductor structures. A unique oxygen plasma etch “descum” step is performed prior to the lens reflow hardbake. In addition, a photo-sensitive planarization layer place immediately atop a color filter layer results in fewer process steps. The micro lens array thus formed has a minimal number of merged or collapsed lenses and residue on bond pad areas is significantly reduced.
    Type: Grant
    Filed: July 12, 2001
    Date of Patent: June 24, 2003
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Yu-Kung Hsiao, Sheng-Liang Pan, Bii Junq Chang
  • Patent number: 6531266
    Abstract: A process for reworking a non-reflowed, defective microlens element shape, of an image sensor device, without damage to an underlying spacer layer, or to underlying color filter elements, has been developed. The non-reflowed, microlens element shape, if defective and needing rework, is first subjected to a high energy exposure, converting the non-reflowed, microlens element shape to a acid type, microlens shape, then removed using a base type developer solution. Prior to formation of a reworked microlens element shape a baking cycle is employed to freeze, or render inactive, any organic residue still remaining on the surface of the spacer layer, after the base type developer removal procedure. Formation of the reworked, microlens element shape, followed by an anneal cycle, results in the desired rounded, microlens element, on the underlying spacer layer.
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: March 11, 2003
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Chih-Kung Chang, Kuang-Peng Lin, Yu-Kung Hsiao, Fu-Tien Weng, Bii-Junq Chang, Kuo-Liang Lu
  • Patent number: 6511779
    Abstract: Within a method for forming an image array optoelectronic microelectronic fabrication there is first provided a substrate. There is then formed at least in part over the substrate a bidirectional array of image array optoelectronic microelectronic pixel elements comprising a plurality of series of patterned color filter layers corresponding with a plurality of colors. Within the method, at least one series of patterned color filter layers within the plurality of series of patterned color filter layers corresponding with at least one color within the plurality of colors is formed employing a photolithographic method which employs a plurality of separate photoexposure steps for forming a plurality of separate sub-series of patterned color filter layers within the series of patterned color filter layers corresponding with the at least one color within the plurality of colors.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: January 28, 2003
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd
    Inventors: Fu-Tien Weng, Chiu-Kung Chang, Yu-Kung Hsiao, Bii-Junq Chang, Kuo-Lian Lu
  • Patent number: 6395576
    Abstract: Formation of integrated color filters for gain-ratio balanced semiconductor array imagers using a spectrophotometric feedback control loop to adjust layer thickness during the deposition process is disclosed. The fabrication sequence of G/R/B conventionally used in Prior Art has been changed to B/R/G or B/G/R to enable the process to adapt to yielding specified color gain-ratio values without the need for integrated circuit redesign. A high efficiency color filter process is demonstrated wherein the additional neutral-density attenuator layers and/or spacer layers required in Prior Art fabrication methods are eliminated. The disclosed process is shown to enable high-precision thickness control of the color filter layers. Blue coating lift-off problems and the steric effect associated with successive depositions of color layers having step-height variations are eliminated.
    Type: Grant
    Filed: June 14, 2000
    Date of Patent: May 28, 2002
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Chih-Kung Chang, Yu-Kung Hsiao, Sheng-Liang Pan, Bii-Junq Chang
  • Patent number: 6017393
    Abstract: A system for pumping resist to a wafer coating machine includes a line that returns a selected proportion of the resist entering the resist pump to the resist supply tank. The return line to the tank is connected to the pump outlet at a higher point than the pump outlet to the wafer coating machine, and the resist that is returned to the tank carries substantially all of the bubbles that are carried in the resist entering the tank. The bubbles are removed from the resist in the tank and the resist can be used normally.
    Type: Grant
    Filed: November 20, 1998
    Date of Patent: January 25, 2000
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Jen Song Liu, Bii Junq Chang, Jen Shang Fang, Hao Wei Chang
  • Patent number: 5951743
    Abstract: The present invention discloses an exhaust gas conduit for feeding exhaust gases to a scrubber wherein the conduit is equipped with a self-cleaning device mounted inside the conduit body adjacent to an outlet end of the conduit for dispensing a cleaning solvent onto the inside wall of the outlet end of the conduit such that solid depositions on the inside wall can be avoided. The present invention is also directed to a method for preventing solid depositions in an exhaust gas inlet port to a wet scrubber by utilizing a self-cleaning device mounted in a conduit adjacent to an outlet end of the exhaust conduit and by dispensing a cleaning solvent through the self-cleaning device and spraying the solvent onto an inside wall of the outlet end of the conduit to prevent the formation of solid depositions on the inside wall.
    Type: Grant
    Filed: December 5, 1997
    Date of Patent: September 14, 1999
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tung-Wen Hsieh, Kuo-Liang Lu, Bii-Junq Chang
  • Patent number: 5765501
    Abstract: A gauge marker system has a flexible track that fits around the circumference of a gauge housing and carries one or more markers that extend over the face of the gauge to indicate a dial position that is to be noticed by a person using the gauge. The markers can be slid along the track to a selected position. The track is adapted to be fastened to the gauge by a cable tie that lies in a groove on the track.
    Type: Grant
    Filed: June 3, 1996
    Date of Patent: June 16, 1998
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shu-Lin Tung, Bii-Junq Chang, Jen-Song Liu