Patents by Inventor Bijendra Singh
Bijendra Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10623315Abstract: In one embodiment of the disclosure, packets are routed according to a VRF (Virtual Routing and Forwarding) domain that is represented by a VRF identifier in a VRF-identifier (ID) field of packet headers. In one embodiment of the disclosure, a VRF identifier may be added to a VRF-ID field of a packet header so that the packet is routed according to a VRF domain that the packet belongs to.Type: GrantFiled: March 22, 2016Date of Patent: April 14, 2020Assignee: Amazon Technologies, Inc.Inventors: Bijendra Singh, Thomas A. Volpe, Kari Ann OBrien, Kiran Kalkunte Seshadri
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Patent number: 10616105Abstract: Systems, methods, apparatus and computer readable medium is disclosed for extending the Virtual Routing and Forwarding (VRF) in the network using embedded source identifiers in the packets. An example apparatus may include ports, memory and processing logic. The memory may include VRF routing tables corresponding to respective VRF domains and a list of media access control (MAC) addresses, wherein each MAC address in the list is linked to one of the respective VRF routing tables. The processing logic may be configured to receive an ingress packet at a port, identify a matching MAC address in the list that matches a source identifier of the ingress packet, and process the ingress packet according to the respective VRF domain associated with the matching MAC address that matches the source identifier.Type: GrantFiled: October 12, 2018Date of Patent: April 7, 2020Assignee: Amazon Technologies, Inc.Inventors: Bijendra Singh, Anand Narayan Acharya, Himabindu Sajja, Kenneth Patton
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Patent number: 10594015Abstract: A heat pipe is provided that is adapted for use as part of an antenna. The heat pipe includes a first conductive shell portion; a second conductive shell portion; and an insulating shell portion disposed between and connected to the first conductive shell portion and the second conductive shell portion. A wick structure is disposed within the sealed chamber.Type: GrantFiled: May 31, 2017Date of Patent: March 17, 2020Assignee: Intel CorporationInventors: Praveen Kumar, Bijendra Singh, Saku Lahti, Seppo Vesamaki, Marko Bonden
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Patent number: 10587514Abstract: Packet processing pipelines may implement filtering of control plane decisions. When network packets are received various types of decision-making and processing is performed. In order to complete processing for the network packet, some decisions may need to be determined by a control plane for the packet processing pipeline, such as a general processor. Requests for control plane decisions for received network packets may be filtered prior to sending the requests to the control plane based on whether the same control plane decisions have been requested for previously received network packets. For control plane decisions with outstanding control plane decision requests, an additional control plane decision request for the network packet may be blocked, whereas control plane decisions with no outstanding control plane decision requests may be allowed.Type: GrantFiled: December 21, 2015Date of Patent: March 10, 2020Assignee: Amazon Technologies, Inc.Inventors: Bijendra Singh, Thomas A. Volpe, Sundeep Amirineni
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Patent number: 10547547Abstract: Disclosed are techniques for determining lookup value(s) for each of a plurality of network packets. The lookup value can be used to locate a forwarding table storage location(s) for populating or retrieving forwarding information from forwarding table(s). An entropy value of the lookup values can indicate a greater degree of disorder than an entropy value for addresses of the network packets.Type: GrantFiled: June 22, 2018Date of Patent: January 28, 2020Assignee: Amazon Technologies, Inc.Inventor: Bijendra Singh
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Patent number: 10498718Abstract: A network protocol is provided to identify and authenticate devices from different vendors that are deployed in a network. Each vendor is provided a vendor key unique to the vendor by a network management server. A vendor server associated with the vendor provisions a device with a first hash value generated using the vendor key among other device attributes. When the device is deployed in the network, the network management server queries the device. The device generates a second hash value using the first hash value and sends it in a response to the network management server. The network management server computes a local hash value using the vendor key and the attributes received from the response. The network management server authenticates the device if the local hash value matches with the second hash value.Type: GrantFiled: June 16, 2017Date of Patent: December 3, 2019Assignee: Amazon Technologies, Inc.Inventors: Bijendra Singh, Richard Dyson, Christopher Warren Jones, Praveen Kumar Madhanagopal
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Publication number: 20190326081Abstract: Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.Type: ApplicationFiled: June 27, 2019Publication date: October 24, 2019Applicant: Intel CorporationInventors: Prakash Kurma Raju, Raghavendra Doddi, Prasanna Pichumani, Sachin Bedare, Bijendra Singh, Gopinath Kandasamy
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Patent number: 10403560Abstract: Particular embodiments described herein provide for a thermal cooling system that is part of a device that includes a hole-in-motherboard configuration. The device can include a substrate, one or more dies on a top portion of the substrate, one or more printed circuit boards below the substrate, where the printed circuit boards are coupled to the substrate with solder balls, and one or more land side capacitors below the substrate. A thermal conducting plate, phase change material, and one or more sponge walls to help insulate the solder balls from the thermal conductive layer can be located in the hole of the hole-in-motherboard configuration and help transfer heat and thermal energy away from the device.Type: GrantFiled: September 28, 2018Date of Patent: September 3, 2019Assignee: Intel CorporationInventors: Bijendra Singh, Sachin Bedare
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Patent number: 10389632Abstract: Disclosed herein is an apparatus for processing an Internet Protocol (IP) header and label switching (LS) headers of a packet in a pipeline. The apparatus includes an LS header processing circuit configured to select a first operation for the packet using an LS header from the packet, and an IP header processing circuit configured to perform an IP lookup to select a second operation for the packet. The apparatus further includes a tunnel initiation circuit configured to initiate an LS tunnel or IP tunnel. The LS header processing circuit, the IP header processing circuit, and the tunnel initiation circuit are operable to operate sequentially on a same packet and concurrently on different packets in a pipeline. Each of these circuits is operable to be bypassed based on an outermost header in the packet, or the selected one of the first operation or the second operation.Type: GrantFiled: July 13, 2018Date of Patent: August 20, 2019Assignee: Amazon Technologies, Inc.Inventors: Kari Ann O'Brien, Thomas A. Volpe, Bijendra Singh
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Patent number: 10348603Abstract: Disclosed are techniques for implementing a device with memory comprising a data table, the data table configured to store a plurality of elements in buckets, wherein each of the plurality of buckets contains a plurality of elements. The memory can further comprise an indirection table, the indirection table comprising a plurality of bucket reference storage locations and a plurality of hash reference storage locations. The device can include processing logic configured to generate a plurality of hash values using information to be inserted into the data table and locate a hash reference stored in one of the plurality of hash reference storage locations corresponding to one of the plurality of hash values. The processing logic can further locate a bucket of the plurality of buckets corresponding to the one of the plurality of hash values.Type: GrantFiled: May 4, 2018Date of Patent: July 9, 2019Assignee: Amazon Technologies, Inc.Inventor: Bijendra Singh
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Publication number: 20190206839Abstract: Electronic device package technology is disclosed. An electronic device package in accordance with the present disclosure can include a heat spreader disposed between an electronic component and an electronic device. The heat spreader can be in thermal communication with the electronic component and operable to transfer heat from the electronic component to a lateral location beyond a first peripheral portion of the electronic component. Associated systems and methods are also disclosed.Type: ApplicationFiled: December 29, 2017Publication date: July 4, 2019Applicant: Intel CorporationInventors: Ranjul Balakrishnan, Navneet K. Singh, Bijendra Singh
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Patent number: 10341259Abstract: A network device can utilize multiple priority arbiters to support different programmable priorities for different virtual routing and forwarding (VRF) subsystems. Each priority arbiter can be logically connected to all the VRF subsystems in the network device. Each priority arbiter can support a set of features corresponding to functional requirements of a VRF subsystem. A particular priority arbiter can be selected from the multiple priority arbiters based on an association of the VRF subsystem to that priority arbiter.Type: GrantFiled: May 31, 2016Date of Patent: July 2, 2019Assignee: Amazon Technologies, Inc.Inventor: Bijendra Singh
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Patent number: 10333853Abstract: A system can provide a unified quality-of-service for multi-path label switching (MPLS) traffic. A single network device can be configured as an ingress label switch router, an egress label switch router or a label switching router for different label switching paths. The network device can support uniform deployment model, pipe deployment model or short-pipe deployment model in any configuration. A configurable scheduler priority map can be selected from multiple scheduler priority maps to generate a scheduler priority class which can be used to assign priority and resources for the packet.Type: GrantFiled: March 30, 2016Date of Patent: June 25, 2019Assignee: Amazon Technologies, Inc.Inventors: Kiran Kalkunte Seshadri, Bijendra Singh, Thomas A. Volpe, Kari Ann O'Brien
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Patent number: 10326830Abstract: Techniques are disclosed herein regarding interfaces and multipath groups each associated with some of the interfaces to a datacenter. The techniques can include forwarding a network packet to be processed by a service, the service offered on each datacenter such that the network packet can be processed interchangeably at each datacenter. The techniques can also include, selecting one of the multipath groups for outputting of the network packet to the datacenter corresponding to the selected multipath group for processing by the service, the selecting based upon a cost to process the network packet at a respective one of the datacenters corresponding to each of the multipath groups. The techniques can further include, upon determining that the selected multipath group corresponds to a datacenter with an intervening second domain between the device and the corresponding datacenter, encapsulating the network packet for tunneling the network packet through the second domain.Type: GrantFiled: September 2, 2016Date of Patent: June 18, 2019Assignee: Amazon Technologies, Inc.Inventor: Bijendra Singh
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Publication number: 20190179377Abstract: A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.Type: ApplicationFiled: February 13, 2019Publication date: June 13, 2019Inventors: Bijendra Singh, Prakash Kurma Raju, Prasanna Pichumani, Kathiravan D
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Publication number: 20190149472Abstract: Packet processors or other devices with packet processing pipelines may implement pipelined evaluations of algorithmic forwarding route lookups. As network packets are received, a destination address for the network packets may be divided into different possible prefix lengths and corresponding entries in a routing table for the different possible prefix lengths may be determined according to a hash scheme for the routing table. The entry values may be read from the routing table and evaluated at subsequent stages to identify the entry with a longest prefix match with respect to the destination address for the network packet. The routing table may include entries for different types of network packets and may be configured to include virtual routing and forwarding for network packets.Type: ApplicationFiled: November 16, 2018Publication date: May 16, 2019Applicant: Amazon Technologies, Inc.Inventors: Bijendra Singh, Thomas A. Volpe, Kari Ann O'Brien
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Patent number: 10257080Abstract: Techniques are provided for allocating hardware resources for an equal-cost multi-path (ECMP) group based on information about the network architecture. A table in memory may include a plurality of entries. Each entry may include interface set and a number of interfaces. Each interface set may represent a list of interfaces for the network device for a given network connection. The network device may receive a list of interfaces for allocating resource for an EMCP group. The network device may select an entry from the table by identifying an interface set that includes all of the interfaces for the ECMP group. The network device may determine a size of the ECMP group using a number of interfaces for the identified interface set from the entry from the table and allocate hardware resources (e.g., memory) for the ECMP group based on the determined size of the ECMP group.Type: GrantFiled: May 31, 2016Date of Patent: April 9, 2019Assignee: Amazon Technologies, Inc.Inventors: Sravya Kusam, Bijendra Singh
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Publication number: 20190041922Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.Type: ApplicationFiled: August 1, 2018Publication date: February 7, 2019Applicant: Intel CorporationInventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Doddi Raghavendra, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
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Publication number: 20190045665Abstract: Particular embodiments described herein provide for a thermal cooling system that is part of a device that includes a hole-in-motherboard configuration. The device can include a substrate, one or more dies on a top portion of the substrate, one or more printed circuit boards below the substrate, where the printed circuit boards are coupled to the substrate with solder balls, and one or more land side capacitors below the substrate. A thermal conducting plate, phase change material, and one or more sponge walls to help insulate the solder balls from the thermal conductive layer can be located in the hole of the hole-in-motherboard configuration and help transfer heat and thermal energy away from the device.Type: ApplicationFiled: September 28, 2018Publication date: February 7, 2019Applicant: Intel CorporationInventors: Bijendra Singh, Sachin Bedare
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Patent number: 10200312Abstract: Power management of a routing table is provided by supporting various power domain configurations. Each power domain configuration can be associated with a different number of power domains than other power domain configurations. Efficient power management can be achieved by switching between a lower power domain configuration and a higher power domain configuration during run-time based on the dynamic load conditions.Type: GrantFiled: May 6, 2016Date of Patent: February 5, 2019Assignee: Amazon Technologies, Inc.Inventors: Bijendra Singh, Kari Ann O'Brien