Abstract: Methods and associated apparatus of reducing stress in a package are described in which a package is provided comprising an array of interconnects that are connected to a substrate, and then reducing the stress of the interconnects located near a weak area in the package, during flexure of the substrate, by spring loading the weak area of the package.

Abstract: A ball grid array device includes a substrate and a die attached to the substrate. The substrate further includes a first major surface and a second major surface. A first ball, having an attached end and a distal tip end, is attached to a major surface of the substrate. The first ball has a first height. A second ball, having an attached end and a distal tip end, is also attached to the major surface. The second ball has a second height different from the first height. The first height and the second height are selected to produce a substantially co-planar surface at the distal tip ends of the first ball and the second ball. The major surface is not substantially co-planar. A method for forming the balls of a ball grid array device on a major of a substrate includes determining height differences across the major surface of the substrate, placing lands on the substrate, and forming a plurality of balls on the lands. Each of the balls has an attached portion and a tip portion.