Patents by Inventor Bill Agar, Jr.

Bill Agar, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RF device package with integrated hybrid coupler
    Patent number: 9628032
    Abstract: An RF device package includes an RF input terminal, first and second amplifier input nodes, and a hybrid coupler integrally formed as part of the RF device package and connected between the RF input terminal and the first and second amplifier input nodes. The hybrid coupler includes a first LC network directly electrically connected to the RF input terminal and physically disconnected from the first and second amplifier input nodes, a second LC network directly electrically connected to the first amplifier input node and physically disconnected from the RF input terminal and the second amplifier input node, and a third LC network directly electrically connected to the second amplifier input node and physically disconnected from the RF input terminal and the first amplifier input node. The second and third LC networks are each inductively coupled to the first LC network in a transformer configuration.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: April 18, 2017
    Assignee: Infineon Technologies AG
    Inventors: Marvin Marbell, Bill Agar, Jr.