Patents by Inventor Bill Ahearn

Bill Ahearn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip module having interconnect dies
    Publication number: 20020176238
    Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.
    Type: Application
    Filed: July 15, 2002
    Publication date: November 28, 2002
    Applicant: The Panda Project, Inc.
    Inventors: Stanford W. Crane, Lakshminarasimha Krishnapura, Yun Li, Moises Behar, Dan Fuoco, Bill Ahearn
  • Multi-chip module having interconnect dies
    Patent number: 6421254
    Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.
    Type: Grant
    Filed: July 13, 2001
    Date of Patent: July 16, 2002
    Assignee: Silicon Bandwidth Inc.
    Inventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Yun Li, Moises Behar, Dan Fuoco, Bill Ahearn
  • Multi-chip module having interconnect dies
    Publication number: 20010040792
    Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.
    Type: Application
    Filed: July 13, 2001
    Publication date: November 15, 2001
    Applicant: The Panda Project
    Inventors: Stanford W. Crane, Lakshminarasimha Krishnapura, Yun Li, Moises Behar, Dan Fuoco, Bill Ahearn
  • Multi-chip module having interconnect dies
    Patent number: 6266246
    Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: July 24, 2001
    Assignee: Silicon Bandwidth, Inc.
    Inventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Yun Li, Moises Behar, Dan Fuoco, Bill Ahearn
  • Cooling system for semiconductor die carrier
    Patent number: 6031720
    Abstract: A cooling system for a semiconductor die carrier is disclosed that includes a cooling fan disposed at a substantial distance from a semiconductor die carrier, a cooling duct including an inlet portion and an outlet portion, and a heat exchanger disposed on an upper surface of the semiconductor die carrier. The cooling duct inlet portion is attached to the cooling fan and the cooling duct outlet portion is disposed in close proximity to the heat exchanger. The cooling fan draws ambient air into the cooling duct and the ambient air exits the cooling duct outlet portion and passes in a heat exchange relationship with the heat exchanger.
    Type: Grant
    Filed: November 14, 1997
    Date of Patent: February 29, 2000
    Assignee: The Panda Project
    Inventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Moises Behar, Arindum Dutta, Kevin J. Link, Bill Ahearn
  • Multi-chip module having interconnect dies
    Patent number: 6016256
    Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.
    Type: Grant
    Filed: November 14, 1997
    Date of Patent: January 18, 2000
    Assignee: The Panda Project
    Inventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Yun Li, Moises Behar, Dan Fuoco, Bill Ahearn