Patents by Inventor Bill Chang

Bill Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200044578
    Abstract: A multi-level power converter and a method using first, second, third and fourth switching elements, an inductor, and a flying capacitor are presented. A first terminal of the inductor may be connected to a switching terminal connecting the second and third switching elements. A first terminal of the flying capacitor may be connected to a terminal connecting the first and second elements. A second terminal of the flying capacitor may be connected to a terminal connecting the third and fourth switching elements. The multi-level power converter may have a first feedback circuit to generate control signals for setting the switching elements in a plurality of switching states for regulating an output voltage or an output current. The converter may have a second feedback circuit to generate control signals to allow the flying capacitor to be charged or discharged using an inductor current flowing through the inductor.
    Type: Application
    Filed: July 31, 2018
    Publication date: February 6, 2020
    Inventors: Aravind Mangudi, Mark Mercer, James Steele, Taek Chang, Bill McKillop
  • Patent number: 10545655
    Abstract: A context-sensitive viewing system is disclosed in which various data visualizations, also referred to a contextual views, of a common set of data may be viewed by a user on an electronic device. Data in the system may comprise data objects and associated properties and/or metadata, and may be stored in one or more electronic data stores. As a user of the system views and manipulates a first contextual view of a set of data objects, one or more other contextual views of the same set of data objects may be updated accordingly. Updates to the secondary contextual views may, in various embodiments, happen real-time. Further, the secondary contextual views may be visible to the user simultaneously with the primary contextual view. A user may switch from one view to another, and may manipulate data in any view, resulting in updates in the other views.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: January 28, 2020
    Assignee: Palantir Technologies Inc.
    Inventors: Joshua Goldenberg, Brian Ngo, Bill Dwyer, Parvathy Menon, Gregory Martin, Zach Bush, Allen Chang, Mike Boland
  • Publication number: 20180352352
    Abstract: A hearing system includes a hearing device, the hearing device comprising: an input module for providing a first input signal, the input module comprising a first microphone; a processor for processing the first input signal and providing a processor output signal based on the first input signal; and a receiver for providing an audio output signal based on the processor output signal; wherein the hearing system is configured to obtain a user input indicative of a change from a first primary setting to a first secondary setting of the hearing device, and wherein the hearing device, upon a detection of the change from the first primary setting to the first secondary setting, is configured to output a secondary audio output signal according to the first secondary setting.
    Type: Application
    Filed: June 6, 2017
    Publication date: December 6, 2018
    Applicant: GN Hearing A/S
    Inventors: Qi YANG, Greg OLSEN, Shira HAHN, Bill CHANG
  • Patent number: 7154155
    Abstract: A surface mounted LED package includes a pair of metal contact plates, an LED mounted to one (or both) metal contact plates, and glue encapsulating the LED and holding the LED and both metal contact plates together to form a LED package to be soldered to a motherboard. The contact plates have side notches and bottom recesses of various shapes and dimensions, as well as through holes extending through the entire width of the contact plates to facilitate the glue flow for filling out the side notches and bottom recesses for improved solidifying of the LED package. The contact plates have portions uncovered by the glue to provide extended areas for soldering to a motherboard.
    Type: Grant
    Filed: November 22, 2002
    Date of Patent: December 26, 2006
    Assignee: Harvatek Corp.
    Inventors: Bily Wang, Bill Chang
  • Publication number: 20050135071
    Abstract: The present invention provides a package structure of optical sensitive device. The package structure includes a silicon substrate, an optical sensitive device, a supporting pad, a transparent plate and a plurality of conductive wires. The optical sensitive device is positioned on the silicon substrate, and the transparent plate is fixedly positioned on the supporting pad and corresponds to the optical sensitive area of the optical sensitive device. The transparent plate can be positioned on the substrate, and the electrical wires are electrically connected between the optical sensitive device and the substrate.
    Type: Application
    Filed: December 18, 2003
    Publication date: June 23, 2005
    Inventors: Billy Wang, Bill Chang, Yu-Jen Huang, Chao-Yen Hsieh
  • Publication number: 20050133888
    Abstract: A package substrate having a chip on a substrate has a die pad on the substrate. The chip is attached on the die pad via ah adhesive. A plurality of gold contacts is distributed on the die pad for electrically connecting to the chip. A plurality of traces is distributed around the die pad to connect to the chip via wires. An adhesive dike is formed between the die pad and the traces to prevent the adhesive from flowing out of the die pad when the chip is attached on the die pad.
    Type: Application
    Filed: December 18, 2003
    Publication date: June 23, 2005
    Inventors: Bily Wang, Bill Chang, Yu-Jen Huang, Chao-Yen Hsieh
  • Patent number: 6794686
    Abstract: A colorless light approaching that of white light in nature, is produced by using no more than two color LEDs covered with one or more layers of complementary color phosphorescent glue on an insulating substrate.
    Type: Grant
    Filed: June 19, 2003
    Date of Patent: September 21, 2004
    Assignee: Harvatek Corporation
    Inventors: Bill Chang, Bily Wang
  • Publication number: 20030227023
    Abstract: A colorless light approaching that of white light in nature, is produced by using no more than two color LEDs covered with one or more layers of complementary color phosphorescent glue on an insulating substrate.
    Type: Application
    Filed: June 19, 2003
    Publication date: December 11, 2003
    Inventors: Bill Chang, Bily Wang
  • Publication number: 20030227022
    Abstract: A colorless light approaching that of white light in nature, is produced by using no more than two color LEDs covered with one or more layers of complementary color phosphorescent glue.
    Type: Application
    Filed: June 6, 2002
    Publication date: December 11, 2003
    Inventors: Chin-Mau James Hwang, Bill Chang, Bily Wang
  • Patent number: 6627482
    Abstract: Surface mount diodes are mass produced by first cutting a metal plate to form a plurality of vertical slits within metal plate. Parallel lines are cut midway between the slits to form wings for the slits. The wings are folded to form the bottoms for surface mounting. Glue is applied over the metal plate to form focusing cups.
    Type: Grant
    Filed: February 9, 2001
    Date of Patent: September 30, 2003
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Bill Chang
  • Publication number: 20030178691
    Abstract: The bottom metal contacts of a surface mount LED are extended wider than the glue covering the LED. The extensions provide more area for soldering to a motherboard.
    Type: Application
    Filed: November 22, 2002
    Publication date: September 25, 2003
    Inventors: Bily Wang, Bill Chang
  • Publication number: 20030133300
    Abstract: The focusing cup of a LED package is coated exteriorly with or made of opaque material to reduce the spurious external light interference due to the reflections of the surfaces of focusing cup.
    Type: Application
    Filed: January 11, 2002
    Publication date: July 17, 2003
    Inventors: Bily Wang, Bill Chang, Chin-Mau James Hwang
  • Patent number: 6583447
    Abstract: A surface-mount package for multiple LED chips is constructed by inscribing a groove in an insulating substrate. The LED chips are mounted in the groove and the leads are connected to metal plates, which wrap around the substrate to provide bottom contacts for surface-mounting.
    Type: Grant
    Filed: August 27, 2001
    Date of Patent: June 24, 2003
    Assignee: Harvatek Corp.
    Inventors: Bily Wang, Bill Chang, Yann Lee
  • Patent number: 6569698
    Abstract: A focusing cup is directly glued to two or more preformed folded metal frames. Parts of the top surfaces of the folded metal frames contact the electrodes of semiconductor device placed inside the focusing cup. The bottoms of the metallic frames serve as the bottom contacts for surface mounting to a motherboard. The preformed metallic frames need not withstand the stress of folding and the package can be made thinner than prior art. The elimination of the through holes makes the package narrower. The bottoms of the metallic frames can be aligned one side of the bottom surface of the package, so that the package can be surface-mounted normally to or in parallel with a motherboard with light emitting respectively in parallel with or normally to the surface of the motherboard.
    Type: Grant
    Filed: August 3, 2001
    Date of Patent: May 27, 2003
    Assignee: Harvatek Corp.
    Inventors: Bily Wang, Bill Chang, Chin-Mau James Hwang
  • Patent number: 6559512
    Abstract: The leads of a light emitting device package are extended is flexible pins. These pins can be bent with respect to a motherboard so that the direction of the light entitled from the light emitting device can be adjusted. The package is tab-mounted to the motherboard for heat sinking or serving as a lead.
    Type: Grant
    Filed: August 2, 2001
    Date of Patent: May 6, 2003
    Assignee: Harvatek Corp.
    Inventors: Bily Wangn, Bill Chang, Chin-Mau James Hwang
  • Publication number: 20030075724
    Abstract: The bottom metal contacts of a surface mount LED are extended wider than the glue covering the LED. The extensions provide more area for soldering to a motherboard.
    Type: Application
    Filed: October 19, 2001
    Publication date: April 24, 2003
    Inventors: Bily Wang, Bill Chang
  • Patent number: 6534799
    Abstract: In a surface mount LED chips mounted on an insulating substrate, plated through conduits to interconnect the chips on both sides are placed at the corners of the outer terminals at two horizontal ends. The depressions caused by wire-bonding the chip to the terminals are lined up vertically with the corner conduits to reduce horizontal dimension.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: March 18, 2003
    Assignee: Harvatek Corp.
    Inventors: Bily Wang, Bill Chang
  • Publication number: 20030038292
    Abstract: A surface-mount package for multiple LED chips is constructed by inscribing a groove in an insulating substrate. The LED chips are mounted in the groove and the leads are connected to metal plates, which wrap around the substrate to provide bottom contacts for surface-mounting.
    Type: Application
    Filed: August 27, 2001
    Publication date: February 27, 2003
    Inventors: Billy Wang, Bill Chang, Yann Lee
  • Publication number: 20030032212
    Abstract: An optoelectronic device is placed in a through hole of an upper substrate and mounted on a lower substrate, which is stacked under the upper substrate. The through hole forms a focusing cup for the optoelectronic device. A metallic base plate can be inserted between the optoelectronic device and the lower substrate to enhance light reflection and heat removal. The through hole can be lined with metallic coating to enhance light reflection.
    Type: Application
    Filed: August 7, 2001
    Publication date: February 13, 2003
    Inventors: Bily Wang, Bill Chang, Yann Lee
  • Publication number: 20030025169
    Abstract: The leads of a light emitting device package are extended as flexible pins. These pins can be bent with respect to a motherboard so that the direction of the light emitted from the light emitting device can be adjusted. The package is tab-mounted to the motherboard for heat sinking or serving as a lead.
    Type: Application
    Filed: August 2, 2001
    Publication date: February 6, 2003
    Inventors: Bily Wang, Bill Chang, Chin-Mau James Hwang