Abstract: An LED lamp module includes a heat sink element having one-piece form; a circuit substrate affixed onto the heat sink element, wherein the substrate has at least an opening exposing the heat sink element, and has an area smaller than that of the heat sink element; a plurality of LED chips mounted on the exposed portion of the heat sink element and electrically connected to the circuit substrate; and a light transparent package material, encapsulating the plurality of LED chips, wherein the heat sink element includes a uniform temperature plate or a plate including at least a vacuum cavity, and an extension part extending laterally from the plate and turned to surround the plurality of LED chips, forming a secondary optical structure. A fabrication method for the LED lamp module is also disclosed. Existing fabrication process is simplified and the cost is lowered with increased heat dissipation effect.

Abstract: A manufacture method of light emitting diode (LED) module includes: providing a carrier board including a carrying area and a shaping area; arranging at least one substrate having at least one circuit layer in the carrying area of the carrier board; arranging at least one LED in the carrying area of the carrier board; electrically connecting the LED to the circuit layer of the substrate; encapsulating the LED and at least part of the circuit layer by at least one light transmissive encapsulation element; and fabricating the shaping area of the carrier board into a desired appearance. The above-mentioned carrier board not only can be a heat sink but also can be easily fabricated into various types of design shapes. Therefore, a light emitting diode module manufactured by the above-mentioned method has preferred heat dissipation effects and a better appearance with relatively low production costs.

Abstract: An LED lamp module is disclosed. An LED die is directly mounted on a heat sink element and then the LED chip is electrically connected to a circuit substrate or a circuit layer disposed over the heat sink element, wherein the size of the heat sink element is larger than the circuit layer or the substrate thereon, thereby providing the LED lamp module excellent heat dissipation. The structure of the LED lamp of the present invention simplifies the existing fabrication process, lowers the cost, and also increases the heat dissipation effect.

Abstract: A chip package structure and its fabrication method are disclosed. Method of electrically connecting a chip with plural different metal layers is utilized to replace the conventional method of connecting identical metal layer merely. Besides, the method of a protective layer directly set on the metal layer to cover the chip and the conductive connecting structure is different from the general method of coating the solder mask on the metal layer. Moreover, a carrier utilized for support makes lighter and thinner substrate be fabricated. The fabrication method is utilized to manufacture by using the fabrication process of present package manufacturing. No additional equipments and fabrication processes are needed so that the PCB production flow may be simplified to reduce the package cost.