Patents by Inventor Bill Cornelius

Bill Cornelius has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Depopulation of a ball grid array to allow via placement
    Patent number: 7279356
    Abstract: The present invention provides an apparatus and methods for the functionality of an integrated circuit. An exemplary embodiment according to an aspect of the present invention includes a ball grid array having open spaces therein. Within the open spaces, pairs of opposite polarity vias are clustered to minimize current path inductance by exploiting mutual inductance between vias of opposite current flow. In an illustrative embodiment, capacitors are coupled to the vias to further reduce current path inductance.
    Type: Grant
    Filed: September 18, 2006
    Date of Patent: October 9, 2007
    Assignee: Apple Inc.
    Inventors: Bill Cornelius, Paul Baker
  • Depopulation of a ball grid array to allow via placement
    Patent number: 7112880
    Abstract: The present invention provides an apparatus and methods for the functionality of an integrated circuit. An exemplary embodiment according to an aspect of the present invention includes a ball grid array having open spaces therein. Within the open spaces, pairs of opposite polarity vias are clustered to minimize current path inductance by exploiting mutual inductance between vias of opposite current flow. In an illustrative embodiment, capacitors are coupled to the vias to further reduce current path inductance.
    Type: Grant
    Filed: November 17, 2004
    Date of Patent: September 26, 2006
    Assignee: Apple Computer, Inc.
    Inventors: Bill Cornelius, Paul Baker
  • Method for depopulating of a ball grid array to allow via placement
    Patent number: 6834427
    Abstract: The present invention provides an apparatus and methods for the functionality of an integrated circuit. An exemplary embodiment according to an aspect of the present invention includes a ball grid array having open spaces therein. Within the open spaces, pairs of opposite polarity vias are clustered to minimize current path inductance by exploiting mutual inductance between vias of opposite current flow. In an illustrative embodiment, capacitors are coupled to the vias to further reduce current path inductance.
    Type: Grant
    Filed: May 6, 2002
    Date of Patent: December 28, 2004
    Assignee: Apple Computer, Inc.
    Inventors: Bill Cornelius, Paul Baker