Patents by Inventor Bill Gervasi

Bill Gervasi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vertically stackable integrated circuit
    Patent number: 6093029
    Abstract: An arrangement for coupling a first packaged integrated circuit to a second packaged integrated circuit comprises a first packaged integrated circuit that includes a first set of electrical interconnection elements arranged on a first surface and a second set of electrical interconnection elements arranged on a second surface which is opposite to the first side. A thermally conductive material is disposed on the second surface and the second set of electrical interconnection elements are arranged around at least a portion of the periphery of the second surface. A second packaged integrated circuit includes a third set of electrical interconnection elements arranged on a first surface of the second packaged integrated circuit. The third set of electrical interconnection elements are shaped to mechanically and electrically couple and decouple to or from the second set of electrical interconnection elements non-destructively by application of manual force.
    Type: Grant
    Filed: September 8, 1998
    Date of Patent: July 25, 2000
    Assignee: S3 Incorporated
    Inventors: Young Kwon, Jon Ewanich, Bill Gervasi, Paul Franklin