Abstract: A package for an optoelectronic device having an optical fiber in communication therewith. The parts of the package are generally of polymer material, preferably engineering thermoplastic, which is assembled to the fiber having the device mounted on a printed circuit board type material, FR4. The adhesion process of the individual parts of the package is done typically through a solvent bonding or an epoxy curing process that is done at room temperature, thereby eliminating the drawbacks of soldering at high temperature which has the attendant disadvantage of built in stress and thermal expansion resulting in misalignment of the individual parts. The related packaging technique greatly reduces the requirements of active alignment of the fiber to the device in the packaging of the device and fiber. Accordingly, the overall cost of the device is reduced by virtue of the reduced cost of the parts of the package as well as the process for fabrication of the package.

Abstract: Improved connectors for optically coupling a fiber optic transmission line and an opto-electronic device electrically interfaced to a substrate. The improved connectors include the opto-electronic device being mounted on the substrate, such as a printed circuit board, and means for mounting the fiber optic transmission line to the substrate such that the operative axis of the opto-electronic device is substantially not coincidental with the light transmission axis of the fiber optic transmission line. The connectors also require light bending means in operative optical association with said opto-electronic device for directing along the light transmission axis of the fiber optic transmission line at least a portion of the light emitted from said opto-electronic device or for directing along the operative axis of said opto-electronic device at least a portion of the light emitted from said fiber optic transmission line.