Patents by Inventor Bill Hoover

Bill Hoover has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230358586
    Abstract: Example systems, apparatuses, and methods are disclosed sensing a flow of fluid using a thermopile-based flow sensing device. An example apparatus includes a flow sensing device comprising a heating structure having a centerline. The flow sensing device may further comprise a thermopile. At least a portion of the thermopile may be disposed over the heating structure. The thermopile may comprise a first thermocouple having a first thermocouple junction disposed upstream of the centerline of the heating structure. The thermopile may further comprise a second thermocouple having a second thermocouple junction disposed downstream of the centerline of the heating structure.
    Type: Application
    Filed: July 14, 2023
    Publication date: November 9, 2023
    Inventors: Robert Higashi, Scott Edward Beck, Yong-Fa Wang, Ian Bentley, Bill Hoover
  • Patent number: 11747184
    Abstract: Example systems, apparatuses, and methods are disclosed sensing a flow of fluid using a thermopile-based flow sensing device. An example apparatus includes a flow sensing device comprising a heating structure having a centerline. The flow sensing device may further comprise a thermopile. At least a portion of the thermopile may be disposed over the heating structure. The thermopile may comprise a first thermocouple having a first thermocouple junction disposed upstream of the centerline of the heating structure. The thermopile may further comprise a second thermocouple having a second thermocouple junction disposed downstream of the centerline of the heating structure.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: September 5, 2023
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Robert Higashi, Scott Edward Beck, Yong-Fa Wang, Ian Bentley, Bill Hoover
  • Publication number: 20200370938
    Abstract: Example systems, apparatuses, and methods are disclosed sensing a flow of fluid using a thermopile-based flow sensing device. An example apparatus includes a flow sensing device comprising a heating structure having a centerline. The flow sensing device may further comprise a thermopile. At least a portion of the thermopile may be disposed over the heating structure. The thermopile may comprise a first thermocouple having a first thermocouple junction disposed upstream of the centerline of the heating structure. The thermopile may further comprise a second thermocouple having a second thermocouple junction disposed downstream of the centerline of the heating structure.
    Type: Application
    Filed: August 13, 2020
    Publication date: November 26, 2020
    Inventors: Robert Higashi, Scott Edward Beck, Yong-Fa Wang, Ian Bentley, Bill Hoover
  • Patent number: 10775217
    Abstract: Example systems, apparatuses, and methods are disclosed sensing a flow of fluid using a thermopile-based flow sensing device. An example apparatus includes a flow sensing device comprising a heating structure having a centerline. The flow sensing device may further comprise a thermopile. At least a portion of the thermopile may be disposed over the heating structure. The thermopile may comprise a first thermocouple having a first thermocouple junction disposed upstream of the centerline of the heating structure. The thermopile may further comprise a second thermocouple having a second thermocouple junction disposed downstream of the centerline of the heating structure.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: September 15, 2020
    Assignee: Honeywell International Inc.
    Inventors: Robert Higashi, Scott Edward Beck, Yong-Fa Wang, Ian Bentley, Bill Hoover
  • Publication number: 20120290268
    Abstract: A modular sensor assembly in which a sensing module may be packaged and provided separately from a signal processing module and which, in some applications, may facilitate disposal and/or replacement of the sensing module when exposed to a “dirty” or “contaminated” environment without requiring disposal and/or replacement of the entire sensor assembly. In certain applications, the sensing module may include at least one transducer or sensor and a local memory containing a set of conditioning coefficients. The sensing module may be removably coupled to a signal processing module which, in some cases, may be configured to download the set of conditioning coefficients stored in the local memory of the sensing module, and to use the set of conditioning coefficients to produce a substantially linearized output signal.
    Type: Application
    Filed: May 9, 2011
    Publication date: November 15, 2012
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Paul Prehn Bey, Bill Hoover, Jamie Speldrich, Ryan Jones