Patents by Inventor Bill Marquart

Bill Marquart has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for providing a soldered interface on a printed circuit board having a blind feature
    Patent number: 11387617
    Abstract: Systems and methods for providing a soldered interface between a circuit board and a connector pin. The methods comprise: using a jet paste dispenser to apply first solder into a plated contact cavity formed in the circuit board; using a stencil screen printer to apply second solder (a) over the plated contact cavity which was at least partially filled with the first solder by the jet paste dispenser and (b) over at least a portion of a pad surrounding the plated contact cavity; inserting the connector pin in the plated contact cavity such that the connector pin passes through the second solder and extends at least partially through the first solder; and performing a reflow process to heat the first and second solder so as to create a solder joint between the circuit board and the connector pin.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: July 12, 2022
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Michael T. DeRoy, Andres M. Gonzalez, Phill Nickel, Scott Nelson, Bill Marquart
  • SYSTEMS AND METHODS FOR PROVIDING A SOLDERED INTERFACE ON A PRINTED CIRCUIT BOARD HAVING A BLIND FEATURE
    Publication number: 20210265795
    Abstract: Systems and methods for providing a soldered interface between a circuit board and a connector pin. The methods comprise: using a jet paste dispenser to apply first solder into a plated contact cavity formed in the circuit board; using a stencil screen printer to apply second solder (a) over the plated contact cavity which was at least partially filled with the first solder by the jet paste dispenser and (b) over at least a portion of a pad surrounding the plated contact cavity; inserting the connector pin in the plated contact cavity such that the connector pin passes through the second solder and extends at least partially through the first solder; and performing a reflow process to heat the first and second solder so as to create a solder joint between the circuit board and the connector pin.
    Type: Application
    Filed: May 13, 2021
    Publication date: August 26, 2021
    Inventors: Michael T. DeRoy, Andres M. Gonzalez, Phill Nickel, Scott Nelson, Bill Marquart
  • Systems and methods for providing a soldered interface on a printed circuit board having a blind feature
    Patent number: 11056850
    Abstract: Systems and methods for providing a soldered interface between a circuit board and a connector pin. The methods comprise: using a jet paste dispenser to apply first solder into a plated contact cavity formed in the circuit board; using a stencil screen printer to apply second solder (a) over the plated contact cavity which was at least partially filled with the first solder by the jet paste dispenser and (b) over at least a portion of a pad surrounding the plated contact cavity; inserting the connector pin in the plated contact cavity such that the connector pin passes through the second solder and extends at least partially through the first solder; and performing a reflow process to heat the first and second solder so as to create a solder joint between the circuit board and the connector pin.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: July 6, 2021
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Michael T. De Roy, Andres M. Gonzalez, Phill Nickel, Scott Nelson, Bill Marquart
  • SYSTEMS AND METHODS FOR PROVIDING A SOLDERED INTERFACE ON A PRINTED CIRCUIT BOARD HAVING A BLIND FEATURE
    Publication number: 20210028588
    Abstract: Systems and methods for providing a soldered interface between a circuit board and a connector pin. The methods comprise: using a jet paste dispenser to apply first solder into a plated contact cavity formed in the circuit board; using a stencil screen printer to apply second solder (a) over the plated contact cavity which was at least partially filled with the first solder by the jet paste dispenser and (b) over at least a portion of a pad surrounding the plated contact cavity; inserting the connector pin in the plated contact cavity such that the connector pin passes through the second solder and extends at least partially through the first solder; and performing a reflow process to heat the first and second solder so as to create a solder joint between the circuit board and the connector pin.
    Type: Application
    Filed: July 26, 2019
    Publication date: January 28, 2021
    Inventors: Michael T. De Roy, Andres M. Gonzalez, Phill Nickel, Scott Nelson, Bill Marquart