Abstract: In one embodiment, the present invention includes a method communicating control information for an external adaptive equalization process for a channel coupled between a transmitter and a receiver from an external agent. In this way, the external agent may control tap settings of an equalizer based on feedback information from the receiver responsive to a data pattern generated and transmitted by the transmitter. Other embodiments are described and claimed.

Abstract: In one embodiment, the present invention includes a method communicating control information for an external adaptive equalization process for a channel coupled between a transmitter and a receiver from an external agent. In this way, the external agent may control tap settings of an equalizer based on feedback information from the receiver responsive to a data pattern generated and transmitted by the transmitter. Other embodiments are described and claimed.

Abstract: An integrated circuit cartridge has been described. The cartridge includes a heat pipe lid that comes in thermal contact with at least one integrated circuit die. The integrated circuit die is mounted on a substrate that is held in a cavity of a pin chassis that has a grid array of pins for interconnection with a socket. The integrated circuit die can be mounted on a secondary substrate that is mounted to a primary substrate. The substrate has an edge connector to supply power to the integrated circuit die, freeing the grid array of pins to be used for signal interconnects. The substrate has a grid of connections soldered to the grid array of pins on the pin chassis. The pin chassis also supplies key structures that aid in alignment of the pins and a socket.

Abstract: An improved connector scheme for a power pod power delivery system provides a low-resistance, low inductance path between a power source and a power consuming module. Specifically, the present invention is a connector scheme comprising a printed circuit board having a plurality of sets of planar pads, each of the plurality of sets of planar pads being coupled to a power source and/or a signal source, and a flexible connection for detachably coupling with each of the plurality of sets of planar pads on the printed circuit board.