Patents by Inventor Bill Yuan Chung Chuang

Bill Yuan Chung Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer securing device and method
    Patent number: 6051067
    Abstract: A wafer securing device and method for securing a planar plate on a wafer having a hollowed-out portion, the device including a substrate for receiving the wafer; a groove provided on the substrate and having an opening, the hollowed-out portion corresponding to the groove when the wafer is placed on the substrate; and an air extracting equipment for extracting air from the groove when the wafer is placed on the substrate so that the planar plate placed on the wafer is secured to the wafer by means of a vacuum suction force.
    Type: Grant
    Filed: April 23, 1998
    Date of Patent: April 18, 2000
    Assignee: Microjet Technology Co., Ltd.
    Inventors: Michael Mou, Bill Yuan Chung Chuang, Arnold Chang Mou Yang, Jing Yuang Ho