Patents by Inventor Bill Z. Dellinger

Bill Z. Dellinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid epoxy resin formulations
    Patent number: 9745409
    Abstract: A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %.
    Type: Grant
    Filed: November 1, 2011
    Date of Patent: August 29, 2017
    Assignee: BLUE CUBE IP LLC
    Inventors: Rajesh H. Turakhia, Cui-ping Chen, Bill Z. Dellinger, Ludovic Valette, Itaru Kudose, Ha Q. Pham
  • Low emission epoxy curing agents
    Patent number: 9469721
    Abstract: A hardener composition comprising: a) an amine component; and b) a glycol ether component comprising i) from 10 weight percent to 70 weight percent alkylene glycol phenyl ether; ii) from 25 weight percent to 80 weight percent dialkylene glycol phenyl ether; iii) from 5 weight percent to 20 weight percent trialkylene glycol phenyl ether, is disclosed. The hardener composition can be used in epoxy thermoset formulations.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: October 18, 2016
    Assignee: BLUE CUBE IP LLC
    Inventors: Rajesh H. Turakhia, Larissa Falsarella, Eva-Maria Michalski, Marcus Pfarherr, Carl J. Marshall, Jr., Bill Z. Dellinger, Felipe A. Donate
  • LOW EMISSION EPOXY CURING AGENTS
    Publication number: 20150315378
    Abstract: A hardener composition comprising: a) an amine component; and b) a glycol ether component comprising i) from 10 weight percent to 70 weight percent alkylene glycol phenyl ether; ii) from 25 weight percent to 80 weight percent dialkylene glycol phenyl ether; iii) from 5 weight percent to 20 weight percent trialkylene glycol phenyl ether, is disclosed. The hardener composition can be used in epoxy thermoset formulations.
    Type: Application
    Filed: December 11, 2013
    Publication date: November 5, 2015
    Inventors: Rajesh H. Turakhia, Larissa Falsarella, Eva-Maria Michalski, Marcus Pfarherr, Carl J. Marshall, JR., Bill Z. Dellinger, Felipe A. Donate
  • LIQUID EPOXY RESIN FORMULATIONS
    Publication number: 20140256856
    Abstract: A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %.
    Type: Application
    Filed: November 1, 2011
    Publication date: September 11, 2014
    Applicant: Dow Global Technologies LLC
    Inventors: Rajesh H. Turakhia, Cui-ping Chen, Bill Z. Dellinger, Ludovic Valette, Itaru Kudose, Ha Q. Pham