Abstract: A monolithic capacitor chip having improved conductive terminations. The capacitor comprises a conventional body formed of stacked, alternately arranged layers of dielectric material and metallic electrode material, alternate electrodes extending to opposite endfaces of the body, and a noncompliant metalized layer on each of the opposite endfaces electrically contacting the electrodes extending thereto. In accordance with this invention each of the noncompliant metalized layers is provided with a compliant coating of an alloy preferably comprising more than 90% lead. A metallic layer is disposed over the surface of each of the compliant coatings, the melting point of the metallic layers being greater than that of the compliant coating. The metallic layer preferably consists of a layer of copper or nickel plating, the surface of which is plated with an oxidation resistant metal such as tin, gold, or the like.