Abstract: A support substrate or chuck 20 supports wafer die 11 during and after dicing of a wafer 10. The support substrate comprises an array of islands 21, upper faces of which are raised above a major face of the support substrate for alignment with an array of dies on, or singulated from, the wafer. Spacing between the islands is not less than a kerf of a laser, or a width of a blade, used to dice the wafer. For laser dicing the upper faces of the islands are a sufficient height above the major face that energy of a laser beam 30 used to dice the wafer is dissipated in channels between the islands without substantially machining the support substrate.