Patents by Inventor Billy J. Lang, II

Billy J. Lang, II has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of electroplating a copper lead frame with copper
    Patent number: 4800178
    Abstract: The copper tape that is used in the tape assembly of semiconductor devices is provided with a bondable surface by an electroplated layer of copper. The copper tape is passivated in a weak organic acid solution immediately after plating. In the preferred embodiment the copper tape is also cleaned and passivated prior to electroplating. The passivated copper can be thermosonically bonded using gold wires for up to 144 hours after preparation. The elimination of noble metal plating reduces assembly cost and the passivated copper bonds well to the subsequently applied plastic encapsulant.
    Type: Grant
    Filed: September 16, 1987
    Date of Patent: January 24, 1989
    Assignee: National Semiconductor Corporation
    Inventors: Ranjan J. Mathew, Billy J. Lang, II