Patents by Inventor Billy Kiang

Billy Kiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for connecting printed circuit boards through soldered lap joints
    Patent number: 6223973
    Abstract: An apparatus and method for connecting together first and second printed circuit boards 10/20 (PCBs), wherein one or both of the PCBs is a flex circuit. The method includes overlapping the two PCBs such that their respective matching circuit trace arrays 12/22 face each other and are separated by a small predetermined distance K, and then introducing molten solder 30 proximate an overlapping PCB edge 18, such as by wave soldering, so as to urge capillation of the molten solder between the two PCBs, thereby forming solder joints operatively connecting together the two circuit trace arrays.
    Type: Grant
    Filed: November 16, 1999
    Date of Patent: May 1, 2001
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Stephen H. P. Wong, Billy Kiang