Abstract: Apparatus and methods for fluxing with water-soluble flux. A circuit card assembly has its solderable surface exposed for fluxing. A spray nozzle atomizes the flux to provide a mist that wets the surface without creating flux droplets. A pump is coupled between the spray nozzle and a container which stores the flux for pumping flux and atomizing the flux to create the flux spray. The apparatus may be used as a stand alone fluxing station for use with a liquid wave solder or vapor solder system. Alternatively, the apparatus may be used as an integral part of a wave soldering system that replaces the conventional fluxing station. In this embodiment, the apparatus is located beneath the conveyor and a sensor is used to actuate the flux spray. A plurality of nozzles or pluralities of sets of nozzles may be employed to achieve proper wetting of the assembly.