Abstract: A package structure for a semiconductor is described. The advantages thereof are that it has a great structural strength and when being penetrated by light, it will not be influenced by external light and can condense the light. Therefore, it is not easily be deformed so that the yield and quality of package can be increased, and when packaging an LED chip, it easily meets the package requirements of an electronic chip. In addition, the substrate structure is cheaper than the prior art, because a double-layered substrate is employed to improve the strength, and the package structure is also preferred because an external frame device is additionally used for preventing interference by external light. The package structure for the semiconductor has a substrate, an external frame device and a polymer filler.

Abstract: The present invention provides a package structure of optical sensitive device. The package structure includes a silicon substrate, an optical sensitive device, a supporting pad, a transparent plate and a plurality of conductive wires. The optical sensitive device is positioned on the silicon substrate, and the transparent plate is fixedly positioned on the supporting pad and corresponds to the optical sensitive area of the optical sensitive device. The transparent plate can be positioned on the substrate, and the electrical wires are electrically connected between the optical sensitive device and the substrate.

Abstract: A surface-mount package for multiple LED chips is constructed by inscribing a groove in an insulating substrate. The LED chips are mounted in the groove and the leads are connected to metal plates, which wrap around the substrate to provide bottom contacts for surface-mounting.