Patents by Inventor Bily Wangn

Bily Wangn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6559512
    Abstract: The leads of a light emitting device package are extended is flexible pins. These pins can be bent with respect to a motherboard so that the direction of the light entitled from the light emitting device can be adjusted. The package is tab-mounted to the motherboard for heat sinking or serving as a lead.
    Type: Grant
    Filed: August 2, 2001
    Date of Patent: May 6, 2003
    Assignee: Harvatek Corp.
    Inventors: Bily Wangn, Bill Chang, Chin-Mau James Hwang