Patents by Inventor Bimal Dey

Bimal Dey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240382950
    Abstract: Disclosed is a deck assembly for a diagnostic system, the deck assembly comprises a deck plate, a heating means, a cooling means and at least one insulation partition. Further, the deck plate, has a defined number of a set of place holders. Further, the heating means is mounted on the deck plate. Further, the cooling means is mounted on the deck plate. Further, the at least one insulation partition is mounted on the deck plate. Further, the at least one insulation is configured to provide insulation by restricting transfer of heat or cold from the at least one place holder from the set of place holders. Further, at least one place holder from the set of the place holder is enabled to discard piercing tips.
    Type: Application
    Filed: July 26, 2024
    Publication date: November 21, 2024
    Inventors: Hasmukh Sohanraj Rawal, Debarshi Bimal Dey, Ketan Kamlesh Gajjar
  • Patent number: 7515045
    Abstract: A sensor package comprising a micro-electromechanical (MEMS) motion sensor, an analog-to-digital converter coupled to the MEMS motion sensor, and a wireless transceiver coupled to the analog-to-digital converter, wherein the sensor package can wirelessly communicate with one or more wireless receivers and, if present, with one or more other sensor packages. A process comprising attaching one or more sensor packages to one or more vehicles or devices (mobile or stationary), each sensor package comprising a micro-electromechanical (MEMS) motion sensor, an analog-to-digital converter coupled to the MEMS motion sensor, and a wireless transceiver coupled to the MEMS motion sensor; sensing the motion of the one or more vehicles or devices to which each sensor package is attached; and transmitting motion data from the sensor package to a wireless receiver or to another sensor package.
    Type: Grant
    Filed: September 29, 2005
    Date of Patent: April 7, 2009
    Assignee: Intel Corporation
    Inventors: Goutam Paul, Madhav Rangaswami, Devadas D. Pillai, Bimal Dey, Ralph M. Kling
  • Publication number: 20070069892
    Abstract: A sensor package comprising a micro-electromechanical (MEMS) motion sensor, an analog-to-digital converter coupled to the MEMS motion sensor, and a wireless transceiver coupled to the analog-to-digital converter, wherein the sensor package can wirelessly communicate with one or more wireless receivers and, if present, with one or more other sensor packages. A process comprising attaching one or more sensor packages to one or more vehicles or devices (mobile or stationary), each sensor package comprising a micro-electromechanical (MEMS) motion sensor, an analog-to-digital converter coupled to the MEMS motion sensor, and a wireless transceiver coupled to the MEMS motion sensor; sensing the motion of the one or more vehicles or devices to which each sensor package is attached; and transmitting motion data from the sensor package to a wireless receiver or to another sensor package.
    Type: Application
    Filed: September 29, 2005
    Publication date: March 29, 2007
    Inventors: Goutam Paul, Madhav Rangaswami, Devadas Pillai, Bimal Dey, Ralph Kling