Patents by Inventor Bin Abdul Aziz Anis Fauzi

Bin Abdul Aziz Anis Fauzi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT PACKAGE WITH LEAD LOCK
    Publication number: 20200176365
    Abstract: In a described example, a packaged integrated circuit (IC) includes a lead frame with a lead and with an IC chip mount pad. A portion of the lead adjacent to the IC chip mount pad is mechanically deformed to form a lead lock. An integrated circuit chip is mounted on a first side of the IC chip mount pad; and the integrated circuit chip, the IC chip mount pad, and the portion are covered in molding compound.
    Type: Application
    Filed: February 5, 2020
    Publication date: June 4, 2020
    Inventors: Bin Abdul Aziz Anis Fauzi, Wei Fen Sueann Lim, Lee Han Meng@Eugene Lee
  • INTEGRATED CIRCUIT PACKAGE WITH LEAD LOCK
    Publication number: 20190206770
    Abstract: In a described example, a packaged integrated circuit (IC) includes a lead frame with a lead and with an IC chip mount pad. A portion of the lead adjacent to the IC chip mount pad is mechanically deformed to form a lead lock. An integrated circuit chip is mounted on a first side of the IC chip mount pad; and the integrated circuit chip, the IC chip mount pad, and the portion are covered in molding compound.
    Type: Application
    Filed: December 29, 2017
    Publication date: July 4, 2019
    Inventors: Bin Abdul Aziz Anis Fauzi, Wei Fen Sueann Lim, Lee Han Meng@Eugene Lee