Patents by Inventor Bin An

Bin An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240190211
    Abstract: An embodiment heat pump system of a vehicle includes a valve controlling a flow of a coolant, a first line having ends connected to the valve, a radiator and an electrical component on the first line, a second line having ends connected to the valve, a battery module on the second line, a first connection line including a first end connected to the valve, a chiller on the first connection line, a second connection line including ends connected to the second and first connection lines, and a third connection line including a first end connected to a second end of the first connection line and a second end connected to the first line between the radiator and the electrical component, wherein the valve operates such that the first, second, or first connection line is connected to another line or to itself depending on the selected mode.
    Type: Application
    Filed: June 7, 2023
    Publication date: June 13, 2024
    Inventors: Yong Woong Cha, Wan Je Cho, Jungha Park, Eon Soo Yun, ByeongGu Kang, Seongjae Lee, Jong Il Park, Jai Young An, Seong-Bin Jeong
  • Publication number: 20240194606
    Abstract: A semiconductor structure includes a stack structure, first gate isolation structures, and conductive structures. The stack structure includes gate layers and first dielectric layers disposed alternately. The first gate isolation structures extend along a first direction, and the first gate isolation structures are arranged at intervals along a second direction and divide the stack structure into at least one block comprising a memory region and a connection region that are distributed along the first direction. The conductive structures are located in the connection region, and orthographic projections of upper ends of at least two conductive structures on a reference plane at least partially overlap. The reference plane is perpendicular to the second direction, and the first direction is perpendicular to the second direction.
    Type: Application
    Filed: December 30, 2022
    Publication date: June 13, 2024
    Inventors: Jiajia Wu, Wei Xu, Bin Yuan, Lei Xue, Zongliang Huo
  • Publication number: 20240190901
    Abstract: Provided are compounds comprising as a central moiety a 6-membered aromatic ring which is fused to a 5-membered heterocyclic ring comprising at least two nitrogen atoms. Also provided are formulations comprising these compounds. Further provided are organic light emitting devices (OLEDs) as well as related consumer products that utilize these compounds.
    Type: Application
    Filed: October 24, 2023
    Publication date: June 13, 2024
    Applicant: UNIVERSAL DISPLAY CORPORATION
    Inventors: Tyler FLEETHAM, Bin MA, Fadi M. JRADI, Elena SHEINA, Siva Kumar TALLURI, Noah HORWITZ, Mahesh PAUDYAL
  • Publication number: 20240194607
    Abstract: A semiconductor device and a manufacturing method thereof, a memory and a memory system are disclosed. The method includes: providing a substrate and stacked layers on the substrate, the stacked layers comprising interlayer sacrificial layers and interlayer insulating layers which are alternately stacked; removing part of the interlayer sacrificial layer to form a gate gap; sequentially forming a protection layer and a gate structure in the gate gap; forming a contact hole extending from a side of the stacked layers facing away from the substrate into a remaining interlayer sacrificial layer and exposing the protection layer; removing the protection layer exposed in the contact hole to expose the gate structure; forming a contact structure in the contact hole in such a way that the contact structure is connected with the gate structure.
    Type: Application
    Filed: December 30, 2022
    Publication date: June 13, 2024
    Inventors: Qiangwei Zhang, Bin Yuan, Zongke Xu, Yali Guo, Wei Xu, Lei Xue, Zongliang Huo
  • Publication number: 20240190868
    Abstract: A compound of formula I: Each variable is defined herein. Also disclosed are a pharmaceutical composition containing a compound of formula I, a method of treating cancer using such a compound, and a method of inhibiting SOS1 with the compound.
    Type: Application
    Filed: November 9, 2023
    Publication date: June 13, 2024
    Inventors: Kuo-Long Yu, Sanjeev Kumar, Bin Liu, Weitao Pan
  • Publication number: 20240194876
    Abstract: A positive electrode additive for a lithium secondary battery can improve atmospheric stability. A method of manufacturing the same and a positive electrode for a lithium secondary battery includes the same. The positive electrode additive for a lithium secondary battery is used to manufacture the positive electrode for a lithium secondary battery and includes a lithium (Li)-based additive core and a coating layer of NbOXCy (0?x?2.5 and 0?y?1; where Nb=niobium, O=oxygen, C=carbon) formed on a surface of the additive core.
    Type: Application
    Filed: October 27, 2023
    Publication date: June 13, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
    Inventors: Da Bin Jang, Sung Ho Ban, Sang Hun Lee, Yong Hoon Kim, Ha Eun Lee, Seung Min Oh, Chang Hoon Song, Sung Min Park, Hyo Bin Lee, Tae Hee Kim, Min Sik Park
  • Publication number: 20240191049
    Abstract: A composition of heat-expandable microspheres and an application thereof are provided. The composition includes heat-expandable microspheres and a solvent. The particle size of the heat-expandable microspheres is 5 ?m?D?40 ?m, preferably 8 ?m?D?20 ?m. The thickness of the walls of at least 60% of the heat-expandable microspheres is ?5 ?m, preferably the thickness is ?3 ?m. The solvent at least comprises one organic solvent having a boiling point of above 220° C. A thermal expansion coating containing the composition has a stable structure, relatively high resistance to thermal shrinkage, relatively high mechanical strength and adhesion, can be applied in the fixation of high temperature resistant parts, and can maintain the bonding stability thereof when placed long-term in a high temperature environment (140-180° C.).
    Type: Application
    Filed: March 31, 2022
    Publication date: June 13, 2024
    Inventors: Zhiqiang LI, Mingliang GAO, Yongjiang YU, Hongyu ZHOU, Bin ZHOU, Pengfei WANG, Rui WEI
  • Publication number: 20240194747
    Abstract: Provided is a metal-oxide thin-film transistor. The metal-oxide thin-film transistor includes a gate, a gate insulation layer, a metal-oxide semiconductor layer, a source electrode, a drain electrode, and a passivation layer that are successively disposed on a base substrate; wherein the source electrode and the drain electrode are both in a laminated structure, wherein the laminated structure of the source electrode or the drain electrode at least includes a bulk metal layer and an electrode protection layer; wherein the electrode protection layer includes a metal or a metal alloy; the electrode protection layer is at least disposed between the metal-oxide semiconductor layer and the bulk metal layer; wherein a metal-oxide layer is disposed between the electrode protection layer and the bulk metal layer.
    Type: Application
    Filed: August 31, 2021
    Publication date: June 13, 2024
    Inventors: Bin Lin, Liangliang Li, Zheng Liu, Bo Hu, Rui Zhang, Xinlin Peng
  • Publication number: 20240190516
    Abstract: An embodiment reinforcement member for a rear floor panel is disposed on an upper surface of the rear floor panel, is coupled to a rear floor center cross member that is configured to support a rear surface of the rear floor panel, and is connected to a maintenance cover hole in the rear floor panel from the rear floor center cross member.
    Type: Application
    Filed: February 3, 2023
    Publication date: June 13, 2024
    Inventors: Hyun-Bin Kim, Hyeon-Ho Im, Jee-Han Kim, Sung-Won Kim
  • Publication number: 20240195000
    Abstract: The energy storage power supply comprises a housing; the housing comprises at least two accommodating portions, the at least two accommodating portions comprise at least one first accommodating portion and at least one second accommodating portion, the first accommodating portion is adapted to detachably accommodate a first battery cell; the second accommodating portion is adapted to detachably accommodate a second battery cell; the first battery cell and the second battery cell are different; each the accommodating portion is provided with a charging portion for supplying power to the first battery cell or the second battery cell; and the first battery cell and the second battery cell are adapted to supply power to the same or different first electrical device in a manner of being separated from the energy storage power supply.
    Type: Application
    Filed: December 29, 2023
    Publication date: June 13, 2024
    Inventors: Bin LI, Naiqian Xu, Hengzhao Ke
  • Publication number: 20240192037
    Abstract: A fluid flow rate sensor. The fluid flow rate sensor comprises an elongated structure; a heating element installed into a first end of the elongated structure; a first temperature transducer coupled to an outside of the elongated structure at a first predefined location; a second temperature transducer coupled to the outside of the elongated structure at a second predefined location; and a control unit that is configured to turn the heating element on and off, to analyze a first temperature indication received from the first temperature transducer, to analyze a second temperature indication received from the second temperature transducer, to determine a flow rate of a fluid that is in intimate contact with the outside of the elongated structure based on analyzing the first temperature indication and the second temperature indication, and to output the flow rate via a communication line.
    Type: Application
    Filed: December 13, 2022
    Publication date: June 13, 2024
    Inventors: Ketankumar Kantilal SHETH, Donn J. BROWN, Robert Charles DE LONG, Christopher Michael JONES, Etienne SAMSON, Bin DAI
  • Publication number: 20240194861
    Abstract: An anode active material for a secondary battery according to an embodiment of the disclosed technology includes an anode current collector, a first anode active material layer on at least one surface of the anode current collector and including a graphite-based active material and a silicon-based active material doped with a metal element, and a second anode active material layer on the first anode active material layer and including a porous structure. The porous structure includes a carbon-based particle having pores and a silicon-containing coating formed inside the pores or on a surface of the carbon-based particle.
    Type: Application
    Filed: December 7, 2023
    Publication date: June 13, 2024
    Inventors: Jun Hee HAN, Moon Sung KIM, Hyo Mi KIM, Sang Baek RYU, Seung Hyun YOOK, Hwan Ho JANG, Da Bin CHUNG, Da Hye PARK, Sang In BANG, Young Mo YANG, Ju Ho CHUNG
  • Publication number: 20240192429
    Abstract: The present application discloses a backlight module and a display device. The backlight module includes a light guide plate, and the light-emitting surface includes a plurality of light-emitting units arranged in rows. A backlight plate is arranged on the light guide plate, and a plurality of transparent hole units are arranged on the backlight plate. A shutter layer is arranged on the backlight plate, and a number of shutter units are arranged on the shutter layer. The shutter units are arranged corresponding to the transparent hole units. The shutter units are used to control whether light passing through the transparent hole units passes through the shutter layer.
    Type: Application
    Filed: June 24, 2022
    Publication date: June 13, 2024
    Inventors: Bin ZHAO, Juncheng XIAO, Junling LIU
  • Publication number: 20240195278
    Abstract: A vibration motor is used for a terminal device. The terminal device is provided with a middle frame having a first avoiding hole. The vibration motor includes a housing. The housing is provided with an accommodating space inside. The housing includes a first wall plate. The first wall plate is provided with a first protruding portion that protrudes outwards. The first protruding portion is hollow inside so that a first accommodating compartment is formed. The first accommodating compartment communicates with the accommodating space. When the vibration motor is mounted on the middle frame, an outer surface of the first wall plate faces the middle frame and the first protruding portion is accommodated in the first avoiding hole.
    Type: Application
    Filed: September 1, 2022
    Publication date: June 13, 2024
    Inventors: Yihe ZHANG, Bangshi YIN, Bin YAN, Jiuliang GAO, Jianwei ZHU
  • Publication number: 20240190202
    Abstract: An embodiment heat pump system for a vehicle includes a valve module for controlling a flow of a coolant according to a selected mode for temperature adjustment of a vehicle interior and temperature adjustment of a battery module, a first line connected to the valve module, an electrical component on the first line, a second line connected to the first line and the valve module, a radiator on the second line, a third line connected to the valve module, wherein the battery module is on the third line, a fourth line connected to the valve module and the third line, a fifth line connected to the valve module, a chiller on the fifth line, a sixth line connected to the first line and the fifth line, and a seventh line connected to the third line and the fifth line.
    Type: Application
    Filed: May 30, 2023
    Publication date: June 13, 2024
    Inventors: Seong-Bin Jeong, Jae-Eun Jeong, Yong Woong Cha, Wan Je Cho
  • Publication number: 20240195731
    Abstract: In an example method embodiment, the SDN controller receives a first message from a first network device controlled by SDN, where the first message includes type information indicating that a type of the first message is a resource report type and resource information of a computing node associated with the first network device; and determines, based at least on the first message, resources of a SDN domain in which the SDN controller is located. As such, the SDN controller also can manage and control the resources of the SDN domain in addition to controlling the SDN network. Therefore, the SDN controller can perform a resource allocation according to the resources of the SDN domain, to optimize the computing power resources of the SDN domain, boost the resource utilization rate of the SDN domain, and further enhance the processing efficiency of the packets.
    Type: Application
    Filed: December 11, 2023
    Publication date: June 13, 2024
    Applicant: Nokia Solutions and Networks Oy
    Inventors: Hai Bo WEN, Kai Bin ZHANG
  • Publication number: 20240195178
    Abstract: A power conversion device and a control method thereof are provided. The power conversion device includes a three-level inverter, positive and negative DC terminals, first and second capacitors, a balance circuit, a bidirectional DC-DC converter and a controller. The three-level inverter has two DC terminals coupled to the positive and negative DC terminals respectively. Two terminals of the first capacitor are coupled to the positive DC terminal and a capacitor midpoint respectively. Two terminals of the second capacitor are coupled to the capacitor midpoint and the negative DC terminal respectively. The balance circuit is electrically connected between the positive and negative DC terminals and has a neutral terminal electrically connected to the capacitor midpoint. The bidirectional DC-DC converter is electrically connected to the DC terminals.
    Type: Application
    Filed: December 7, 2023
    Publication date: June 13, 2024
    Inventors: Feidong Xu, Bin Wang, Yueran Zhang, Heng Wang
  • Publication number: 20240193816
    Abstract: Disclosed herein are an immersive image encoding/decoding method and apparatus, and a method for transmitting a bitstream generated by the immersive image encoding method. An immersive image encoding method according to the present disclosure, which is performed in an immersive image encoding apparatus, may include: grouping images for a virtual reality space into groups; calculating, based on view information, a view weight of each of the groups; and determining, based on the view weight, a bitstream level of the each of the groups.
    Type: Application
    Filed: February 28, 2023
    Publication date: June 13, 2024
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Eun Seok RYU, Soon Bin LEE, Jong Beom JEONG
  • Patent number: 12005495
    Abstract: A steel ladle drainage method is achieved by using a steel ladle structure. Vacuum interlayers are provided within an upper nozzle, an upper fixed plate, a lower fixed plate and a sliding plate of the steel ladle structure respectively. In the steel ladle drainage method provided by the present invention, a metal drainage agent is used to replace the drainage sand in the prior art, the metal drainage agent is melted by the liquid steel and deposited in the upper nozzle, the sliding plate with the vacuum interlayer and the upper nozzle with the vacuum interlayer have the insulation effect on the melted metal drainage agent. Moreover, through moving the sliding plate, the two pouring holes of the upper and lower fixed plates are connected with each other, the metal drainage agent enters the tundish through the pouring holes and the lower nozzle under the action of gravity.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: June 11, 2024
    Assignee: HEBEI VOCATIONAL UNIVERSITY OF INDUSTRY AND TECHNOLOGY
    Inventors: Lei Cao, Yanjun Meng, Zhen Cao, Weiqing Huang, Yongliang Shi, Bin Yang, Zhongqi Dong, Yanxia Liu, Min Chen, Shanshan Zhang
  • Patent number: 12005445
    Abstract: A method for making ion-crystal semiconductor material based micro- and/or nanowires, MNWs, embedded into a semiconductor substrate, includes forming a structure into the semiconductor substrate, wherein the structure has each of a width and a depth less than 10 ?m; pumping an ion-crystal semiconductor material as an ion solution into the structure, wherein the pumping is achieved exclusively due to capillary forces; flowing the ion solution through the structure to fill the structure; crystallizing the ion-crystal semiconductor material inside the structure to form the MNWs; and adding electrodes to ends of the MNWs.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: June 11, 2024
    Assignee: KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Bin Xin, Iman S. Roqan