Abstract: A circuit layout structure is provided. In the circuit layout structure, a transmission line group is disposed on a substrate. In its first differential signal transmission line pair, a first negative polarity transmission line is parallel to a first positive polarity transmission line and is configured to transmit a first negative polarity transmission signal of a first differential signal. In a second differential signal transmission line pair, a second positive polarity transmission line is parallel to a single-ended signal transmission line and is configured to transmit a second positive polarity transmission signal of a second differential signal. The second negative polarity transmission line is parallel to the second positive polarity transmission line. The single-ended signal transmission line is disposed between the first differential signal transmission line pair and the second differential signal transmission line pair.

Abstract: An artificial magnetic conductor comprising a base board, a first conducting element, a second conducting element and a first lumped element is provided. The first conducting element is disposed at a first side of the base board. The first conducting element includes an opening. The second conducting element is disposed at a second side of the base board. The first lumped element is disposed on the corresponding first conducting element. An electronic device including the artificial magnetic conductor is also provided.

Abstract: A signal transmission assembly includes a substrate, a first transmission line, and a second transmission line. The first transmission line and the second transmission line are disposed on the substrate and extending along a first direction. The first transmission line comprises at least one first transmission section and at least one second transmission section. The first transmission section is apart from the second transmission line by a first distance. The second transmission section is apart from the second transmission line by a second distance. The first distance is greater than or equal to the second distance. A first edge of the first transmission section and a second edge of the second transmission section are proximal to the second transmission line and parallel to the first direction, and the second transmission line does not contact an edge extension line extending from the second edge along the first direction.

Abstract: A signal transmission assembly includes a substrate, a first transmission line, and a second transmission line. The first transmission line and the second transmission line are disposed on the substrate and extending along a first direction. The first transmission line comprises at least one first transmission section and at least one second transmission section. The first transmission section is apart from the second transmission line by a first distance. The second transmission section is apart from the second transmission line by a second distance. The first distance is greater than or equal to the second distance. A first edge of the first transmission section and a second edge of the second transmission section are proximal to the second transmission line and parallel to the first direction, and the second transmission line does not contact an edge extension line extending from the second edge along the first direction.

Abstract: An electronic assembly and a method for manufacturing the electronic assembly are provided. The method includes: configuring a chip and a connector at a first wiring layer of a PCB, and determining a first trace between a first pin of the chip and a first pin of the connector, and a second trace between a second pin of the chip and a second pin of the connector according to a first internal resistance of the chip, a second internal resistance of the chip, a first internal resistance of the connector, and a second internal resistance of the connector.

Abstract: A circuit layout structure is provided. In the circuit layout structure, a transmission line group is disposed on a substrate. In its first differential signal transmission line pair, a first negative polarity transmission line is parallel to a first positive polarity transmission line and is configured to transmit a first negative polarity transmission signal of a first differential signal. In a second differential signal transmission line pair, a second positive polarity transmission line is parallel to a single-ended signal transmission line and is configured to transmit a second positive polarity transmission signal of a second differential signal. The second negative polarity transmission line is parallel to the second positive polarity transmission line. The single-ended signal transmission line is disposed between the first differential signal transmission line pair and the second differential signal transmission line pair.

Abstract: An electronic assembly and a method for manufacturing the electronic assembly are provided. The method includes: configuring a chip and a connector at a first wiring layer of a PCB, and determining a first trace between a first pin of the chip and a first pin of the connector, and a second trace between a second pin of the chip and a second pin of the connector according to a first internal resistance of the chip, a second internal resistance of the chip, a first internal resistance of the connector, and a second internal resistance of the connector.

Abstract: A wearable electronic device includes a device body and a wearing element. The wearing element is connected to the device body. The device body includes a conductive upper cover, a conductive lower cover, an insulating frame and a circuit system. The insulating frame is disposed between the conductive upper cover and the conductive lower cover and forms an accommodating space therewith. The circuit system is disposed in the accommodating space. The conductive upper cover has a first feeding point. The conductive lower cover has a second feeding point. The circuit system is coupled to the first feeding point and the second feeding point respectively.

Abstract: An electromagnetic bandgap structure and an electronic device having the same are provided. The electromagnetic bandgap structure includes a first conductive element, a second conductive element and a planar inductive element. The planar inductive element is disposed between the first conductive element and the second conductive element. Furthermore, the planar inductive element is electrically connected to the first conductive element via a first conductive pillar, and it is electrically connected to the second conductive element via a second conductive pillar.

Abstract: An artificial magnetic conductor comprising a base board, a first conducting element, a second conducting element and a first lumped element is provided. The first conducting element is disposed at a first side of the base board. The first conducting element includes an opening The second conducting element is disposed at a second side of the base board. The first lumped element is disposed on the corresponding first conducting element. An electronic device including the artificial magnetic conductor is also provided.

Abstract: An electronic device includes a main body, a metal cover, an antenna and a magnetic flux inducer unit. The metal cover is disposed at the main body and the main body includes a nonmetal covered portion. The antenna is disposed in the main body. The magnetic flux inducer unit is disposed in the main body and located between the nonmetal covered portion and the antenna. The permeability of the magnetic flux inducer unit is greater than 1.

Abstract: A wearable electronic device includes a device body and a wearing element. The wearing element is connected to the device body. The device body includes a conductive upper cover, a conductive lower cover, an insulating frame and a circuit system. The insulating frame is disposed between the conductive upper cover and the conductive lower cover and forms an accommodating space therewith. The circuit system is disposed in the accommodating space. The conductive upper cover has a first feeding point. The conductive lower cover has a second feeding point. The circuit system is coupled to the first feeding point and the second feeding point respectively.

Abstract: An electromagnetic bandgap structure and an electronic device having the same are provided. The electromagnetic bandgap structure includes a first conductive element, a second conductive element and a planar inductive element. The planar inductive element is disposed between the first conductive element and the second conductive element. Furthermore, the planar inductive element is electrically connected to the first conductive element via a first conductive pillar, and it is electrically connected to the second conductive element via a second conductive pillar.

Abstract: An electronic device includes a main body, a metal cover, an antenna and a magnetic flux inducer unit. The metal cover is disposed at the main body and the main body includes a nonmetal covered portion. The antenna is disposed in the main body. The magnetic flux inducer unit is disposed in the main body and located between the nomnetal covered portion and the antenna. The permeability of the magnetic flux inducer unit is greater than 1.

Abstract: A common mode filter includes a plurality of substrates stacked along an axial direction, a first conductor structure and a second conductor structure disposed on the substrates and including a plurality of first rings and second rings disposed sequentially along the axial direction. The first rings and the second rings are disposed to alternate with each other along the axial direction. The first conductor structure and the second conductor structure are spaced apart by a first clearance in a first direction transverse to the axial direction.

Abstract: A miniaturized common mode filter is composed of multiple substrates with a positive coil and a negative coil formed on alternate substrates. The positive coils are sequentially connected via conductive through holes defined in each substrate, as are the negative coils. The pattern of each positive coil is interlaced with that of each negative coil, whereby when the positive and negative coils are alternately stacked, the positive coils do not overlap negative coils. With such an interlaced configuration of the coils, the problem of the parasitic capacitance is eliminated. Moreover, the thickness of each substrate can be decreased so the size of the entire filter is effectively reduced.