Abstract: A semiconductor device and method of manufacture are provided. After a patterning of a middle layer, the middle layer is removed. In order to reduce or prevent damage to other underlying layers exposed by the patterning of the middle layer and intervening layers, an inhibitor is included within an etching process in order to inhibit the amount of material removed from the underlying layers.

Abstract: An optical fiber connector includes a connecting unit, an adapter unit, and an attenuation unit. The adapter unit includes an insertion seat connected removably to a main housing of the connecting unit, and two guide frame bodies located respectively at two opposite sides of the insertion seat in a transverse direction. The insertion seat has two insertion holes spaced apart in the transverse direction and extending in a front-rear direction. Each guide frame body extends in the front-rear direction away from the connecting unit. The attenuation unit includes two attenuation components, two rear ferrules, and two front ferrules. The attenuation components are arranged in the transverse direction and disposed within the main housing. The rear ferrules respectively extend rearwardly from rear ends of the attenuation components into the insertion holes. The front ferrules respectively extend forwardly from front ends of the attenuation components through and outwardly of the main housing.

Abstract: A semiconductor device includes a first contact layer, a second contact layer, an active layer, a photonic crystal layer, a passivation layer, a first electrode and a second electrode. The first contact layer has a first surface and a second surface opposite to each other. Microstructures are located on the second surface. The second contact layer is located below the first surface. The active layer is located between the first contact layer and the second contact layer. The photonic crystal layer is located between the active layer and the second contact layer. The passivation layer is located on the second contact layer. The first electrode is located on the passivation layer and is electrically connected the first surface of the first contact layer. The second electrode is located on the passivation layer and is electrically connected to the second contact layer.

Abstract: A semiconductor device includes a substrate and a gate structure. The gate structure is disposed on the substrate, and the gate structure includes a titanium nitride barrier layer a titanium aluminide layer, and a middle layer. The titanium aluminide layer is disposed on the titanium nitride barrier layer, and the middle layer is disposed between the titanium aluminide layer and the titanium nitride barrier layer. The middle layer is directly connected with the titanium aluminide layer and the titanium nitride barrier layer, and the middle layer includes titanium and nitrogen. A concentration of nitrogen in the middle layer is gradually decreased in a vertical direction towards an interface between the middle layer and the titanium aluminide layer.

Abstract: A beta2-microglobulin concentration analyzing method includes: inputting samples that are prepared from spent dialysate and corresponding to sampling time points into a differential mobility analyzing device for analysis to obtain beta2-microglobulin concentrations, multiplying the sampling time points with a dialysate flowrate respectively to obtain spent dialysate volumes, performing fitting on the beta2-microglobulin concentrations to obtain a concentration-spent dialysate volume fitting curve, and performing integration on the concentration-spent dialysate volume fitting curve to generate a total dialyzed weight.

Abstract: A beta2-microglobulin concentration analyzing method includes: preparing a sample with dialysate, and putting the sample into a differential mobility analyzing device for analysis to obtain a beta2-microglobulin concentration. The present invention further provides a beta2-microglobulin concentration analyzing system, which includes: a preparation device and a differential mobility analyzing device, wherein the preparation device is configured to prepare a sample with dialysate, and the differential mobility analyzing device is configured to analyze the sample to obtain a beta2-microglobulin concentration.

Abstract: An LED lighting device includes a luminescent device driven by a rectified AC voltage, a current detecting circuit, a current regulating circuit, and a duty cycle detecting circuit. The current regulating circuit is configured to provide a regulating current so that the current flowing through the luminescent device does not exceed the regulating current. The current detecting circuit is configured to monitor the value of the regulating current, and the duty cycle detecting circuit is configured to monitor the duty cycle of the regulating current. The present invention can improve the overall line regulation of the LED lighting device when the rectified AC voltage somehow fluctuates between its upper bound and lower bound.

Abstract: An LED lighting device includes a luminescent device driven by a rectified AC voltage, a current detecting circuit, a current regulating circuit, and a duty cycle detecting circuit. The current regulating circuit is configured to provide a regulating current so that the current flowing through the luminescent device does not exceed the regulating current. The current detecting circuit is configured to monitor the value of the regulating current, and the duty cycle detecting circuit is configured to monitor the duty cycle of the regulating current. The present invention can improve the overall line regulation of the LED lighting device when the rectified AC voltage somehow fluctuates between its upper bound and lower bound.

Abstract: A method includes supplying slurry onto a polishing pad; holding a wafer against the polishing pad with a piezoelectric layer interposed vertically between a pressure unit and the wafer; exerting a force on the piezoelectric layer using the pressure unit to make the piezoelectric layer directly press the wafer; generating, using the piezoelectric layer, a first voltage corresponding to a first portion of the wafer and a second voltage corresponding to a second portion of the wafer; tuning the force exerted on the piezoelectric layer according to the first voltage and the second voltage; and polishing, using the polishing pad, the wafer.

Abstract: The present invention provides a pulse diagnosis device including at least one bellow, at least one sensor, and a locating element. The bellow has a sensing surface having a first end and a second end opposite to each other. The sensor is disposed on the sensing surface and has a sensing area at least partially extending from the first end to the second end or protruding from the second end. The locating element is at least partially disposed along the second end to position the sensor at the second end, wherein the sensing area does not overlap with the locating element at least partially.

Abstract: A method includes supplying slurry onto a polishing pad. A wafer is held against the polishing pad with a first piezoelectric layer interposed between a pressure unit and the wafer. A first voltage generated by the first piezoelectric layer is detected. The wafer is pressed, using the pressure unit, against the polishing pad according to the detected first voltage generated by the first piezoelectric layer. The wafer is polished using the polishing pad.

Abstract: A direct type backlight device includes a printed circuit board, a light reflector and plural Mini-LEDs. The light reflector and the Mini-LEDs are disposed over the printed circuit board. The light reflector is arranged between at least part of adjacent Mini-LEDs. Each of the Mini-LEDs includes a non-light-emitting layer and a light-emitting layer arranged on the non-light-emitting layer. A bottom surface of the light-emitting layer of each of the Mini-LEDs is higher than a top surface of the light reflector.

Abstract: A display apparatus includes a back plate, a plurality of first magnetic components, a display module and second magnetic components. The back plate has a bottom wall and a carrying portion. The carrying portion is connected to the bottom wall and located at a periphery of the bottom wall. A plurality of first magnetic components is disposed on the carrying portion. The display module includes a first substrate. The carrying portion supports an edge of the first substrate. The second magnetic components are disposed to the edge of the first substrate and disposed oppositely to the first magnetic components respectively. The first magnetic components and the second magnetic components are coupled to each other by a magnetic force.

Abstract: A dimmer circuit is used in an LED lighting system which includes a power supply circuit and a lamp. The power supply circuit is configured to provide an AC voltage. The lamp is coupled to the power supply. The dimmer circuit is configured to adjust the brightness of the lamp according to a dimming signal without the lamp conducting a bleeder current during each cycle of the AC voltage.

Abstract: A display apparatus includes a back plate, a plurality of first magnetic components, a display module and second magnetic components. The back plate has a bottom wall and a carrying portion. The carrying portion is connected to the bottom wall and located at a periphery of the bottom wall. A plurality of first magnetic components is disposed on the carrying portion. The display module includes a first substrate. The carrying portion supports an edge of the first substrate. The second magnetic components are disposed to the edge of the first substrate and disposed oppositely to the first magnetic components respectively. The first magnetic components and the second magnetic components are coupled to each other by a magnetic force.

Abstract: An LED lighting system includes a luminescent unit driven by a rectified AC voltage and a bleeder circuit. The bleeder circuit includes a current source, a dimming detection unit and an adjusting unit. The current source is configured to provide a bleeder current according to a control signal. The dimming detection unit is configured to monitor the rectified AC voltage, thereby outputting a dimming detection signal associated with an operational mode of the LED lighting system. The adjusting unit is configured to output the control signal according to the dimming detection signal so as to instruct the current source to keep the bleeder current at a first value during a first period and at a second value smaller than the first value during a second period subsequent to the first period when the dimming detection signal indicates that the LED lighting system is operating in a dimming mode.

Abstract: A method includes supplying slurry onto a polishing pad. A wafer is held against the polishing pad with a first piezoelectric layer interposed between a pressure unit and the wafer. A first voltage generated by the first piezoelectric layer is detected. The wafer is pressed, using the pressure unit, against the polishing pad according to the detected first voltage generated by the first piezoelectric layer. The wafer is polished using the polishing pad.

Abstract: A display device including a backlight module and a display panel is provided. The backlight module includes a frame, a light guide element, and a light source. The light guide element is connected to the frame and has a light incident surface, a light emitting surface, and a back surface. The back surface is opposite to the light emitting surface and serves as an appearance surface of the display device. The light source is disposed in the frame and aligned with the light incident surface. The display panel is connected to the frame, and the light emitting surface faces the display panel. A backlight module is also provided. The display device and the backlight module provided in the invention are thinner and lighter, and have a desirable appearance.

Abstract: A polishing head includes a carrier head and a plurality of pressure units arranged on the carrier head. At least two of the pressure units are located on the same circumferential line relative to a center axis of the carrier head.

Abstract: An LED lighting system includes a luminescent unit driven by a rectified AC voltage, a dimmer switch configured to adjust a duty cycle of a system current, and a bleeder circuit. The bleeder circuit includes a first current source, a second current source, a third current source, a current-sensing element for providing a first feedback voltage associated with the system current, a capacitor, and a control unit. The control unit is configured to activate the first current source and deactivate the second current source for charging the capacitor when the system current exceeds a predetermined threshold, deactivate the first current source and activate the second current source for discharging the capacitor when the system current does not exceed the predetermined threshold, and deactivate the third current source to stop supplying the bleeder current according to a second feedback voltage established across the capacitor.