Patents by Inventor Binhua Tan

Binhua Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7031114
    Abstract: A system and a method for bonding a slider to a suspension tongue are disclosed. A set of conductive fibers is embedded in a bonding adhesive binding the slider to the suspension tongue to improve conductivity between the slider and the suspension assembly. The bonding adhesive includes binder resin and silver powder. The slider is composed of aluminum oxide and titanium carbide. The set of conductive fibers is composed of carbon coated potassium titanic acid whisker. The set of conductive fibers range in length from 10 ?m to 20 ?m, and in diameter from 0.3 ?m to 0.6 ?m. The set of conductive fibers range in resistance from 0.01 ohm to 0.1 ohm. The set of conductive fibers is mixed with the bonding adhesive in a 1% to 4% mixing ratio.
    Type: Grant
    Filed: March 24, 2003
    Date of Patent: April 18, 2006
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Quansheng Wu, Binhua Tan, Ichiro Yagi
  • Publication number: 20040070881
    Abstract: A system and a method for bonding a slider to a suspension tongue are disclosed. A set of conductive fibers is embedded in a bonding adhesive binding the slider to the suspension tongue to improve conductivity between the slider and the suspension assembly. The bonding adhesive includes binder resin and silver powder. The slider is composed of aluminum oxide and titanium carbide. The set of conductive fibers is composed of carbon coated potassium titanic acid whisker. The set of conductive fibers range in length from 10 &mgr;m to 20 &mgr;m. and in diameter from 0.3 &mgr;m to 0.6 &mgr;m. The set of conductive fibers range in resistance from 0.01 ohm to 0.1 ohm. The set of conductive fibers is mixed with the bonding adhesive in a 1% to 4% mixing ratio.
    Type: Application
    Filed: March 24, 2003
    Publication date: April 15, 2004
    Inventors: Quansheng Wu, Binhua Tan, Ichiro Yagi