Patents by Inventor Bin Huang

Bin Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12107370
    Abstract: An electrical connector connected with a cable connector connected to cables. The cable connector comprises a plurality of ground terminals, a plurality of signal terminals, and an electromagnetic shielding member. The electrical connector comprises a circuit board, a plurality of ground conductive pads, a plurality of signal conductive pads, and a shielding ground conductive pad. The circuit board comprises two electrical connecting areas that are parallel to each other along first direction. The plurality of ground conductive pads are disposed on a surface of the circuit board at intervals. At least one signal conductive pad is disposed between two adjacent ground conductive pads along second direction that is perpendicular to the first direction. Each of the signal conductive pads being directly connected with the corresponding signal terminal and not directly connected to the cables. The shielding ground conductive pad is disposed on the surface of the circuit board.
    Type: Grant
    Filed: June 5, 2023
    Date of Patent: October 1, 2024
    Assignees: Dongguan Luxshare Technologies Co., Ltd, HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Bin Huang, Ming Li, RongZhe Guo, HongJi Chen, KaiDe Wang, Tao Zeng, ShuYao Shen
  • Patent number: 12108211
    Abstract: A sound receiving device and a control method of the sound receiving device are described. The sound receiving device includes a microphone apparatus, an object detection apparatus, and a processor. The microphone apparatus provides an audio signal. The object detection apparatus detects position information of at least one object. The processor is coupled to the microphone apparatus and the object detection apparatus. The processor determines position information of a sound source according to the audio signal and the position information of the at least one object, and adjusts each microphone gain in the microphone apparatus to receive sound from the sound source.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: October 1, 2024
    Assignee: Chicony Electronics Co., Ltd.
    Inventors: Shang-Yuan Yuan, Hung-Bin Huang
  • Publication number: 20240323041
    Abstract: The present disclosure provides video conference system and conference frame display method. The conference frame display method includes: detecting a direction of at least one voice signal according to at least one audio signal; performing an image recognition on at least one of a plurality of image areas in a rectangle image according to the direction of the at least one voice signal; and in a condition that at least one object of interest is recognized from the at least one of the plurality of image areas, by a display device, displaying an emphasized frame visually highlighting the at least one object of interest.
    Type: Application
    Filed: November 22, 2023
    Publication date: September 26, 2024
    Inventors: Shang-Yuan YUAN, Hung-Bin HUANG
  • Publication number: 20240319838
    Abstract: A control display method includes: displaying a graphical user interface (GUI), the GUI comprising a user-controlled virtual character and a plurality of opponent virtual characters located in a virtual environment and a control; updating a display position of the virtual character on the GUI as the virtual character moves in the virtual environment; in accordance with a determination that the control blocks the virtual character at the display position, increasing a transparency of the control; and in accordance with a determination that the control does not block the virtual character at the display position, reducing the transparency of the control. The control display method enables a user to better observe the virtual character that would have been blocked by the control, and dynamic changes of the transparency of the control is more likely to attract the user's attention, so that the user does not miss important information.
    Type: Application
    Filed: May 21, 2024
    Publication date: September 26, 2024
    Inventors: Qingchun LU, Hongchang HUANG, Bin HUANG
  • Patent number: 12084388
    Abstract: A method for preparing a carbide protective layer comprises: (A) mixing a carbide powder, an organic binder, an organic solvent and a sintering aid to form a slurry; (B) spraying the slurry on a surface of a graphite component to form a composite component; (C) subjecting the composite component to a cold isostatic pressing densification process; (D) subjecting the composite component to a constant temperature heat treatment; (E) repeating steps (B)-(D) until a coating is formed on a surface of the composite component; (F) subjecting the coating to a segmented sintering process; (G) obtaining a carbide protective layer used for the surface of the composite component. Accordingly, while the carbide protective layer can be completed by using the wet cold isostatic pressing densification process and the cyclic multiple superimposition method, so that it can improve the corrosion resistance in the silicon carbide crystal growth process environment.
    Type: Grant
    Filed: January 13, 2023
    Date of Patent: September 10, 2024
    Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Chih-Hsing Wang, Cheng-Jung Ko, Chuen-Ming Gee, Chih-Wei Kuo, Hsueh-I Chen, Jun-Bin Huang, Ying-Tsung Chao
  • Patent number: 12074393
    Abstract: An electrical connector includes an insulating body, a number of first conductive terminals and a metal shell. The insulating body includes a first butting protrusion having a first slot. The metal shell is assembled to the insulating body along an assembling direction. The metal shell includes a top wall, a bottom wall, two side walls and a partition wall. The metal shell includes a first receiving cavity for receiving a first mating plug. The metal shell further includes an installation opening extending downwardly to receive the insulating body. The electrical connector includes a first stop portion provided on the first mating protrusion and adapted for stopping further insertion of the first mating plug.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: August 27, 2024
    Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: Bin Huang, Rongzhe Guo
  • Patent number: 12074035
    Abstract: A method for selectively removing a tungsten-including layer includes: forming a tungsten-including layer which has a first portion and a second portion; performing a treatment on a surface region of the first portion of the tungsten-including layer so as to convert tungsten in the surface region into tungsten oxide; and partially removing the tungsten-including layer using an etchant which has a higher etching selectivity to tungsten than tungsten oxide such that the second portion of the tungsten-including layer is fully removed, and the first portion of the tungsten-including layer, having the tungsten oxide in the surface region, is at least partially retained.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: August 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Ling Chung, Chun-Chih Cheng, Ying-Liang Chuang, Ming-Hsi Yeh, Kuo-Bin Huang
  • Publication number: 20240280796
    Abstract: The present invention discloses an image enhancement system and an implementation method therefor. The system comprises a media signal processing apparatus, an image enhancement apparatus, a microscope body, and a binocular tube. The image enhancement apparatus comprises a housing, and a display device and a superposition lens group that are disposed in the housing, the display device is connected to the media signal processing apparatus, the superposition lens group is disposed on a main optical path of the microscope body, the binocular tube is disposed on the microscope body, the display device is configured to receive information data sent by the media signal processing apparatus and convert the received information data into an optical image, the optical image sent by the display device is superposed to the main optical path of the microscope body through the superposition lens group to form a superposed image, and the superposed image can be observed through the binocular tube.
    Type: Application
    Filed: June 17, 2022
    Publication date: August 22, 2024
    Applicant: ZUMAX MEDICAL CO., LTD.
    Inventors: Jilong WANG, Bobby NADEAU, Jianyue LI, Bin HUANG, Jian CHEN, Jin HE, Tao QIU, ZhuangZhuang HU
  • Publication number: 20240278977
    Abstract: An optical element storage device includes: a base provided with a first groove on the surface, a second groove being provided in the first groove, a boss being provided along an inner wall of the second groove, the optical element to be stored being placed on the boss; and a cover body unit including a top cover and a pressing block, a third groove being provided in the top cover, a fourth groove being provided in the third groove, the pressing block being provided in the fourth groove, the pressing block being movably connected with the fourth groove, the projected area of the pressing block on the base being larger than the sectional area of the first groove, the top cover being detachably connected with the base. The storage device has a simple structure and is easy to be carried, and can store and transport the optical element stably.
    Type: Application
    Filed: January 5, 2024
    Publication date: August 22, 2024
    Inventors: Quan LIU, Zhiwei CHEN, Kexin WANG, Bin HUANG, Nenghua ZHOU
  • Publication number: 20240282575
    Abstract: A semiconductor device and method of manufacture are provided. After a patterning of a middle layer, the middle layer is removed. In order to reduce or prevent damage to other underlying layers exposed by the patterning of the middle layer and intervening layers, an inhibitor is included within an etching process in order to inhibit the amount of material removed from the underlying layers.
    Type: Application
    Filed: April 17, 2024
    Publication date: August 22, 2024
    Inventors: Jian-Jou Lian, Yao-Wen Hsu, Neng-Jye Yang, Li-Min Chen, Chia-Wei Wu, Kuan-Lin Chen, Kuo-Bin Huang
  • Publication number: 20240275110
    Abstract: A coaxial cable connector suitable for mating with an end portion of an electronic device comprises a spindle and a sleeve. The spindle includes a head and a body, wherein the head and the body are coaxially sleeved onto each other. The sleeve is coaxially sleeved onto the spindle, and it includes a head portion, a stopper portion, a compression portion, and a sleeving portion, with the head portion and the body portion of the spindle being disposed between the head portion and the stopper portion. When the coaxial cable connector is joined to the electronic device, the head portion is used to electrically contact the end portion of the electronic device. During installation or removal of the coaxial cable connector from the electronic device, only by rotating the sleeving portion can the head portion be rotated to a specific position.
    Type: Application
    Filed: April 26, 2024
    Publication date: August 15, 2024
    Inventors: Chi Bin HUANG, Han Chung CHEN
  • Patent number: 12051619
    Abstract: Semiconductor devices and methods of manufacture are described herein. A method includes forming an opening through an interlayer dielectric (ILD) layer to expose a contact etch stop layer (CESL) disposed over a conductive feature in a metallization layer. The opening is formed using photo sensitive materials, lithographic techniques, and a dry etch process that stops on the CESL. Once the CESL is exposed, a CESL breakthrough process is performed to extend the opening through the CESL and expose the conductive feature. The CESL breakthrough process is a flexible process with a high selectivity of the CESL to ILD layer. Once the CESL breakthrough process has been performed, a conductive fill material may be deposited to fill or overfill the opening and is then planarized with the ILD layer to form a contact plug over the conductive feature in an intermediate step of forming a semiconductor device.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: July 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Shih Wang, Po-Nan Yeh, U-Ting Chiu, Chun-Neng Lin, Chia-Cheng Chen, Liang-Yin Chen, Ming-Hsi Yeh, Kuo-Bin Huang
  • Patent number: 12051626
    Abstract: A method for manufacturing a semiconductor device includes forming one or more work function layers over a semiconductor structure. The method includes forming a hardmask layer over the one or more work function layers. The method includes forming an adhesion layer over the hardmask layer. The method includes removing a first portion of a patternable layer that is disposed over the hardmask layer. The adhesion layer comprises an organic acid that concurrently bonds metal atoms of the hardmask layer and phenol groups of the patternable layer, thereby preventing an etchant from penetrating into a second portion of the patternable layer that still remains over the hardmask layer.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: July 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-Cheng Chou, Ying-Liang Chuang, Chun-Neng Lin, Ming-Hsi Yeh, Kuo-Bin Huang
  • Publication number: 20240250481
    Abstract: A connector assembly includes an electrical connector, a metal shielding cage, and a heat dissipation element. The electrical connector includes an insulating body and a number of conductive terminals configured to be mounted on a circuit board. The insulating body includes a mating slot. The metal shielding cage is shielded on a periphery of the electrical connector. The metal shielding cage includes a receiving chamber in communication with the mating slot. The receiving chamber and the mating slot are configured to receive a mating connector along a first direction. The first direction is perpendicular to the circuit board. The heat dissipation element is fixed to the metal shielding cage.
    Type: Application
    Filed: August 2, 2023
    Publication date: July 25, 2024
    Applicant: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: Bin HUANG, Qiongnan CHEN, Hongji CHEN, Chuanqi GONG
  • Publication number: 20240250478
    Abstract: A connector assembly includes an electrical connector and a metal shielding cage. The electrical connector includes an insulating body and a number of conductive terminals configured to be mounted to a circuit board. The insulating body includes a mating slot configured to receive a mating connector. The metal shielding cage is shielded on a periphery of the electrical connector. The metal shielding cage includes a receiving chamber in communication with the mating slot. The receiving chamber and the mating slot are configured to receive the mating connector along a first direction. The first direction is perpendicular to the circuit board. The metal shielding cage is provided with at least one fastening foot configured to be fixed to the circuit board.
    Type: Application
    Filed: August 2, 2023
    Publication date: July 25, 2024
    Applicant: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: Bin HUANG, Qiongnan CHEN, Hongji CHEN, Chuanqi GONG
  • Publication number: 20240250482
    Abstract: A connector assembly includes an electrical connector, a metal shielding cage, a circuit board and a heat dissipation element. The electrical connector includes an insulating body and a number of conductive terminals. The metal shielding cage includes a receiving chamber configured to receive a mating connector along a first direction. The first direction is perpendicular to the circuit board. The circuit board includes a heat dissipation slot. The heat dissipation element includes a heat sink mounted to the metal shielding cage. The heat sink corresponds to the heat dissipation slot along the first direction.
    Type: Application
    Filed: November 7, 2023
    Publication date: July 25, 2024
    Applicant: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: Bin HUANG, Hongji CHEN, Kunlin YAO, Chuanqi GONG, Chenhui ZENG
  • Publication number: 20240250458
    Abstract: A connector assembly includes an electrical connector, a metal shielding cage and a fastener. The electrical connector includes an insulating body and a number of conductive terminals. The insulating body includes a mounting surface configured to be mounted on a circuit board and a mating slot configured to receive a mating connector. The metal shielding cage is shielded on a periphery of the electrical connector. The metal shielding cage includes a receiving chamber in communication with the mating slot for receiving the mating connector. The fastener passes through the circuit board and is fastened to the electrical connector.
    Type: Application
    Filed: August 2, 2023
    Publication date: July 25, 2024
    Applicant: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: Bin HUANG, Qiongnan CHEN, Hongji CHEN, Chuanqi GONG
  • Publication number: 20240248266
    Abstract: A connector assembly includes an electrical connector, a metal shielding cage, a heat sink and a fastening member. The electrical connector includes an insulating body and a number of conductive terminals configured to be mounted on a circuit board. The insulating body includes a mating slot. The metal shielding cage is shielded on a periphery of the electrical connector. The metal shielding cage includes a receiving chamber in communication with the mating slot for receiving a mating connector along a first direction. The first direction is perpendicular to the circuit board. The heat sink is fixed to the metal shielding cage. The fastening member passes through the circuit board and is fastened to the heat sink.
    Type: Application
    Filed: August 2, 2023
    Publication date: July 25, 2024
    Applicant: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: Bin HUANG, Qiongnan CHEN, Hongji CHEN, Chuanqi GONG
  • Publication number: 20240250479
    Abstract: A connector assembly includes an electrical connector and a metal shielding cage. The electrical connector includes a first mating slot and a second mating slot. The metal shielding cage is shielded on a periphery of the electrical connector. The metal shielding cage includes a first receiving chamber and a second receiving chamber. The first receiving chamber and the first mating slot are in communication and configured to receive a first mating connector along a first direction. The second receiving chamber and the second mating slot are in communication and configured to receive a second mating connector along the first direction. The first mating connector and the second mating connector are arranged belly-to-belly reduce mutual interference.
    Type: Application
    Filed: August 2, 2023
    Publication date: July 25, 2024
    Applicant: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: Bin HUANG, Qiongnan CHEN, Hongji CHEN, Chuanqi GONG
  • Publication number: 20240250483
    Abstract: A connector assembly includes an electrical connector, a metal shielding cage, and a heat dissipation element. The electrical connector includes an insulating body and a number of conductive terminals configured to be mounted on a circuit board. The metal shielding cage is shielded on a periphery of the electrical connector. The metal shielding cage includes a receiving chamber configured to receive a mating connector along a first direction. The first direction is perpendicular to the circuit board. The heat dissipation element includes a first heat sink. The first heat sinks include a number of first heat dissipation fins and a number of first heat dissipation channels.
    Type: Application
    Filed: November 7, 2023
    Publication date: July 25, 2024
    Applicant: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: Bin HUANG, Hongji CHEN, Kunlin YAO, Chuanqi GONG, Chenhui ZENG