Patents by Inventor Bin Jian

Bin Jian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11229059
    Abstract: Embodiments of this application disclose a random access method. A base station determines that a detected first preamble value is a preamble value from a target terminal. The base station calculates a preamble offset and a time offset of the target terminal. The base station generates at least two random access response messages, where at least one of the at least two random access response messages includes a second preamble value and a second timing advance TA value, and at least one of the at least two random access response messages includes a third preamble value and a third TA value. The base station sends the at least two random access response messages to the target terminal.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: January 18, 2022
    Assignee: HUAWEI TECHNOLOGIES CO.. LTD.
    Inventors: Bin Jian, Pengfei Li
  • Patent number: 11089634
    Abstract: A random access method, base station, and terminal, where a base station detects a first preamble value, and generates at least two random access response messages based on the first preamble value. At least one random access response message includes a second preamble value, and at least one random access response message includes a third preamble value, where the second preamble value is the same as the first preamble value, and the third preamble value is a preamble value obtained after the base station adds a preset accumulation number to the first preamble value. The base station then sends the at least two random access response messages to a terminal.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: August 10, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jing Tu, Bin Jian, Pengfei Li
  • Publication number: 20200137805
    Abstract: A random access method, base station, and terminal, where a base station detects a first preamble value, and generates at least two random access response messages based on the first preamble value. At least one random access response message includes a second preamble value, and at least one random access response message includes a third preamble value, where the second preamble value is the same as the first preamble value, and the third preamble value is a preamble value obtained after the base station adds a preset accumulation number to the first preamble value. The base station then sends the at least two random access response messages to a terminal.
    Type: Application
    Filed: December 27, 2019
    Publication date: April 30, 2020
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jing TU, Bin JIAN, Pengfei LI
  • Publication number: 20200137804
    Abstract: Embodiments of this application disclose a random access method. A base station determines that a detected first preamble value is a preamble value from a target terminal. The base station calculates a preamble offset and a time offset of the target terminal. The base station generates at least two random access response messages, where at least one of the at least two random access response messages includes a second preamble value and a second timing advance TA value, and at least one of the at least two random access response messages includes a third preamble value and a third TA value. The base station sends the at least two random access response messages to the target terminal.
    Type: Application
    Filed: December 26, 2019
    Publication date: April 30, 2020
    Inventors: Bin JIAN, Pengfei LI
  • Patent number: 8153709
    Abstract: A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant, and a solvent. A halogen-free prepreg is also provided, including a glass fabric cloth and a halogen-free resin layer on the glass fabric. The halogen-free resin layer is made from the foregoing halogen-free resin.
    Type: Grant
    Filed: June 11, 2009
    Date of Patent: April 10, 2012
    Assignee: Iteq Corporation
    Inventors: Bin Jian, Li-Chun Chen
  • Patent number: 8058363
    Abstract: A varnish includes resin and composite curing agent. The composite curing agent includes curing agent of polyphenylene methylphosphonate resin and curing agent of phenol resin. Glass fabric cloth is dipped into the varnish so as to form a prepreg with better thermal stability, anti-flammability, and low absorbent ability. Furthermore, the composite curing agent can be provided for higher curing rate.
    Type: Grant
    Filed: April 9, 2009
    Date of Patent: November 15, 2011
    Assignee: ITEQ Corporation
    Inventors: Bin Jian, Li-Chun Chen
  • Patent number: 7955701
    Abstract: A composition for preparing a resin is provided. The composition includes a brominated epoxy resin, a urethane-modified copolyester, a curing agent and a solvent. A prepreg is also provided. The prepreg includes a glass fabric and a resin layer on the glass fabric. The resin layer is made from the foregoing resin.
    Type: Grant
    Filed: June 19, 2009
    Date of Patent: June 7, 2011
    Assignee: ITEQ Corporation
    Inventors: Bin Jian, Lai-Tu Liu
  • Publication number: 20100258339
    Abstract: A varnish includes resin and composite curing agent. The composite curing agent includes curing agent of polyphenylene methylphosphonate resin and curing agent of phenol resin. Glass fabric cloth is dipped into the varnish so as to form a prepreg with better thermal stability, anti-flammability, and low absorbent ability. Furthermore, the composite curing agent can be provided for higher curing rate.
    Type: Application
    Filed: April 9, 2009
    Publication date: October 14, 2010
    Inventors: Bin Jian, Li-chun Chen
  • Publication number: 20100159765
    Abstract: A composition for preparing a resin is provided. The composition includes a brominated epoxy resin, a urethane-modified copolyester, a curing agent and a solvent. A prepreg is also provided. The prepreg includes a glass fabric and a resin layer on the glass fabric. The resin layer is made from the foregoing resin.
    Type: Application
    Filed: June 19, 2009
    Publication date: June 24, 2010
    Applicant: ITEQ CORPORATION
    Inventors: Bin JIAN, Lai-Tu LIU
  • Publication number: 20100155123
    Abstract: A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant, and a solvent. A halogen-free prepreg is also provided, including a glass fabric cloth and a halogen-free resin layer on the glass fabric. The halogen-free resin layer is made from the foregoing halogen-free resin.
    Type: Application
    Filed: June 11, 2009
    Publication date: June 24, 2010
    Applicant: ITEQ CORPORATION
    Inventors: Bin JIAN, Li-Chun CHEN
  • Patent number: 6878504
    Abstract: A chemically-amplified resist composition is disclosed, which comprises a polymer of formula (I) below: wherein R1 is H, C1-C4 alkyl, or CF3; Q is C4-C12 cycloalkyl; R2 is H, C1-C4 alkyl, or CF3; R3 is C4-C12 branched or cyclic alkyl; and x+y+z equals to 1. The chemically-amplified resist compositions of the present invention not only can be applied maturely to general lithographic processes, especially to 193 nm lithographic process, but also have excellent photo-sensitivity, and can form a well-resolved pattern and profile.
    Type: Grant
    Filed: May 28, 2003
    Date of Patent: April 12, 2005
    Assignee: Everlight USA, Inc.
    Inventors: Chi-Sheng Chen, Chan-Chan Tsai, Bin Jian, Hsin-Ming Liao
  • Publication number: 20040241569
    Abstract: A chemically-amplified resist composition is disclosed, which comprises a polymer of formula (I) below: 1
    Type: Application
    Filed: May 28, 2003
    Publication date: December 2, 2004
    Applicant: Everlight USA, Inc.
    Inventors: Chi-Sheng Chen, Chan-Chan Tsai, Bin Jian, Hsin-Ming Liao