Patents by Inventor Bin Lin

Bin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250247765
    Abstract: The present disclosure is a novel utility of a software defined radio (SDR) based Distributed Antenna System (DAS) that is field reconfigurable and support multi-modulation schemes (modulation-independent), multi-carriers, multi-frequency bands and multi-channels. The present invention enables a high degree of flexibility to manage, control, enhance, facilitate the usage and performance of a distributed wireless network such as Flexible Simulcast, automatic traffic load-balancing, network and radio resource optimization, network calibration, autonomous/assisted commissioning, carrier pooling, automatic frequency selection, frequency carrier placement, traffic monitoring, traffic tagging, pilot beacon, etc. As a result, a DAS in accordance with the present invention can increase the efficiency and traffic capacity of the operators' wireless network.
    Type: Application
    Filed: January 18, 2025
    Publication date: July 31, 2025
    Inventors: Shawn Patrick Stapleton, Paul Lemson, Bin Lin, Albert S. Lee
  • Patent number: 12369094
    Abstract: The present disclosure is a novel utility of a software defined radio (SDR) based Distributed Antenna System (DAS) that is field reconfigurable and support multi-modulation schemes (modulation-independent), multi-carriers, multi-frequency bands and multi-channels. The present invention enables a high degree of flexibility to manage, control, enhance, facilitate the usage and performance of a distributed wireless network such as Flexible Simulcast, automatic traffic load-balancing, network and radio resource optimization, network calibration, autonomous/assisted commissioning, carrier pooling, automatic frequency selection, frequency carrier placement, traffic monitoring, traffic tagging, pilot beacon, etc. As a result, a DAS in accordance with the present invention can increase the efficiency and traffic capacity of the operators' wireless network.
    Type: Grant
    Filed: November 13, 2023
    Date of Patent: July 22, 2025
    Assignee: DALI WIRELESS, INC.
    Inventors: Shawn Patrick Stapleton, Paul Lemson, Bin Lin, Albert S. Lee
  • Publication number: 20250217339
    Abstract: In some examples, a database system includes processing modules with access to a remote object store and a local database storage associated with the database system. The processing modules perform a database operation that involves use of a plurality of instances of spool data. The processing modules store a first instance of spool data in the remote object store based on a first characteristic of the first instance of spool data, and the processing modules store a second instance of spool data in the local database storage based on a second characteristic of the second instance of spool data.
    Type: Application
    Filed: December 27, 2023
    Publication date: July 3, 2025
    Inventors: Pradeep Sridhar, Showvick Kalra, Bin Lin, Chad Brandon Seeraty, Bo Hao Tan
  • Publication number: 20250221033
    Abstract: A structure includes a bulk semiconductor substrate, a first plurality of dielectric isolation regions over the bulk semiconductor substrate, a plurality of semiconductor fins protruding higher than the first plurality of dielectric isolation regions, a first gate stack on top surfaces and sidewalls of the plurality of semiconductor fins, a second plurality of dielectric isolation regions over the bulk semiconductor substrate, a mesa structure in the second plurality of dielectric isolation regions, and a second gate stack over the mesa structure. Top surfaces of the first gate stack and the second gate stack are coplanar with each other.
    Type: Application
    Filed: March 19, 2025
    Publication date: July 3, 2025
    Inventors: Sung-Hsin Yang, Ru-Shang Hsiao, Ching-Hwanq Su, Chen-Bin Lin, Wen-Hsin Chan
  • Patent number: 12328842
    Abstract: Examples of the disclosure relate to an immersed liquid cooling apparatus and a liquid cooling system.
    Type: Grant
    Filed: June 21, 2024
    Date of Patent: June 10, 2025
    Assignee: Beijing Bytedance Network Technology Co., Ltd.
    Inventors: Jian Wang, Bin Lin, Zhichao Lv, Shifeng Wang, Yulong Wang, Ruidong Wang
  • Patent number: 12322849
    Abstract: Provided is a manufacturing method of a dielectric waveguide radio-frequency device, which relates to a manufacturing method of waveguide radio-frequency devices. The object of the present disclosure is to solve the issues of high costs, low processing efficiency, poor dimensional accuracy, poor surface quality, low device performance and inability to manufacture the ceramic waveguide radio-frequency devices in huge batches in the existing manufacturing method of the ceramic waveguide radio-frequency devices. The method includes: I. sectioning, II. slotting, III. processing tuning hole, IV. processing energy input hole, V. adhesive coating, stacking, VI. bonding, and VII. entire metallization, so as to obtain the dielectric waveguide radio-frequency device. In the present disclosure, more complex and diverse device topology structures can be manufactured, reducing the device manufacturing difficulty, and improving the accuracy allowance.
    Type: Grant
    Filed: May 21, 2024
    Date of Patent: June 3, 2025
    Assignee: TIANJIN UNIVERSITY
    Inventors: Bin Lin, Hetian Hou, Haoji Wang, Tianyi Sui
  • Publication number: 20250159930
    Abstract: Provided is a metal-oxide thin-film transistor. The metal-oxide thin-film transistor includes a gate, a gate insulation layer, a metal-oxide semiconductor layer, a source electrode, a drain electrode, and a passivation layer that are successively disposed on a base substrate; wherein the source electrode and the drain electrode are both in a stacked structure including a bulk metal layer and an electrode protection layer; wherein the electrode protection layer includes a metal or a metal alloy; the electrode protection layer is at least disposed between the metal-oxide semiconductor layer and the bulk metal layer; wherein a metal-oxide layer is disposed between the electrode protection layer and the bulk metal layer.
    Type: Application
    Filed: January 15, 2025
    Publication date: May 15, 2025
    Inventors: Bin LIN, Liangliang LI, Zheng LIU, Bo HU, Rui ZHANG, Xinlin PENG
  • Patent number: 12302535
    Abstract: The embodiments of the present disclosure provide a modular cooling device and a cooling system. The device includes: an air cooling box adapted to sealingly receive a predetermined number of electronic devices to be cooled; and a heat exchange unit coupled to the air cooling box and comprising: a housing sealingly enclosing a heat exchange chamber, the heat exchange chamber sealingly connecting with an interior of the air cooling box to allow air to circulate between the interior of the air cooling box and the heat exchange chamber as an effect of fans of the electronic devices; and a heat exchanger arranged in the heat exchange chamber and comprising paths for enabling circulating air to circulate; and a cooling interface at least partly arranged on the housing and adapted to allow a cooling medium to circulate between an external cold source and an interior of the heat exchanger.
    Type: Grant
    Filed: July 15, 2024
    Date of Patent: May 13, 2025
    Assignee: Beijing Bytedance Network Technology Co., Ltd.
    Inventors: Jian Wang, Bin Lin, Zhichao Lv, Shifeng Wang, Yulong Wang, Ruidong Wang
  • Patent number: 12283595
    Abstract: A structure includes a bulk semiconductor substrate, a first plurality of dielectric isolation regions over the bulk semiconductor substrate, a plurality of semiconductor fins protruding higher than the first plurality of dielectric isolation regions, a first gate stack on top surfaces and sidewalls of the plurality of semiconductor fins, a second plurality of dielectric isolation regions over the bulk semiconductor substrate, a mesa structure in the second plurality of dielectric isolation regions, and a second gate stack over the mesa structure. Top surfaces of the first gate stack and the second gate stack are coplanar with each other.
    Type: Grant
    Filed: March 17, 2022
    Date of Patent: April 22, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sung-Hsin Yang, Ru-Shang Hsiao, Ching-Hwanq Su, Chen-Bin Lin, Wen-Hsin Chan
  • Publication number: 20250123101
    Abstract: The present disclosure provides a device and a method for measuring levelness of a top cover of a reactor pressure vessel. The device includes a mounting and fixing mechanism, an inclination sensor mounting base, and an inclination sensor. The mounting and fixing mechanism includes a mounting bottom plate, and a fixing mechanism disposed on the mounting bottom plate. The inclination sensor mounting base includes a bearing plate located on the mounting bottom plate, and a portal frame disposed on the bearing plate and having a top surface. The inclination sensor is mounted on a sensor mounting surface of the bearing plate and located in the portal frame, and configured to obtain levelness of the sealing surface of the top cover by measuring levelness of the sensor mounting surface of the bearing plate.
    Type: Application
    Filed: December 19, 2024
    Publication date: April 17, 2025
    Inventors: Wenfa WANG, Heng PAN, Zhuangzhuang DONG, Pengfei ZHANG, Bin LIN, Ming LIU, Zhengdi YANG, Heng GAO, Tao LIU, Yongkang SHUAI
  • Patent number: 12276527
    Abstract: The present disclosure provides a device and a method for measuring levelness of a top cover of a reactor pressure vessel. The device includes a mounting and fixing mechanism, an inclination sensor mounting base, and an inclination sensor. The mounting and fixing mechanism includes a mounting bottom plate, and a fixing mechanism disposed on the mounting bottom plate. The inclination sensor mounting base includes a bearing plate located on the mounting bottom plate, and a portal frame disposed on the bearing plate and having a top surface. The inclination sensor is mounted on a sensor mounting surface of the bearing plate and located in the portal frame, and configured to obtain levelness of the sealing surface of the top cover by measuring levelness of the sensor mounting surface of the bearing plate.
    Type: Grant
    Filed: December 19, 2024
    Date of Patent: April 15, 2025
    Assignee: JIANGSU NUCLEAR POWER CORPORATION
    Inventors: Wenfa Wang, Heng Pan, Zhuangzhuang Dong, Pengfei Zhang, Bin Lin, Ming Liu, Zhengdi Yang, Heng Gao, Tao Liu, Yongkang Shuai
  • Patent number: 12261225
    Abstract: Provided is an oxide thin film transistor, including a gate, a gate insulator, a channel layer, a protective layer, and a source electrode and drain electrode layer that are disposed on a base substrate, wherein the source electrode and drain electrode layer includes a source electrode and a drain electrode that are spaced; and the protective layer is disposed between the channel layer and the source electrode and drain electrode layer, and is in contact with both the source electrode and drain electrode layer and the channel layer; an orthographic projection of the protective layer on the base substrate covers an orthographic projection of the channel layer on the base substrate; and the protective layer includes a first portion, a second portion, and a third portion that are in different areas of the protective layer.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: March 25, 2025
    Assignees: FUZHOU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Bin Lin, Zengrong Li, Hangle Guo, Zhenyou Zou, Liangliang Li, Fadian Le
  • Publication number: 20250063686
    Abstract: Provided in embodiments of the disclosure are an immersion-type liquid-cooling device and an immersion-type liquid-cooling system. The immersion-type liquid-cooling device comprises: a cooling tank adapted to accommodate a main cooling liquid in a sealed manner; a main heat dissipation apparatus attached to the cooling tank and comprising an inner cavity enclosed by a housing, and a main circulating component and heat exchanger accommodated in the inner cavity, wherein the inner cavity is in communication with the cooling tank in a sealed manner, and the main circulating component is adapted to circulate the main cooling liquid between the cooling tank and the exterior of the heat exchanger; and a cold source interface coupled to the main heat dissipation apparatus and configured to allow an auxiliary cooling liquid to circulate between an external cold source and the interior of the heat exchanger.
    Type: Application
    Filed: December 12, 2022
    Publication date: February 20, 2025
    Inventors: Jian WANG, Bin LIN, Zhichao LV, Shifeng WANG, Ruidong WANG
  • Patent number: 12210632
    Abstract: Examples described herein relate to a manner of provide a time of life of data. In some examples, data and control parameters are received from a data source. The data can be encrypted and stored. In addition, at least a portion of the control parameters can be stored into a distributed ledger. In some examples, the portion of the control parameters include an indicator of expiration time of the data. In some examples, a data header for the data is generated, where the data header includes an indication that the data is subject to a limited life span and a data identifier. The data header can be accessed with a request to access the encrypted data. In some examples, a request to determine if the data is valid and accessible is provided to a node of the distributed ledger and an indication of whether the data is valid and accessible is received from a node in the distributed ledger.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: January 28, 2025
    Assignee: Intel Corporation
    Inventors: Sundar Vedantham, Bin Lin, Pravin Pathak, Ximing Chen, Chris MacNamara
  • Patent number: 12205999
    Abstract: Provided is a metal-oxide thin-film transistor. The metal-oxide thin-film transistor includes a gate, a gate insulation layer, a metal-oxide semiconductor layer, a source electrode, a drain electrode, and a passivation layer that are successively disposed on a base substrate; wherein the source electrode and the drain electrode are both in a laminated structure, wherein the laminated structure of the source electrode or the drain electrode at least includes a bulk metal layer and an electrode protection layer; wherein the electrode protection layer includes a metal or a metal alloy; the electrode protection layer is at least disposed between the metal-oxide semiconductor layer and the bulk metal layer; wherein a metal-oxide layer is disposed between the electrode protection layer and the bulk metal layer.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: January 21, 2025
    Assignees: FUZHOU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Bin Lin, Liangliang Li, Zheng Liu, Bo Hu, Rui Zhang, Xinlin Peng
  • Publication number: 20250015091
    Abstract: Provided is an array substrate. The array substrate includes: a substrate, and a first electrode, a connecting electrode, and at least two insulating layers arranged on the substrate, wherein the first electrode is disposed on a side, proximal to the first electrode, of the at least two insulating layers, and the connecting electrode is disposed on a side, facing away from the substrate, of the at least two insulating layers; and at least two communicated vias are arranged in the at least two insulating layers, a size of a first via, most proximal to the substrate, in the at least two vias is less than sizes of other vias, and the connecting electrode is lapped with the first electrode via the at least two vias.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 9, 2025
    Applicants: Fuzhou BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Bin LIN, Yang WANG, Jinliang WANG, Qiming LI, Zhenyou ZOU, Zengrong LI
  • Patent number: D1068697
    Type: Grant
    Filed: December 11, 2024
    Date of Patent: April 1, 2025
    Inventor: Bin Lin
  • Patent number: D1068698
    Type: Grant
    Filed: December 11, 2024
    Date of Patent: April 1, 2025
    Inventor: Bin Lin
  • Patent number: D1068699
    Type: Grant
    Filed: December 11, 2024
    Date of Patent: April 1, 2025
    Inventor: Bin Lin
  • Patent number: D1068957
    Type: Grant
    Filed: December 18, 2024
    Date of Patent: April 1, 2025
    Inventor: Bin Lin