Patents by Inventor Bin Lin

Bin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12283595
    Abstract: A structure includes a bulk semiconductor substrate, a first plurality of dielectric isolation regions over the bulk semiconductor substrate, a plurality of semiconductor fins protruding higher than the first plurality of dielectric isolation regions, a first gate stack on top surfaces and sidewalls of the plurality of semiconductor fins, a second plurality of dielectric isolation regions over the bulk semiconductor substrate, a mesa structure in the second plurality of dielectric isolation regions, and a second gate stack over the mesa structure. Top surfaces of the first gate stack and the second gate stack are coplanar with each other.
    Type: Grant
    Filed: March 17, 2022
    Date of Patent: April 22, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sung-Hsin Yang, Ru-Shang Hsiao, Ching-Hwanq Su, Chen-Bin Lin, Wen-Hsin Chan
  • Publication number: 20250123101
    Abstract: The present disclosure provides a device and a method for measuring levelness of a top cover of a reactor pressure vessel. The device includes a mounting and fixing mechanism, an inclination sensor mounting base, and an inclination sensor. The mounting and fixing mechanism includes a mounting bottom plate, and a fixing mechanism disposed on the mounting bottom plate. The inclination sensor mounting base includes a bearing plate located on the mounting bottom plate, and a portal frame disposed on the bearing plate and having a top surface. The inclination sensor is mounted on a sensor mounting surface of the bearing plate and located in the portal frame, and configured to obtain levelness of the sealing surface of the top cover by measuring levelness of the sensor mounting surface of the bearing plate.
    Type: Application
    Filed: December 19, 2024
    Publication date: April 17, 2025
    Inventors: Wenfa WANG, Heng PAN, Zhuangzhuang DONG, Pengfei ZHANG, Bin LIN, Ming LIU, Zhengdi YANG, Heng GAO, Tao LIU, Yongkang SHUAI
  • Patent number: 12276527
    Abstract: The present disclosure provides a device and a method for measuring levelness of a top cover of a reactor pressure vessel. The device includes a mounting and fixing mechanism, an inclination sensor mounting base, and an inclination sensor. The mounting and fixing mechanism includes a mounting bottom plate, and a fixing mechanism disposed on the mounting bottom plate. The inclination sensor mounting base includes a bearing plate located on the mounting bottom plate, and a portal frame disposed on the bearing plate and having a top surface. The inclination sensor is mounted on a sensor mounting surface of the bearing plate and located in the portal frame, and configured to obtain levelness of the sealing surface of the top cover by measuring levelness of the sensor mounting surface of the bearing plate.
    Type: Grant
    Filed: December 19, 2024
    Date of Patent: April 15, 2025
    Assignee: JIANGSU NUCLEAR POWER CORPORATION
    Inventors: Wenfa Wang, Heng Pan, Zhuangzhuang Dong, Pengfei Zhang, Bin Lin, Ming Liu, Zhengdi Yang, Heng Gao, Tao Liu, Yongkang Shuai
  • Patent number: 12261225
    Abstract: Provided is an oxide thin film transistor, including a gate, a gate insulator, a channel layer, a protective layer, and a source electrode and drain electrode layer that are disposed on a base substrate, wherein the source electrode and drain electrode layer includes a source electrode and a drain electrode that are spaced; and the protective layer is disposed between the channel layer and the source electrode and drain electrode layer, and is in contact with both the source electrode and drain electrode layer and the channel layer; an orthographic projection of the protective layer on the base substrate covers an orthographic projection of the channel layer on the base substrate; and the protective layer includes a first portion, a second portion, and a third portion that are in different areas of the protective layer.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: March 25, 2025
    Assignees: FUZHOU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Bin Lin, Zengrong Li, Hangle Guo, Zhenyou Zou, Liangliang Li, Fadian Le
  • Publication number: 20250063686
    Abstract: Provided in embodiments of the disclosure are an immersion-type liquid-cooling device and an immersion-type liquid-cooling system. The immersion-type liquid-cooling device comprises: a cooling tank adapted to accommodate a main cooling liquid in a sealed manner; a main heat dissipation apparatus attached to the cooling tank and comprising an inner cavity enclosed by a housing, and a main circulating component and heat exchanger accommodated in the inner cavity, wherein the inner cavity is in communication with the cooling tank in a sealed manner, and the main circulating component is adapted to circulate the main cooling liquid between the cooling tank and the exterior of the heat exchanger; and a cold source interface coupled to the main heat dissipation apparatus and configured to allow an auxiliary cooling liquid to circulate between an external cold source and the interior of the heat exchanger.
    Type: Application
    Filed: December 12, 2022
    Publication date: February 20, 2025
    Inventors: Jian WANG, Bin LIN, Zhichao LV, Shifeng WANG, Ruidong WANG
  • Patent number: 12210632
    Abstract: Examples described herein relate to a manner of provide a time of life of data. In some examples, data and control parameters are received from a data source. The data can be encrypted and stored. In addition, at least a portion of the control parameters can be stored into a distributed ledger. In some examples, the portion of the control parameters include an indicator of expiration time of the data. In some examples, a data header for the data is generated, where the data header includes an indication that the data is subject to a limited life span and a data identifier. The data header can be accessed with a request to access the encrypted data. In some examples, a request to determine if the data is valid and accessible is provided to a node of the distributed ledger and an indication of whether the data is valid and accessible is received from a node in the distributed ledger.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: January 28, 2025
    Assignee: Intel Corporation
    Inventors: Sundar Vedantham, Bin Lin, Pravin Pathak, Ximing Chen, Chris MacNamara
  • Patent number: 12205999
    Abstract: Provided is a metal-oxide thin-film transistor. The metal-oxide thin-film transistor includes a gate, a gate insulation layer, a metal-oxide semiconductor layer, a source electrode, a drain electrode, and a passivation layer that are successively disposed on a base substrate; wherein the source electrode and the drain electrode are both in a laminated structure, wherein the laminated structure of the source electrode or the drain electrode at least includes a bulk metal layer and an electrode protection layer; wherein the electrode protection layer includes a metal or a metal alloy; the electrode protection layer is at least disposed between the metal-oxide semiconductor layer and the bulk metal layer; wherein a metal-oxide layer is disposed between the electrode protection layer and the bulk metal layer.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: January 21, 2025
    Assignees: FUZHOU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Bin Lin, Liangliang Li, Zheng Liu, Bo Hu, Rui Zhang, Xinlin Peng
  • Publication number: 20250015091
    Abstract: Provided is an array substrate. The array substrate includes: a substrate, and a first electrode, a connecting electrode, and at least two insulating layers arranged on the substrate, wherein the first electrode is disposed on a side, proximal to the first electrode, of the at least two insulating layers, and the connecting electrode is disposed on a side, facing away from the substrate, of the at least two insulating layers; and at least two communicated vias are arranged in the at least two insulating layers, a size of a first via, most proximal to the substrate, in the at least two vias is less than sizes of other vias, and the connecting electrode is lapped with the first electrode via the at least two vias.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 9, 2025
    Applicants: Fuzhou BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Bin LIN, Yang WANG, Jinliang WANG, Qiming LI, Zhenyou ZOU, Zengrong LI
  • Patent number: 12179737
    Abstract: An unmanned ground vehicle (UGV) includes one or more motors configured to drive one or more wheels of the UGV, an obstacle sensor, a memory storing instructions, and a processor coupled to the one or more motors, the obstacle sensor, and the memory. The processor is configured to execute the instructions to cause the UGV to obtain location information of multiple navigation points; calculate a navigation path based on the obtained location information; drive the one or more motors to navigate the UGV along the navigation path; detect, by the obstacle sensor, whether one or more obstacles exist while navigating the UGV, and if detected, determine location information of the one or more obstacles; and if the one or more obstacles are detected by the obstacle sensor, update the navigation path based on determined location information of the one or more obstacles.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: December 31, 2024
    Assignee: GEOSAT AEROSPACE & TECHNOLOGY
    Inventors: Hsin-Yuan Chen, Chien-Hung Liu, Wei-Hao Wang, Yi-Bin Lin, Yi-Chiang Yang
  • Publication number: 20240427206
    Abstract: Provided are a display substrate and a manufacturing method therefor, and a display device. The display substrate includes: a base substrate including a display area and a frame area located on at least one side of the display area; a plurality of shift registers arranged in cascade in the frame area; a plurality of jumper terminals located between the shift registers and the display area and including first jumper terminals and second jumper terminals; a plurality of transfer terminals located between the shift registers and the display area, and located on a side of the layer where the first jumper terminals are located away from the base substrate; and an insulating layer located in the display area and the frame area, located between a layer where the second jumper terminals are located and a layer where the plurality of transfer terminals are located, and including a channel.
    Type: Application
    Filed: March 23, 2022
    Publication date: December 26, 2024
    Inventors: Wenxing XI, Weiwang WANG, Zhenyou ZOU, Xue YU, Zhouyu CHEN, Chengjun LIU, Chenglong WU, Bin LIN
  • Publication number: 20240427399
    Abstract: The disclosed technology is directed to a computing device for detecting and preventing melting of a component of the computing device. In some examples, the computing device includes a cable that connects a power supply unit and an add-on card, and a thermal protection controller. Based on a sensor signal from a temperature sensor of the cable, the thermal protection controller determines that a temperature associated with the cable exceeds a threshold temperature. Responsive to determining that the temperature associated with the cable exceeds the threshold temperature, the thermal protection controller causes the power supply unit to cease supplying power to the add-on card by transmitting an overtemperature signal through the cable.
    Type: Application
    Filed: June 26, 2023
    Publication date: December 26, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Wen-Bin Lin, Chao-Wen Cheng, Cheng-Yi Yang, Chien-Wei Chen
  • Publication number: 20240419532
    Abstract: In some examples, a system detects disabling of a driver of a storage control feature included in a main processor of the system, where the storage control feature to manage access of a storage device. In response to detecting the disabling of the driver of the storage control feature included in the main processor, the system initiates a remediation action to prevent a fault in the system.
    Type: Application
    Filed: October 28, 2021
    Publication date: December 19, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Wen-Bin Lin, Chao-Wen Cheng, Chien-Cheng Su
  • Publication number: 20240385532
    Abstract: One or more images of a device feature are acquired using an imaging tool. A geometrical shape is defined encompassing the relevant pixels of each image, where the geometrical shape is represented in terms of one or more parameters. A cost function is defined whose variables comprise the one or more parameters of the geometrical shape. For each image, numerical optimization is applied to obtain optimal values of the one or more parameters for which the cost function is minimized. The optimal values of the one or more parameters are reported as metrology data pertaining to the device feature.
    Type: Application
    Filed: July 29, 2024
    Publication date: November 21, 2024
    Inventors: Waheb Bishara, Stephanie W. Chen, Bin Lin, Xinhuo Xiao
  • Publication number: 20240382416
    Abstract: A pharmaceutical composition for treating retinal degeneration is provided. Particularly, the pharmaceutical composition includes a tropomyosin 1 (TPM1) inhibitor and is further enriched with pharmaceutically acceptable additives. In addition, the pharmaceutical formulation is configured to suppress and/or knock down the expression and/or activity of TPM1, thereby addressing the molecular factors associated with retinal degeneration.
    Type: Application
    Filed: February 29, 2024
    Publication date: November 21, 2024
    Inventors: Rong LI, Bin LIN
  • Publication number: 20240385672
    Abstract: In example implementations, an apparatus is provided. The apparatus includes an expansion slot, a peripheral device connected to the expansion slot, and a processor communicatively coupled to the expansion slot. The processor is to determine that a compatibility of the peripheral device with active state power management (ASPM) is unknown, provide a notification to indicate that the compatibility of the peripheral device with ASPM is unknown, wherein the notification provides a selection between disabling ASPM for the peripheral device or enabling ASPM for the peripheral device, and configure a basic input/output system (BIOS) setting in accordance with the selection to control the ASPM for the peripheral device.
    Type: Application
    Filed: October 13, 2021
    Publication date: November 21, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Wen-Bin Lin, Chao-Wen Cheng, Chien-Cheng Su
  • Publication number: 20240381581
    Abstract: The embodiments of the present disclosure provide a modular cooling device and a cooling system. The device includes: an air cooling box adapted to sealingly receive a predetermined number of electronic devices to be cooled; and a heat exchange unit coupled to the air cooling box and comprising: a housing sealingly enclosing a heat exchange chamber, the heat exchange chamber sealingly connecting with an interior of the air cooling box to allow air to circulate between the interior of the air cooling box and the heat exchange chamber as an effect of fans of the electronic devices; and a heat exchanger arranged in the heat exchange chamber and comprising paths for enabling circulating air to circulate; and a cooling interface at least partly arranged on the housing and adapted to allow a cooling medium to circulate between an external cold source and an interior of the heat exchanger.
    Type: Application
    Filed: July 15, 2024
    Publication date: November 14, 2024
    Inventors: Jian WANG, Bin LIN, Zhichao LV, Shifeng WANG, Yulong WANG, Ruidong WANG
  • Patent number: D1068697
    Type: Grant
    Filed: December 11, 2024
    Date of Patent: April 1, 2025
    Inventor: Bin Lin
  • Patent number: D1068698
    Type: Grant
    Filed: December 11, 2024
    Date of Patent: April 1, 2025
    Inventor: Bin Lin
  • Patent number: D1068699
    Type: Grant
    Filed: December 11, 2024
    Date of Patent: April 1, 2025
    Inventor: Bin Lin
  • Patent number: D1068957
    Type: Grant
    Filed: December 18, 2024
    Date of Patent: April 1, 2025
    Inventor: Bin Lin