Patents by Inventor Bin Luo

Bin Luo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220404039
    Abstract: Disclosed are a heat exchanger fin, a heat exchanger, an indoor unit and an air conditioner. The heat exchanger fin includes a fin body, and the fin body includes an air outlet contour line arranged on one side and an air inlet contour line arranged on the other side; refrigerant pipe mounting holes are provided in the fin body; and on a straight line where the curvature radius of the air outlet contour line of the fin body is located, or on a straight line where the curvature radius of the air inlet contour line of the fin body is located, the distance between the air inlet contour line and the air outlet contour line of the fin body is gradually reduced from the middle to two ends of the heat exchanger fin.
    Type: Application
    Filed: March 2, 2020
    Publication date: December 22, 2022
    Inventors: Baisong ZHOU, Bin LUO, Feng LI, Zhaohui LI, Kun YANG, Lin WU
  • Publication number: 20220382991
    Abstract: The present disclosure provides a training method and apparatus for a document processing model, a device, a storage medium and a program, which relate to the field of artificial intelligence, and in particular, to technologies such as deep learning, natural language processing and text recognition. The specific implementation is: acquiring a first sample document; determining element features of a plurality of document elements in the first sample document and positions corresponding to M position types of each document element according to the first sample document; where the document element corresponds to a character or a document area in the first sample document; and performing training on a basic model according to the element features of the plurality of document elements and the positions corresponding to the M position types of each document element to obtain the document processing model.
    Type: Application
    Filed: August 9, 2022
    Publication date: December 1, 2022
    Inventors: Qiming PENG, Bin LUO, Yuhui CAO, Shikun FENG, Yongfeng CHEN
  • Publication number: 20220318076
    Abstract: An application sharing method, a first electronic device, and a computer-readable storage medium are provided.
    Type: Application
    Filed: June 24, 2022
    Publication date: October 6, 2022
    Applicant: VIVO MOBILE COMMUNICATION CO., LTD.
    Inventor: Bin LUO
  • Publication number: 20220320384
    Abstract: A light-emitting device is applicable to a backlight module. The light-emitting device includes a substrate, a light-emitting diode (LED) and an encapsulation body. The encapsulation body is on the substrate and covers the LED. The encapsulation body includes a base and a lens. The base has a base surface. The lens has a lens surface. The lens surface conforms to a cubic Bezier curve. The cubic Bezier curve has a start point and an end point. The start point of the cubic Bezier curve is at the base surface. The end point of the cubic Bezier curve corresponds to the center of the LED. The lens surface is provided with a concave portion at the end point. The lens increases the light-emitting angle of the LED, so that the spacing between light-emitting devices can be increased, thereby reducing the number of light-emitting devices to be used and the costs.
    Type: Application
    Filed: June 8, 2021
    Publication date: October 6, 2022
    Inventors: Bin LUO, Rui-Hua WANG, Chih-Chou CHOU
  • Publication number: 20220301835
    Abstract: Plasma viewports for high-temperature environments in semiconductor processing equipment are disclosed; such view-ports may use a triple-window design, with each window providing particular functionality.
    Type: Application
    Filed: August 21, 2020
    Publication date: September 22, 2022
    Inventors: Bin Luo, Andrew H. Breninger, John Michael Wiltse, Brian Lewis Ratliff, David James Shusteric
  • Patent number: 11449453
    Abstract: A multi-package system includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first die and a second die. The second semiconductor package includes a third die. A first processing circuit of the first die communicates with a second processing circuit of the second die through a first configurable input/output (IO) interface circuit of the first die and a third configurable IO interface circuit of the second die that are configured to perform single-ended intra-package communication. The first processing circuit of the first die communicates with a third processing circuit of the third die through a second configurable IO interface circuit of the first die and a fourth configurable IO interface circuit of the third die that are configured to perform differential inter-package communication. The first configurable IO interface circuit and the second configurable IO interface circuit have a same circuit design.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: September 20, 2022
    Assignee: MEDIATEK INC.
    Inventors: Chun-Yuan Yeh, Yan-Bin Luo, Tse-Hsiang Hsu
  • Publication number: 20220282377
    Abstract: Showerheads for semiconductor processing equipment are disclosed that include various features designed to promote thermal control of the showerhead in high-temperature applications.
    Type: Application
    Filed: August 21, 2020
    Publication date: September 8, 2022
    Inventors: Bin Luo, Timothy Scott Thomas, Matthew B. Schick, John Michael Wiltse, Sean M. Donnelly, Michael John Selep
  • Publication number: 20220232726
    Abstract: A power distribution system is provided in this application, which includes a plurality of power distribution equipments, and the plurality of power distribution equipments are configured to supply power to a plurality of powered devices respectively. First power distribution equipment in the plurality of power distribution equipments includes: a first power module, configured to perform voltage conversion on an input voltage to obtain an output voltage, where the output voltage is a supply voltage of the first power distribution equipment; and a first cascading circuit, configured to connect an output of the first power module to an output of a power module in power distribution equipment in the power distribution system other than the first power distribution equipment, where the first power distribution equipment is any power distribution equipment in the power distribution system. A server system which includes the power distribution system is also disclosed in this application.
    Type: Application
    Filed: January 19, 2022
    Publication date: July 21, 2022
    Inventors: Zhen QIN, Chen ZHANG, Bin LUO
  • Publication number: 20220205667
    Abstract: Provided in the present application are a control system of an air conditioner and an air-conditioning device. The control system of the air conditioner comprises: a main machine control assembly receiving a feedback parameter of a main machine, to adjust, according to the feedback parameter, a water discharge temperature of the main machine; a water pump control assembly, and the water pump control assembly is in communication with the main machine control assembly, to adjust, according to a feedback parameter of the water pump, an operating parameter of a water pump; a cooling tower control assembly, and the cooling tower control assembly is connected to the water pump control assembly, to adjust, according to an environment parameter and a target water discharge temperature, the current water discharge temperature of a cooling tower; and a tail end control assembly.
    Type: Application
    Filed: March 19, 2020
    Publication date: June 30, 2022
    Inventors: Yuanyang LI, Jie YAN, Rui LIANG, Bin LUO
  • Patent number: 11336554
    Abstract: The invention relates to a universal semiconductor automatic high-speed serial signal testing method, comprising: a chip to be tested sending, to an impedance matching unit, a high-speed serial signal; then by means of a phase shift unit, sequentially transforming, according to a set fixed resolution, the phase of the high-speed serial signal, the magnitude of each offset phase being determined by a phase shift control signal outputted by a control unit and the resolution of the phase shift unit; after passing through the phase shift unit, the high-speed serial signal keeps channel impedance matching by means of the impedance matching unit; the signal entering an acquisition unit, and being acquired under the action of an acquisition control signal sent by the control unit; the control unit performing signal exchange with semiconductor automatic testing equipment (ATE); and the acquisition unit transmitting the acquired signal back to the universal semiconductor ATE for algorithm operation, and then the actua
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: May 17, 2022
    Assignee: SINO IC TECHNOLOGY CO., LTD.
    Inventors: Kun Yu, Zhiyong Zhang, Hua Wang, Jianhua Qi, Bin Luo
  • Patent number: 11326812
    Abstract: A heat pump system and a control method therefor are provided. The heat pump system includes an outdoor heat exchanger and an electromagnetic heating assembly. The electromagnetic heating assembly includes an induction heating sheet, an insulation plate, and an electromagnetic induction wire coil. The induction heating sheet is in contact with the outdoor heat exchanger, the electromagnetic induction wire coil is attached to the insulation plate, the insulation plate is connected to the outdoor heat exchanger or the induction heating sheet, the induction heating sheet is coupled with the electromagnetic induction wire coil by communication.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: May 10, 2022
    Assignees: HEFEI MIDEA HEATING & VENTILATING EQUIPMENT CO., LTD., GD MIDEA HEATING & VENTILATING EQUIPMENT CO., LTD.
    Inventors: Bin Luo, Yuanyang Li, Shuqing Liu, Kun Yang, Lei Zhan
  • Publication number: 20220114925
    Abstract: The present invention relates generally to an LED sign system use on roadways, and more particularly to a LED sign system for use on roadways with a redundant controller.
    Type: Application
    Filed: October 5, 2021
    Publication date: April 14, 2022
    Applicant: Ledstar Inc.
    Inventors: Milan Patel, Andrey Burak, Bin Luo
  • Publication number: 20220077897
    Abstract: An antenna selection method and a terminal, where the terminal includes m primary antennas configured for a first application program and n secondary antennas, where m?1, and n?1. The method includes, when the terminal is in a WI-FI connected state and a landscape state, obtaining a key factor and a radio frequency indicator that are of each of m+n antenna combinations, determining a first antenna combination based on the key factor and the radio frequency indicator, where the first antenna combination is a first-priority antenna combination of the m+n antenna combinations, and the first antenna combination includes at least one of the secondary antennas, and using the first antenna combination to perform communication for a second application program.
    Type: Application
    Filed: December 20, 2018
    Publication date: March 10, 2022
    Inventors: Jie Song, Yuan-Hao Lan, Yuanpeng Li, Xinli Zhang, Tongbo Wang, Ji Ding, Bin Luo
  • Publication number: 20210400579
    Abstract: A data processing method includes obtaining a first network wakeup parameter, where the first network wakeup parameter is used to wake up an application program. The data processing method further includes performing reconfiguration processing on the first network wakeup parameter based on a preset first configuration condition to obtain a second network wakeup parameter, and configuring a driver of the terminal based on the second network wakeup parameter. The second network wakeup parameter is written into Wi-Fi firmware so that the Wi-Fi firmware directly performs processing without waking up the application program when the first network wakeup parameter is received next time.
    Type: Application
    Filed: June 28, 2021
    Publication date: December 23, 2021
    Inventors: Peng Feng, Bin Luo
  • Publication number: 20210364206
    Abstract: A heat pump system (100) and an air conditioner are provided. The heat pump system (100) includes a compressor assembly (10), an outdoor heat exchanger (20), an indoor heat exchanger (30), a heating and heat accumulation device (50) and a switching device (40). The heating and heat accumulation device (50) is connected in series with the switching device (40). In the first heating mode, a refrigerant discharged out of the compressor assembly (10) enters the indoor heat exchanger (30) and the outdoor heat exchanger (20) in sequence after passing through the switching device (40) and the heating and heat accumulation device (50). In the defrosting mode, the refrigerant discharged out of the compressor assembly (10) enters the indoor heat exchanger (30), the outdoor heat exchanger (20) and the heating and heat accumulation device (50) in sequence after passing through the switching device (40).
    Type: Application
    Filed: May 30, 2019
    Publication date: November 25, 2021
    Inventors: Bin LUO, Kun YANG, Lei ZHAN, Shuqing LIU, Zhijun TAN
  • Patent number: 11171410
    Abstract: Embodiments of wireless audio systems and methods for wirelessly communicating audio information are disclosed herein. In one example, wireless transceiver includes a first antenna, a second antenna, and a radio frequency (RF) module. The first antenna and second antenna are configured to establish communication links with an audio source and another wireless transceiver. The RF module is configured to receive audio information from the audio source based on a first communication link using the first antenna and the second antenna and receive audio play information from the another wireless transceiver based on a second communication link using the first antenna and the second antenna. A data transmission proportion of the first communication link allocated between the first antenna and the second antenna is dynamically adjusted based on qualities of data communicated by the first antenna and the second antenna through the first transmission link.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: November 9, 2021
    Assignee: BESTECHNIC (SHANGHAI) CO., LTD.
    Inventors: Weifeng Tong, Liang Zhang, Bin Luo, Fei Luo
  • Publication number: 20210326292
    Abstract: A multi-package system includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first die and a second die. The second semiconductor package includes a third die. A first processing circuit of the first die communicates with a second processing circuit of the second die through a first configurable input/output (IO) interface circuit of the first die and a third configurable IO interface circuit of the second die that are configured to perform single-ended intra-package communication. The first processing circuit of the first die communicates with a third processing circuit of the third die through a second configurable IO interface circuit of the first die and a fourth configurable IO interface circuit of the third die that are configured to perform differential inter-package communication. The first configurable IO interface circuit and the second configurable IO interface circuit have a same circuit design.
    Type: Application
    Filed: February 2, 2021
    Publication date: October 21, 2021
    Inventors: Chun-Yuan Yeh, Yan-Bin Luo, Tse-Hsiang Hsu
  • Patent number: 11099430
    Abstract: A backlight module includes a light guide panel and a backlight source, which emits light entering the light guide panel via a light receiving surface on a side of the light guide panel. The backlight source includes a base plate and a plurality of light source holders disposed on the base plate. The light source holder includes a circuit substrate having an opening and a base surface. The base surface and the opening are transitionally connected by a curved surface.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: August 24, 2021
    Assignee: Wistron Corporation
    Inventors: Bin Luo, Chih-Chou Chou, Wei-Chia Huang, Zhi-Yi Liang
  • Patent number: 11086408
    Abstract: A keypad is provided in the present invention. The keypad includes a keypad shell and a keypad circuit board provided within the keypad shell. The keypad shell is provided with at least two subscriber identity module (SIM) card sockets and a first communication module connected to the SIM card sockets and configured to access the Internet. A SIM card switch is provided between the first communication module and the SIM card sockets. Compared to the prior art, the present invention enables, by means of providing the keypad with the at least two SIM card sockets and the first communication module supporting all major operators, the keypad to access the Internet when connected to a mobile terminal, and ensures uninterrupted Internet data access by switching to a SIM card of a different operator when the SIM card of the current operator has weak reception.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: August 10, 2021
    Assignee: HuiZhou TCL Mobile Communication Co., Ltd.
    Inventors: Zhuwei Qiu, Bin Luo, Xu Wang, Fan Huang, Xingchun Chen, Shengfang Qiu, Yong Zeng
  • Patent number: D956705
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: July 5, 2022
    Assignee: Lam Research Corporation
    Inventors: Bin Luo, Damien Slevin, Allan Matthew Jones