Patents by Inventor Bin Qu

Bin Qu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240309068
    Abstract: The present disclosure provides a recombinant adeno-associated vector comprising a codon-optimized sequence encoding CYP4V2 linked to selected gene expression regulatory sequences and its use in treating Bietti Crystalline Dystrophy (BCD).
    Type: Application
    Filed: January 11, 2024
    Publication date: September 19, 2024
    Applicant: SHANGHAI VITALGEN BIOPHARMA CO., LTD.
    Inventors: Lu GUO, Yezheng TAO, Shin-Shay TIAN, Bin QU, Wei LI, Xi ZHU, Xiaoping ZHAO
  • Patent number: 11428439
    Abstract: A tile or plate, includes: an upper plate (3) and a lower plate (4); wherein a plurality of heat conducting cavities (6) are uniformly provided between the upper plate (3) and the lower plate (4) via connecting ribs (5). A solar collection layer is provided on an upper surface of the tile or the plate. Two ends of the tile or the plate are connected with each of the plurality of the heat conducting cavities (6) via transverse connecting pipes (23, 37, 42). The transverse connecting pipes (23, 37, 42) of two neighboring tiles are connected by a ferrule (17) or a hose (36) to form an integrated circulation system. The tile or plate has a large day-lighting area and a high energy conversion rate.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: August 30, 2022
    Assignee: BEIJING WADENER TECHNOLOGY CO. LTD
    Inventors: Yunliang Qu, Jian Cui, Zhixiang Ying, Fang Shen, Bin Qu, Xinrong Wang, Chen Zhang, Xiangdong Li, Hongxing Wang
  • Publication number: 20210167584
    Abstract: A GIS mechanical fault diagnosis method and the device are disclosed. The method includes: collecting vibration signals to be measured of various excitation sources of GIS in mechanical operation; performing wavelet packet-feature entropy vector extraction on the vibration signals to be measured, when it is determined that the vibration signals to be measured are abnormal according to standard vibration signals in the normal state; inputting the extracted wavelet packet-feature entropy vectors into the pre-trained BP neural network for GIS mechanical fault identification, and outputting the corresponding fault. The disclosure integrates the vibration signals under the action of various excitation sources, extracts the feature entropy vectors according to the entropy theory, and constructs and trains a BP neural network that can classify and recognize various GIS mechanical faults, so as to perform comprehensive and effective GIS mechanical faults diagnose.
    Type: Application
    Filed: December 9, 2020
    Publication date: June 3, 2021
    Inventors: Bin Qu, Li Zhang, Rong Chen, Liansheng Zhou, Zhiyong Gan, Chi Zhang, Guohao Li, Jin He, Kun Wang, Ziyue Wang, Jian Wang, Wei Fan
  • Patent number: 10977761
    Abstract: This application relates to the field of digital watermark technologies and discloses a digital watermark embedding method and extraction method, a digital watermark embedding apparatus and extraction apparatus, and a digital watermark system. The method includes obtaining a digital watermark of a composite file, splitting the digital watermark into N sub-watermarks according to a carrier quantity N of the composite file, each sub-watermark being corresponding to partial content of the digital watermark, embedding an ith sub-watermark in an ith carrier of the composite file, to obtain an ith target carrier, and integrating N target carriers into a target file. This application resolves a problem in the related technology that a digital watermark technology cannot ensure integrity of an order file, and protects carriers of a composite file, thereby ensuring security and integrity of the composite file.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: April 13, 2021
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: He Wang Zhong, Liang Sun, Zheng Bin Qu, Da Yi Huang, You Shan Yang
  • Publication number: 20190236747
    Abstract: This application relates to the field of digital watermark technologies and discloses a digital watermark embedding method and extraction method, a digital watermark embedding apparatus and extraction apparatus, and a digital watermark system. The method includes obtaining a digital watermark of a composite file, splitting the digital watermark into N sub-watermarks according to a carrier quantity N of the composite file, each sub-watermark being corresponding to partial content of the digital watermark, embedding an ith sub-watermark in an ith carrier of the composite file, to obtain an ith target carrier, and integrating N target carriers into a target file. This application resolves a problem in the related technology that a digital watermark technology cannot ensure integrity of an order file, and protects carriers of a composite file, thereby ensuring security and integrity of the composite file.
    Type: Application
    Filed: April 8, 2019
    Publication date: August 1, 2019
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: He Wang Zhong, Liang Sun, Zheng Bin Qu, Da Yi Huang, You Shan Yang
  • Publication number: 20170108243
    Abstract: A tile or plate, includes: an upper plate (3) and a lower plate (4); wherein a plurality of heat conducting cavities (6) are uniformly provided between the upper plate (3) and the lower plate (4) via connecting ribs (5). A solar collection layer is provided on an upper surface of the tile or the plate. Two ends of the tile or the plate are connected with each of the plurality of the heat conducting cavities (6) via transverse connecting pipes (23, 37, 42). The transverse connecting pipes (23, 37, 42) of two neighboring tiles are connected by a ferrule (17) or a hose (36) to form an integrated circulation system. The tile or plate has a large day-lighting area and a high energy conversion rate.
    Type: Application
    Filed: July 24, 2014
    Publication date: April 20, 2017
    Inventors: Yunliang Qu, Jian Cui, Zhixiang Ying, Fang Shen, Bin Qu, Xinrong Wang, Chen Zhang, Xiangdong Li, Hongxing Wang
  • Patent number: 8288860
    Abstract: An integrated circuit package system includes: providing a base package of an elongated rectangular-box shape containing first electrical circuitry and including: forming a rectangular contact strip on and adjacent to a first end of the base package; and forming a base contact pad on and adjacent to a second end of the base package for connection to an electrical interconnect.
    Type: Grant
    Filed: September 9, 2008
    Date of Patent: October 16, 2012
    Assignee: Stats Chippac Ltd.
    Inventors: Chee Keong Chin, Yu Feng Feng, Wen Bin Qu
  • Publication number: 20090072378
    Abstract: An integrated circuit package system includes: providing a base package of an elongated rectangular-box shape containing first electrical circuitry and including: forming a rectangular contact strip on and adjacent to a first end of the base package; and forming a base contact pad on and adjacent to a second end of the base package for connection to an electrical interconnect.
    Type: Application
    Filed: September 9, 2008
    Publication date: March 19, 2009
    Inventors: Chee Keong Chin, Yu Feng Feng, Wen Bin Qu