Patents by Inventor Bin-Yuan Lin

Bin-Yuan Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6280907
    Abstract: A process is disclosed for forming resistors on a printed circuit substrate. The method includes the step of applying a photoresist layer onto substrate, and forming openings in the photoresist layer to expose the preselected regions for resistors, such that polymer thick resist pastes as well as resistive metallic films can be applied onto the substrate through these openings with precise geometry. The process according to the invention has higher accuracy and greater processing flexibility than the prior art processes where the resistor pastes are directly applied onto the substrate by screen printing.
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: August 28, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Chia-Tin Chung, Bin-Yuan Lin, Wun-Ku Wang, Wei-Chun Yang, Hsin-Herng Wang, Te-Yeu Su
  • Patent number: 6114433
    Abstract: A novel PTC conductive polymer composition is disclosed, which comprises (a) 35 to 60%, by weight of the composition, of a branched polyolefin with a polydispersity index of less than 2.5; and (b) 20 to 45%, by weight of the composition, of conductive particles which have been dispersed in the polyolefin. The PTC composition of the invention has intense, reproducible PTC behavior and is particularly suitable for use in PTC thermistors.
    Type: Grant
    Filed: August 11, 1998
    Date of Patent: September 5, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Chia-Tin Chung, Bin-Yuan Lin, Hsin-Herng Wang, Hsiao-Pin Huang
  • Patent number: 6072001
    Abstract: The present invention uses high molecular weight polyethene glycol copolymer with high antistatic property, and other solubilizer agent to proceed blending and enhancing the co-solublization property of the polyamide. The long-term antistatic plastic particles obtained by blending the modified antistatic composition and the polyamide material are made into different articles according to various composites. The molded articles are divided into three types: (1) an antistatic polyamide article with surface resistance of about 10.sup.10 -10.sup.11 (.OMEGA./sq.), and the dissipation time of electrostatic charge is less than 1.5 sec; (2) an antistatic polyamide fiber with surface resistance of about 6.times.l0.sup.10 -1.2.times.10.sup.12 (.OMEGA./sq.), and the dissipation time of electrostatic charge is less than 60 sec; (3) a polishing resistant antistatic polyamide with surface resistance of about 10.sup.10 -10.sup.11 (.OMEGA./sq.), and the dissipation time of electrostatic charge is less than 1.5 sec.
    Type: Grant
    Filed: January 27, 1998
    Date of Patent: June 6, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Hsin-Herng Wang, Bin-Yuan Lin
  • Patent number: 6030553
    Abstract: Polymer thick film resistor pastes with dimensionally stability and excellent processibility, such as coating, printing, and extruding, are disclosed. The resistor paste composition in accordance with the present invention comprises a low-k cycloaliphatic epoxy resin vehicle loaded with electrically conductive particles, a cationic photoinitiator, a thermal catalyst, and optionally a reactive diluent.
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: February 29, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Hui-min Huang, Chia-Tin Chung, Bin-Yuan Lin, Hsin-Herng Wang, Wun-Ku Wang, Te-Yeu Su, Su-Jen Chang
  • Patent number: 5712043
    Abstract: Laminar articles having improved barrier properties to organic solvents and gases, fabricated directly from polyolefin and modified polyamide, are disclosed. The modified polyamide is a blend of 97-40 wt % polyamide and 3-60 wt % of compatabilizer which is a polyether ester amide block copolymer or a mixture of the block copolymer and alkylcarboxyl-substituted polyolefin.
    Type: Grant
    Filed: June 26, 1995
    Date of Patent: January 27, 1998
    Assignee: Industrial Technology Research Institute
    Inventors: Wen-Jer Chen, Hsin-Herng Wang, Der-Tarng Su, Bin-Yuan Lin, Hsien-Mhing Chen
  • Patent number: 5340861
    Abstract: A rapidly crystallizing polyphenylene sulfide composition for reducing duration of injection molding cycle which comprises (a) a polyphenylene sulfide represented by the formula: ##STR1## and (b) an organometallic compound represented by the formula:R'--O--M--(Q--R").sub.3wherein M is either titanium or zirconium; R' is a substituted or un-substituted alkyl group having a carbon number of 1 to 30; Q is an SO.sub.3 group and R" is an alkyl group having a carbon number of 1 to 25, or an aryl-alkyl group represented by the following formula: ##STR2## wherein R is an alkyl group having a carbon number of 1 to 25.
    Type: Grant
    Filed: May 3, 1993
    Date of Patent: August 23, 1994
    Assignee: Industrial Technology Research Institute
    Inventors: Chi-Hwang Chen, Chih-Cheng Chiang, Bin-Yuan Lin, Rong-Hwa Chang