Abstract: A semiconductor device includes a substrate, a metal layer formed on the substrate, a dielectric layer formed on the substrate and covering the metal layer, a first contact hole formed in the dielectric layer, a conductive layer filled in the first contact hole, a thin film resistor layer formed on a portion of the dielectric layer, and a cover layer located on the thin film resistor layer. A bottom of the first contact hole exposes a surface of the metal layer. A bottom of the thin film resistor layer contacts a top surface of the conductive layer.

Abstract: A liquid crystal display, including a transparent region, a light shielding region, and a display region. The liquid crystal display includes a liquid crystal box, a lower polarizer, and a backlight module that are sequentially disposed in a stacked manner. A part of the liquid crystal box is located in the transparent region and is configured to allow visible light to pass through, a part of the liquid crystal box is located in the light shielding region and is configured to shield visible light, and a part of the liquid crystal box is located in the display region and is configured to display an image.

Abstract: A liquid crystal display, including a transparent region, a light shielding region, and a display region. The liquid crystal display includes a liquid crystal box, a lower polarizer, and a backlight module that are sequentially disposed in a stacked manner. A part of the liquid crystal box is located in the transparent region and is configured to allow visible light to pass through, a part of the liquid crystal box is located in the light shielding region and is configured to shield visible light, and a part of the liquid crystal box is located in the display region and is configured to display an image.

Abstract: It is provided an electrolysis and grinding combined machining device and method. The device includes a machine tool bed, a vertical moving mechanism and a horizontal moving mechanism which are provided on the machine tool bed. An electrode clamping device is provided on the vertical moving mechanism, and the electrode clamping device is configured to fix a tool electrode. An electrolysis tank is provided on the horizontal moving mechanism. A workpiece to be machined is placed in the electrolysis tank. The tool electrode includes a metal wire and abrasive materials distributed on a surface of the metal wire. The tool electrode and the workpiece to be machined are electrically connected with a pulse power source. A current sensor is arranged between the workpiece and the pulse power source. A data acquisition card is connected to the current sensor; the data acquisition card is electrically connected with an industrial personal computer.