Patents by Inventor Binbin XIONG

Binbin XIONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220402074
    Abstract: The present disclosure discloses a laser cutting method, which relates to the technical field of laser cutting. The laser cutting method first removes the active material on the surface of a preset position of a to-be-cut part; and then performs the laser cutting on the to-be-cut part at the preset position to cut off the to-be-cut part. Compared with the prior art, since the laser cutting method provided by the present disclosure performs the step of removing the active material on the surface of the preset position of the to-be-cut part, the quality of the to-be-cut part can be guaranteed, the occurrence of material splashing can be avoided, the steps are simple, and the cutting efficiency is higher.
    Type: Application
    Filed: May 10, 2022
    Publication date: December 22, 2022
    Applicant: SHENZHEN GEESUN INTELLIGENT TECHNOLOGY CO., LTD.
    Inventors: Xiaoping LI, Xueke WU, Binbin XIONG, Rukun YANG