Abstract: The present embodiments relate generally to ultrasound apparatus with improved heat dissipation and methods for providing same. The ultrasound apparatus may have a housing that encloses a transducer array and at least one integrated circuit (IC) for driving the transducer array during operation. The housing may have an interior surface and an exterior surface, and the housing can be made substantially of metal. A post is disposed between the at least one IC and the interior surface of the housing. The post can be coupled directly to the interior surface of the housing so that heat generated from the at least one IC is transferred via the post to the housing and dissipated via the exterior surface.