Abstract: Embodiments of the disclosure provide a cooling system including an air cooling part including a first cooler and a first circulation pipeline, the first cooler being configured to cool a coolant inside it with an external liquid, and the first circulation pipeline including a first liquid outlet pipe and a first liquid return pipe; a liquid cooling part including a second cooler and a second circulation pipeline, the second cooler being configured to cool a coolant inside it with an external gas, and the second circulation pipeline including a second liquid outlet pipe and a second liquid return pipe; and a guide assembly connected between the first circulation pipeline and the second circulation pipeline.

Abstract: A control method includes receiving chilling unit operating state data, determining a target chilling unit to be started up by polling through at least one of timing polling or fault polling, and replacing an operating chilling unit based on the target chilling unit.

Abstract: A system for utilizing waste heat of data center, which includes a first heat exchange module, a second heat exchange module, a heat storage and extraction flow path, a heat supply flow path and a buried pipe; both the heat storage and extraction flow path and the heat supply flow path are connected with the first heat exchange module, the second heat exchange module is connected in the heat storage and extraction flow path and the heat supply flow path, the buried pipe is arranged in the heat storage and extraction flow path, and the buried pipe is configured to be buried below a ground surface and store the heat transferred by the data center heat dissipation system into soil below the ground surface, or transfer heat stored in the soil below the ground surface to the heat supply flow path through the second heat exchange module.

Abstract: A heat dissipation system and method for a data center are provided. The heat dissipation system includes a first heat exchanger, a second heat exchanger, a third heat exchanger, and a first controller. The first heat exchanger and the second heat exchanger form a first cooling circuit with a cooling medium outlet and a cooling medium inlet of the data center, and the second heat exchanger and the third heat exchanger form a second cooling circuit. The third heat exchanger is connected to a heat recovery system. The first controller is connected to the first heat exchanger and the second heat exchanger, and is configured to control a heat exchange ratio of the first heat exchanger to the second heat exchanger.

Abstract: An energy efficiency calculation method includes calculating an hourly cooling load of a cooling area, determining an hourly power consumption of a chiller unit, an hourly power consumption of a water pump, and an hourly power consumption of a cooling tower of a refrigeration machine room, and calculating an energy efficiency of a water system of the refrigeration machine room based on the hourly cooling load, the hourly power consumption of the chiller unit, the hourly power consumption of the water pump, and the hourly power consumption of the cooling tower.

Abstract: The invention discloses a traceability system for pesticide residues, the main points of the technical scheme: the traceability system for pesticide residues, comprising the following steps; step 1, collecting the basic properties of a variety of pesticides commonly used in crops; step 2, collecting the degradation properties of pesticides in many different types of soils; step 3, collecting the rainfall, irrigation conditions and other agricultural operation factors; step 4, predicting the risk of pesticide residues on the surface of the soil after use, and speculating on the transfer pollution of pesticides to crops; step 5, predicting the pesticide residues available to leach into groundwater after pesticide use; step 6, predicting the pesticide residues available to leach into surface water after pesticide use.

Abstract: Thionyl tetrafluoride gas reacts efficiently with primary amines to form reactive iminosulfur oxydifluoride compounds. These dual SVI—F loaded iminosulfur oxydifluoride compounds, in turn, readily react with secondary amines or aryloxy silyl ethers (ArO—SiR3), yielding the corresponding fused heteroatom-linked substrates. Iminosulfur oxyfluoride polymers also are provided by disclosed methods.

Abstract: A carbon nanotube aligned film as well as a preparation method and application thereof are disclosed. The preparation method includes: providing a carbon nanotube dispersion solution comprising a selected carbon nanotube, a polymer as a carbon nanotube dispersing agent and binding to the selected carbon nanotube, an aromatic molecule binding to the selected carbon nanotube and allowing the surface of the selected carbon nanotube to have the same charges and an organic solvent being at least used for cooperating with the rest components of the dispersion solution to form uniform dispersion solution; and introducing a water phase layer to the upper surface of the dispersion solution to form a double-layer liquid phase system, partially or completely inserting a base into the double-layer liquid system, and then pulling out the base so as to form the carbon nanotube aligned film on the surface of the base.

Abstract: A carbon nanotube aligned film as well as a preparation method and application thereof are disclosed. The preparation method includes: providing a carbon nanotube dispersion solution comprising a selected carbon nanotube, a polymer as a carbon nanotube dispersing agent and binding to the selected carbon nanotube, an aromatic molecule binding to the selected carbon nanotube and allowing the surface of the selected carbon nanotube to have the same charges and an organic solvent being at least used for cooperating with the rest components of the dispersion solution to form uniform dispersion solution; and introducing a water phase layer to the upper surface of the dispersion solution to form a double-layer liquid phase system, partially or completely inserting a base into the double-layer liquid system, and then pulling out the base so as to form the carbon nanotube aligned film on the surface of the base.

Abstract: Condensation of fluoro-substituted and silyl-substituted monomers provides polymers suitable for use, e.g., as engineering polymers. A monomer composition is condensed in the presence of a bifluoride or poly(hydrogen fluoride) fluoride salt. The monomer composition contains a compound of formula F-X-F and a compound of formula (R1)3Si—Z—Si(R1)3, and forms an alternating X-Z polymer chain and a silyl fluoride byproduct. X has the formula -A(-R2-A)n-; each A is SO2, C(?O), or Het; R2 is an organic moiety; n is 0 or 1; Het is an aromatic nitrogen heterocycle; Z has the formula -L-R3-L-; each L is O, S, or N(R4); and each R3 is an organic moiety, and R4 comprises H or an organic moiety.

Abstract: Thionyl tetrafluoride gas reacts efficiently with primary amines to form reactive iminosulfur oxydifluoride compounds. These dual SVI—F loaded iminosulfur oxydifluoride compounds, in turn, readily react with secondary amines or aryloxy silyl ethers (ArO—SiR3), yielding the corresponding fused heteroatom-linked substrates. Iminosulfur oxyfluoride polymers also are provided by disclosed methods.

Abstract: Condensation of fluoro-substituted and silyl-substituted monomers provides polymers suitable for use, e.g., as engineering polymers. A monomer composition is condensed in the presence of a bifluoride or poly(hydrogen fluoride) fluoride salt. The monomer composition contains a compound of formula F-X-F and a compound of formula (R1)3Si—Z—Si(R1)3, and forms an alternating X-Z polymer chain and a silyl fluoride byproduct. X has the formula -A(-R2-A)n-; each A is SO2, C(?O), or Het; R2 is an organic moiety; n is 0 or 1; Het is an aromatic nitrogen heterocycle; Z has the formula -L-R3-L-; each L is O, S, or N(R4); and each R3 is an organic moiety, and R4 comprises H or an organic moiety.

Abstract: A heat dissipation simulator of a component on a printed circuit board (PCB) includes a simulation board and a simulated heat source. The simulation board includes an iron layer and a plastic layer. The simulated heat source includes a simulation chip, a thermal, and a heat sink. The simulation chip, the thermal piece, and the heat sink are mounted on the simulation board in that order. The heat dissipation simulator replaces a sample of the PCB with the component for simulating working states of the component on the PCB.

Abstract: A heat dissipation simulator of a component on a printed circuit board (PCB) includes a simulation board and a simulated heat source. The simulation board includes an iron layer and a plastic layer. The simulated heat source includes a simulation chip, a thermal, and a heat sink. The simulation chip, the thermal piece, and the heat sink are mounted on the simulation board in that order. The heat dissipation simulator replaces a sample of the PCB with the component for simulating working states of the component on the PCB.

Abstract: A cable binding device for binding cables includes a connector from which the cables extend, a fixing member detachably mounted to the connector, and a binding member pivotably mounted to the fixing member to bind the cables.

Abstract: A plug tool for plugging or unplugging a connector includes a first operation member and a second operation member. The connector includes a plug, a resilient latching piece, and a cable. The first operation member includes a fastening shell receiving the plug and a sleeve extending out from the fastening shell receiving the cable of the connector. The second operation member is rotatably connected to the sleeve. The second operation member includes a pressing portion for pressing the latching piece of the connector toward the plug.

Abstract: A connector assembly includes a connector and an auxiliary device. The connector includes a connection portion, and a cable connected to a rear end of the connection portion. A latch extends up and back from a front end of the connection portion. The auxiliary device includes a fastening member fastened to the connector, and a resilient tab extending up and forward from the fastening member. A front end of the resilient tab is located above the latch.

Abstract: A touch panel includes a touch sensitive layer, a substrate opposite to the touch sensitive layer, a conductive layer arranged between the touch sensitive layer and the substrate, and an antenna. The substrate includes a central display area and a marginal bezel area surrounding the display area. The antenna is disposed at one side of the substrate that faces away from the conductive layer. The antenna is formed on the bezel area by spraying.

Abstract: An electronic device includes at least a pair of opposite touch keys defined on a touch panel, a touch sensing unit, a storage unit, a touch control unit, and a CPU. The storage unit stores a key-coordinate area relation list, which defines a relationship between the keys and the coordinate areas. A touch sensing unit included in the touch control unit generates signals in response to user touches on the keys. A touch area determining module included determines the coordinates touched according to the signals, and searching the key-coordinate area relation list to determine the coordinate areas including touched coordinates, and determines whether the touched coordinates distributed in both of the coordinate areas corresponding to the one pair of the pair of opposite touch keys. Then the key determining module determines an “OK” key is touched if yes. The CPU executes a function corresponding. A related method is also provided.