Abstract: A light-emitting diode (LED) package having electrostatic discharge (ESD) protection function and a method of fabricating the same adopt a composite substrate to prepare an embedded diode and an LED, and use an insulating layer in the composite substrate to isolate some individual embedded diodes, such that the LED device has the ESD protection.

Abstract: An illumination device includes a light source positioned on an illumination axis, a lens assembly having at least two biconvex lenses disposed on the illumination axis, and a reflector having a reflecting surface enclosing the lens assembly. The light source emits a first group of light beams which directly impinge of the lens assembly, and a second group of light beams which directly impinge on the reflector. The second group of light beams being reflected by the reflecting surface such that they surround the first group of light beams after being refracted by the lens assembly, without such second group of light beams impinging on the lens assembly.

Abstract: A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.

Abstract: An illumination device includes a light source generating initial light beams, a lens assembly disposed on an axis, and a reflector comprising a reflecting surface. The initial light beams include a first and second reference light beams traveling along a first and second positions, respectively. The first reference light beam passes through the lens assembly to form a first predetermined light beam traveling away from the light source. A first angle is substantially formed between the first position and the axis. The second reference light beam is reflected by the reflective surface to form a second predetermined light beam traveling away from the light source. A second angle is formed between the first and second positions. The first angle is less than or equal to the second angle. The initial light beams are guided by the lens assembly and the reflector to emit the light beams in a projecting mode.

Abstract: A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.

Abstract: An electrostatic movable micro mirror chip includes an upper mirror plate and a lower electrode plate positioned and jointed together via pairs of fitting solder and positioning grooves. It improves the optical quality of the mirror chip by a lower joining temperature. The fitting and jointing achieves easy positioning and interconnection. The fabrication time and cost is less. The mirror in the mirror chip is plated with metallic coating on both sides so as to balance the stress and improve its flatness.

Abstract: A method of pre-etching a glass substrate for reducing a post-releasing time is provided. The method includes steps of: The glass substrate, a micro-structure and a silicon substrate are provided. The glass substrate is connected with the micro-structure. A first etching process is performed on the glass substrate for reducing the area of the glass substrate connected with the micro-structure. The micro-structure is connected with the silicon substrate and a second etching process is performed on the glass substrate for removing the micro-structure from the glass substrate.