Patents by Inventor Bing Wei

Bing Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080309749
    Abstract: The present invention relates to a method for processing the video telephone call failure based on the mobile communication network, which comprises the following steps: when a video telephone call initiated by a calling terminal has failed, the mobile communication network side returns a call failure message which contains a reason value of the call failure and a disconnecting signaling to said calling terminal in accordance with the reason of the call failure; after said calling terminal receives said call failure message, it queries and extracts said call failure prompt information data in accordance with said reason value and broadcasts the call failure prompt information locally.
    Type: Application
    Filed: April 21, 2006
    Publication date: December 18, 2008
    Applicant: China Mobile Communications Corporation
    Inventors: Lingjun Feng, Zhangzhe Liu, Congxing Ouyang, Jianfeng Tang, Zhaohui Zheng, Bing Wei
  • Publication number: 20080309750
    Abstract: The present invention discloses a method for processing the video telephone calling based on the mobile communication network.
    Type: Application
    Filed: April 21, 2006
    Publication date: December 18, 2008
    Inventors: Lingjun Feng, Zhangzhe Liu, Congxing Ouyang, Jianfeng Tang, Zhaohui Zheng, Bing Wei
  • Patent number: 7425477
    Abstract: A manufacturing method of a thin film transistor is provided. A buffer layer is formed on a substrate, and then a first and a second poly-silicon island are formed thereon. A gate-insulating layer is formed on the substrate, and a first and a second gate are formed thereon. A sacrificed layer is formed on the substrate and a photo-resist layer is formed thereon. The sacrificed layer above the first poly-silicon island is removed by using the photo-resist layer as a mask. A first ion implantation process is performed to form a first source/drain. The photo-resist layer is removed and a second ion implantation process is performed to form a second source/drain. At the same time, the second ion implantation process is used to implant ions into the buffer layer below the two sides of the second gate. A lightly-doped ion implantation process is performed after removing the sacrificed layer.
    Type: Grant
    Filed: December 16, 2005
    Date of Patent: September 16, 2008
    Assignee: Chunghwa Picture Tubes, Ltd.
    Inventors: Chia-Nan Shen, Wen-Chun Yeh, Chia-Chien Chen, Bing-Wei Wu, Hung-Chi Liao
  • Publication number: 20070238218
    Abstract: A method for fabricating an AMOLED display device is provided. A substrate is provided. A device layer having multiple active devices is formed on the substrate. A flat layer is configured on the device layer. A first, a second and a third color photoresistant layers are respectively configured on the flat layer and are patterned to form a first, a second and a third color filter layers. The first, the second and the third color filter layers respectively define a first, a second and a third pixel areas and are used for etching masks to etch the flat layer for exposing parts of the active devices. A first, a second and a third pixel electrode are respectively configured in the mentioned pixel areas and are electrically connected with the active devices. A first, a second and a third organic light emitting layers are respectively configured on the mentioned pixel electrodes.
    Type: Application
    Filed: April 7, 2006
    Publication date: October 11, 2007
    Inventors: Te-Hua Teng, Chia-Chien Chen, Fang-Yi Lu, Bing-Wei Wu, Yun-Pei Yang
  • Publication number: 20070122949
    Abstract: A manufacturing method of a thin film transistor is provided. A buffer layer is formed on a substrate, and then a first and a second poly-silicon island are formed thereon. A gate-insulating layer is formed on the substrate, and a first and a second gate are formed thereon. A sacrificed layer is formed on the substrate and a photo-resist layer is formed thereon. The sacrificed layer above the first poly-silicon island is removed by using the photo-resist layer as a mask. A first ion implantation process is performed to form a first source/drain. The photo-resist layer is removed and a second ion implantation process is performed to form a second source/drain. At the same time, the second ion implantation process is used to implant ions into the buffer layer below the two sides of the second gate. A lightly-doped ion implantation process is performed after removing the sacrificed layer.
    Type: Application
    Filed: December 16, 2005
    Publication date: May 31, 2007
    Inventors: Chia-Nan Shen, Wen-Chun Yeh, Chia-Chien Chen, Bing-Wei Wu, Hung-Chi Liao