Abstract: Disclosed are a quantum chip and a fabrication method therefor. The quantum chip includes a base substrate on which signal transmission lines are formed; and at least one insulating substrate located on the base substrate, where a qubit and a through hole penetrating through the insulating substrate are formed on the insulating substrate, a metal piece is formed in the through hole, and two ends of the metal piece are electrically connected to the signal transmission lines and the qubit, respectively.

Abstract: Disclosed are a fabrication method for a superconducting circuit and a superconducting quantum chip. The fabrication method includes: determining, on a substrate, a first junction region located between a first electrical element and a second electrical element, and a second junction region located between a first conductive plate and a second conductive plate that are formed in advance; forming a Josephson junction in the second junction region; detect an electrical parameter of the Josephson junction, and determining whether the electrical parameter is within a target parameter range; if yes, separating the Josephson junction through cutting, and moving the Josephson junction to the first junction region; and forming a first connection structure connecting the first superconducting layer to the first electrical element and a second connection structure connecting the second superconducting layer to the second electrical element.

Abstract: Disclosed are a fabrication method for a superconducting circuit and a superconducting quantum chip. The fabrication method includes: determining, on a substrate, a first junction region located between a first electrical element and a second electrical element, and a second junction region located between a first conductive plate and a second conductive plate that are formed in advance; forming a Josephson junction in the second junction region; detect an electrical parameter of the Josephson junction, and determining whether the electrical parameter is within a target parameter range; if yes, separating the Josephson junction through cutting, and moving the Josephson junction to the first junction region; and forming a first connection structure connecting the first superconducting layer to the first electrical element and a second connection structure connecting the second superconducting layer to the second electrical element.

Abstract: A superconducting quantum circuit and a fabrication method thereof, as well as a quantum computer, belong to the field of quantum computing technology. The superconducting quantum circuit comprises a first superconducting element (21) and a second superconducting element (22) formed on a substrate (1), and a superconducting quantum interference device. The superconducting quantum interference device comprises: a bottom electrode (241) integrally connected to the second superconducting element (22); a barrier layer (242) located on the bottom electrode (241); and a top electrode (31) that is electrically connected at one end to the first superconducting element (21) and forms a partial overlapping area with the barrier layer (242) to obtain a Josephson junction at the overlapping area.

Abstract: A mask fabrication method, mask, Josephson junction element, and quantum chip is provided, which belong to the field of quantum information, especially the field of quantum computing. The mask fabrication method includes: providing a dielectric layer, wherein a ratio of a thickness of the dielectric layer to a line width of a target pattern to be fabricated is greater than a cutting depth-to-width ratio allowed by a patterning apparatus; determining a first sublayer and a second sublayer of the dielectric layer, wherein a ratio of a thickness of the second sublayer to the line width of the target pattern is less than or equal to the cutting depth-to-width ratio; forming the target pattern on the second sublayer and a first pattern on the first sublayer, wherein the first pattern exposes the target pattern.

Abstract: Disclosed are a quantum chip and a fabrication method therefor. The quantum chip includes a base substrate on which signal transmission lines are formed; and at least one insulating substrate located on the base substrate, where a qubit and a through hole penetrating through the insulating substrate are formed on the insulating substrate, a metal piece is formed in the through hole, and two ends of the metal piece are electrically connected to the signal transmission lines and the qubit, respectively.

Abstract: An annular signal feed module is composed of a jack and a plug. The annular signal feed module includes the signal feed function of the traditional headphone. Besides, there is no jack hole in construction so that the moisture, water and dust intrusion are incapable to corrode and immerse the contacts and internal circuit parts, therefore, prolong the durability of the headphone signal feed device and the related electronic apparatuses such as televisions, stereos, cell phones and so forth. The present annular signal feed module is designed to integrate the features pertaining to no jack hole in construction of previous model patent certification no. M419356, and simplify the structural complexity, more than those, less modifications from traditional molds make it easier and convenient to be manufactured than product of patent no. M419356.

Abstract: An annular signal feed module is composed of a jack and a plug. The annular signal feed module includes the signal feed function of the traditional headphone. Besides, there is no jack hole in construction so that the moisture, water and dust intrusion are incapable to corrode and immerse the contacts and internal circuit parts, therefore, prolong the durability of the headphone signal feed device and the related electronic apparatuses such as televisions, stereos, cell phones and so forth. The present annular signal feed module is designed to integrate the features pertaining to no jack hole in construction of previous model patent certification no. M419356, and simplify the structural complexity, more than those, less modifications from traditional molds make it easier and convenient to be manufactured than product of patent no. M419356.