Abstract: The fan controller controls a plurality of fans in a server system according to a fan control signal. The fan controller comprises a control unit, a current monitor, a power supply module, current sampling units and switches. The power supply module transfers power to the fans through branch power lines respectively. The current sampling units and switches are disposed on the branch power lines respectively. The control unit switches the switches and the current sampling units sample current signals in the branch power lines respectively. When the current monitor monitors one of the current signals being over a threshold value, the current monitor issues an over-current signal to the control unit to turn off the corresponding switch to cut off the power supplied to the corresponding fan by the power supply module.

Abstract: A server system comprises a fan backplate, a server array, a substrate, a first fan controller and a second fan controller. The fan backplate couples with fans. The server array includes calculation nodes. The substrate has a multiplexer. The calculation nodes couple with the multiplexer. The first fan controller and the second fan controller couple with the calculation nodes through the multiplexer. A fan control signal is generated according to the real-time temperature of the calculation nodes to control the fans. The first fan controller and the second fan controller form a redundancy system.

Abstract: A server system comprises base boards connected in series. Each base board is connected to virtual media apparatus. Each virtual media apparatus includes system-on-chips, a switch unit, a control unit and a programmable module. The switch unit couples with the system-on-chips through a serial bus. The control unit couples with the switch unit to transform a serial signal to an intranet signal. The programmable module couples with the switch unit and the control unit to receive a control signal generated by the control unit and generate a selecting signal according to the control signal. The selecting signal is transferred to the switch unit to select one of the system-on-chips to be connected to the control unit.

Abstract: A computer system including a first processor, an error detecting circuit and a south bridge chip is provided. The first processor outputs a first catastrophic error signal. The error detecting circuit is coupled to the first processor to receive the first catastrophic error signal. When the first catastrophic error signal changes to a first level and is maintained for a period exceeding a first predetermined time, the error detecting circuit outputs an internal error reset signal. When the first catastrophic error signal changes to a first level and passes a second predetermined time, the error detecting circuit outputs a machine error reset signal. Here, the second predetermined time is greater than the first predetermined time. The south bridge chip is coupled to the error detecting circuit and reboots the computer system according the internal error reset signal or the machine error reset signal.

Abstract: A computer system including a first processor, an error detecting circuit and a south bridge chip is provided. The first processor outputs a first catastrophic error signal. The error detecting circuit is coupled to the first processor to receive the first catastrophic error signal. When the first catastrophic error signal changes to a first level and is maintained for a period exceeding a first predetermined time, the error detecting circuit outputs an internal error reset signal. When the first catastrophic error signal changes to a first level and passes a second predetermined time, the error detecting circuit outputs a machine error reset signal. Here, the second predetermined time is greater than the first predetermined time. The south bridge chip is coupled to the error detecting circuit and reboots the computer system according the internal error reset signal or the machine error reset signal.

Abstract: A structure compatible with I2C bus and system management (SM) bus is provided. The structure includes a first device having an I2C bus interface, a second device having a SM bus interface, and a timing buffering apparatus connected between the I2C bus interface and the SM bus interface. The timing buffering apparatus provides a time delay when the first device sends data to the second device so as to meet the requirement of the second device to data holding time.

Abstract: A structure compatible with I2C bus and system management (SM) bus is provided. The structure includes a first device having an I2C bus interface, a second device having a SM bus interface, and a timing buffering apparatus connected between the I2C bus interface and the SM bus interface. The timing buffering apparatus provides a time delay when the first device sends data to the second device so as to meet the requirement of the second device to data holding time.

Abstract: A hinge assembly (9) includes a shell (1), a coil spring (2), a shaft (3), and two bolts (4). The shell defines a cavity (12) therein, with one end of the shell being closed and the other end being open. Two holes (14) are defined in the shell near the open end. The shaft includes a cam (32), a soleplate (38), and an interconnecting neck (34). The cam includes a cam surface (324) at one end thereof, the cam surface including peaks and valleys. The spring and the shaft are received in the shell, but with the soleplate exposed outside. The spring biases the cam surface against the bolts no matter what part of the cam surface abuts the bolts. Because the hinge assembly of the present invention is effectively an integrated, modular structure, it is easily incorporated into a portable foldable device such as a mobile phone.

Abstract: A hinge assembly for joining a cover to a main body of a foldable device includes a hollow housing (10), a spring (20), a shaft (30), and a positioning pin (40). The housing includes an open end, an opposite rear end (11). The spring is received in the housing. The shaft includes a cam portion (34) received in the housing, and a shaft portion (32) passing through the spring and extending out through the rear end. One end of the spring biases the cam portion, and an opposite end of the spring biases the rear end. The pin is transversely retained in the housing near the open end, and is rotatable relative to the shaft and movably engaged with a cam surface of the cam portion. When the rear end is urged in an axial direction by the spring, the cam surface causes the pin to rotate the housing.

Abstract: A hinge assembly (9) includes a shell (1), a coil spring (2), a shaft (3), and two bolts (4). The shell defines a cavity (12) therein, with one end of the shell being closed and the other end being open. Two holes (14) are defined in the shell near the open end. The shaft includes a cam (32), a soleplate (38), and an interconnecting neck (34). The cam includes a cam surface (324) at one end thereof, the cam surface including peaks and valleys. The spring and the shaft are received in the shell, but with the soleplate exposed outside. The spring biases the cam surface against the bolts no matter what part of the cam surface abuts the bolts. Because the hinge assembly of the present invention is effectively an integrated, modular structure, it is easily incorporated into a portable foldable device such as a mobile phone.

Abstract: A modified push-pull booster circuit is proposed, wherein two alternately switching transistors are disposed on the primary winding of a transformer, and a bridge rectifier and a charging circuit are disposed on the secondary winding; wherein the bridge rectifier has a pair of inductors with inductive coupling installed on the first half and second half of the circuit. The push-pull circuit uses series inductance to step up the bus voltage, and, because of the degaussing effect when current is induced on the inductors, the inductance of the inductor can be decreased even without using snubber circuit, thus decreasing the peak voltage of the bridge rectifier, and balancing the magnitude of current flow in the secondary winding. By reducing the turn ratio on the transformer windings, the operating efficiency of the booster circuit can be considerably improved.

Abstract: A modified push-pull booster circuit is proposed, wherein two alternately switching transistors are disposed on the primary winding of a transformer, and a bridge rectifier and a charging circuit are disposed on the secondary winding; wherein the bridge rectifier has a pair of inductors with inductive coupling installed on the first half and second half of the circuit. The push-pull circuit uses series inductance to step up the bus voltage, and, because of the degaussing effect when current is induced on the inductors, the inductance of the inductor can be decreased even without using snubber circuit, thus decreasing the peak voltage of the bridge rectifier, and balancing the magnitude of current flow in the secondary winding. By reducing the turn ratio on the transformer windings, the operating efficiency of the booster circuit can be considerably improved.