Patents by Inventor Bingfei DOU

Bingfei DOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Millimeter-wave radar package module
    Patent number: 11894601
    Abstract: Provided is a millimeter-wave radar package module, which relates to antenna packaging. The millimeter wave radar package module includes a package and a plurality of antenna units packaged therein. The package includes a chip, and the chip includes a transmitter and a receiver. The antenna units are respectively connected to an output pin of the receiver and an output pin of the transmitter through a transmission line.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: February 6, 2024
    Assignee: 8TH RESEARCH INSTITUTE, CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
    Inventors: Zongming Duan, Chuanming Zhu, Ying Liu, Bowen Wu, Weiwei Jin, Bingfei Dou, Yuefei Dai
  • MILLIMETER-WAVE RADAR PACKAGE MODULE
    Publication number: 20220247066
    Abstract: Provided is a millimeter-wave radar package module, which relates to antenna packaging. The millimeter wave radar package module includes a package and a plurality of antenna units packaged therein. The package includes a chip, and the chip includes a transmitter and a receiver. The antenna units are respectively connected to an output pin of the receiver and an output pin of the transmitter through a transmission line.
    Type: Application
    Filed: March 19, 2021
    Publication date: August 4, 2022
    Inventors: Zongming DUAN, Chuanming ZHU, Ying LIU, Bowen WU, Weiwei JIN, Bingfei DOU, Yuefei DAI