Patents by Inventor Bingfei ZHANG

Bingfei ZHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTROMAGNETIC-INDUCTION HEATING DEVICE FOR THIN-FILM THERMOCOUPLE ON CERAMIC BLADE
    Publication number: 20230156873
    Abstract: Disclosed is an electromagnetic-induction heating device for a thin film thermocouple on a ceramic blade, including a spiral coil. The ceramic blade is enveloped in the spiral coil, and two ends of the spiral coil are both connected to an electromagnetic-induction heater. The ceramic blade is arranged in an alumina ceramic chamber, and the thin-film thermocouple is arranged on a surface of the ceramic blade. One end of the air channel is connected to an end of the alumina ceramic chamber, and the other end of the air channel is connected to an infrared nod temperature instrument and a vacuum pump. The infrared nod temperature instrument, the electromagnetic-induction heater, and the vacuum pump controller are electrically connected to the controller.
    Type: Application
    Filed: January 4, 2023
    Publication date: May 18, 2023
    Inventors: Zhongkai ZHANG, Bian TIAN, Hao LI, Bingfei ZHANG, Libo ZHAO
  • Tungsten-rhenium composite thin film thermocouple based on surface micropillar array with gas holes
    Patent number: 11598676
    Abstract: Provided herein is a tungsten-rhenium composite thin film thermocouple based on a surface micropillar array with gas holes. A tungsten-rhenium thin film thermocouple is arranged on a surface of a flat alumina ceramic substrate. Two tails of the tungsten-rhenium thin film thermocouple are respectively connected to a lead wire. A surface of the tungsten-rhenium thin film thermocouple is arrayed with a plurality of micron alumina micropillars to form an alumina micropillar array. Air is filled between the micron alumina micropillars to form the gas holes. The flat alumina ceramic substrate, the tungsten-rhenium thin film thermocouple and the alumina micropillar array form a three-layered laminated structure.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: March 7, 2023
    Assignee: XI'AN JIAOTONG UNIVERSITY
    Inventors: Zhongkai Zhang, Bian Tian, Bingfei Zhang, Jiangjiang Liu, Zhaojun Liu, Libo Zhao
  • TUNGSTEN-RHENIUM COMPOSITE THIN FILM THERMOCOUPLE BASED ON SURFACE MICROPILLAR ARRAY WITH GAS HOLES
    Publication number: 20220326092
    Abstract: Provided herein is a tungsten-rhenium composite thin film thermocouple based on a surface micropillar array with gas holes. A tungsten-rhenium thin film thermocouple is arranged on a surface of a flat alumina ceramic substrate. Two tails of the tungsten-rhenium thin film thermocouple are respectively connected to a lead wire. A surface of the tungsten-rhenium thin film thermocouple is arrayed with a plurality of micron alumina micropillars to form an alumina micropillar array. Air is filled between the micron alumina micropillars to form the gas holes. The flat alumina ceramic substrate, the tungsten-rhenium thin film thermocouple and the alumina micropillar array form a three-layered laminated structure.
    Type: Application
    Filed: June 23, 2022
    Publication date: October 13, 2022
    Inventors: Zhongkai ZHANG, Bian TIAN, Bingfei ZHANG, Jiangjiang LIU, Zhaojun LIU, Libo ZHAO