Abstract: The disclosure provides a code completion method based on a big model. The method includes: determining a first code element where a position to be completed is located in a first code file to be completed; determining a second code file having a dependency relationship with the first code file from a development project to which the first code file belongs; determining, according to the first code element, a second code element whose correlation with the first code element meets a preset condition, in which the second code element belongs to at least one of the first code file or the second code file; and generating a target code corresponding to the position to be completed through a big model based on a signature of the second code element.

Abstract: There is provided a code retrieval method and apparatus based on a large language model, an electronic device and a readable storage medium, which relates to the field of artificial intelligence technologies, such as large language model technologies, big data technologies, cloud service technologies, or the like.

Abstract: Disclosed is an electromagnetic-induction heating device for a thin film thermocouple on a ceramic blade, including a spiral coil. The ceramic blade is enveloped in the spiral coil, and two ends of the spiral coil are both connected to an electromagnetic-induction heater. The ceramic blade is arranged in an alumina ceramic chamber, and the thin-film thermocouple is arranged on a surface of the ceramic blade. One end of the air channel is connected to an end of the alumina ceramic chamber, and the other end of the air channel is connected to an infrared nod temperature instrument and a vacuum pump. The infrared nod temperature instrument, the electromagnetic-induction heater, and the vacuum pump controller are electrically connected to the controller.

Abstract: Provided herein is a tungsten-rhenium composite thin film thermocouple based on a surface micropillar array with gas holes. A tungsten-rhenium thin film thermocouple is arranged on a surface of a flat alumina ceramic substrate. Two tails of the tungsten-rhenium thin film thermocouple are respectively connected to a lead wire. A surface of the tungsten-rhenium thin film thermocouple is arrayed with a plurality of micron alumina micropillars to form an alumina micropillar array. Air is filled between the micron alumina micropillars to form the gas holes. The flat alumina ceramic substrate, the tungsten-rhenium thin film thermocouple and the alumina micropillar array form a three-layered laminated structure.

Abstract: Provided herein is a tungsten-rhenium composite thin film thermocouple based on a surface micropillar array with gas holes. A tungsten-rhenium thin film thermocouple is arranged on a surface of a flat alumina ceramic substrate. Two tails of the tungsten-rhenium thin film thermocouple are respectively connected to a lead wire. A surface of the tungsten-rhenium thin film thermocouple is arrayed with a plurality of micron alumina micropillars to form an alumina micropillar array. Air is filled between the micron alumina micropillars to form the gas holes. The flat alumina ceramic substrate, the tungsten-rhenium thin film thermocouple and the alumina micropillar array form a three-layered laminated structure.