Abstract: An air-coupled ultrasonic plane stress detection method for a composite material based on dual-modal sound-time ratios of a Lamb wave includes: S1: assembling a detection device; S2: based on the detection device and the dual-modal sound-time ratios of the Lamb wave in S1, using unidirectionally loaded stress to obtain different stress coefficient relations; S3: based on the stress coefficient relations in S2, solving stress coefficients; S4: based on the stress coefficients in S3, acquiring three sound-time ratios; S5: based on the sound-time ratios in S4, describing a stress state of a detection point; and S6: repeating S4 and S5 till completing detection and scanning. The method improves the accuracy of stress coefficient calibration and air-coupled ultrasonic stress representation of a composite material panel greatly.

Abstract: The present application relates to a cell detection method and apparatus, a device, a readable storage medium, and a program product. The method may include: obtaining a first image, where the first image includes a first area where a cell is located; determining a first edge line of the cell based on the first area; and determining a detection result of the cell based on grayscale values corresponding to pixels in a preset area in the first image, where the detection result is used to indicate whether the cell includes a bottom support sheet, and the preset area is an area within a preset range from the first edge line.

Abstract: An ultrasonic measurement method for plane stress on the basis of a multi-wafer air-coupled transducer relates to the technical field of ultrasonic testing. The method solves problems that a traditional measurement method for plane stress generally computes the plane stress by changing at least 3 different measurement directions and obtaining information such as an acoustic time difference in the 3 measurement directions by using a pair of contact ultrasonic transducers, which is too complicated in operation, and a coupling agent can influence measurement accuracy of the plane stress.

Abstract: A first communication apparatus obtains a sampling cycle. The sampling cycle is a time interval at which the first communication apparatus samples occupancy of a first buffer. The first buffer is used to store a data packet of a first priority. The first communication apparatus determines occupancy of the first buffer at a first sampling moment based on the sampling cycle. The first communication apparatus determines first duration based on the sampling cycle and the occupancy of the first buffer at the first sampling moment. The first duration is duration for which a second communication apparatus stops sending data to the first communication apparatus. The first communication apparatus sends first indication information to the second communication apparatus based on the first duration.

Abstract: The present disclosure relates to a semiconductor structure and a method for forming the semiconductor structure. The semiconductor structure includes: a first wafer, including a first substrate and a first dielectric layer on the first substrate, a pad groove and a pad structure in the pad groove are formed in the first substrate and the first dielectric layer, and the pad groove extends through the first substrate along a direction from the first substrate to the first dielectric layer and extends into a partial thickness of the first dielectric layer; and an isolation ring structure, arranged in the first substrate around the pad groove and extending through the first substrate along the direction from the first substrate to the first dielectric layer.

Abstract: The present disclosure relates to a semiconductor structure and a method for forming the semiconductor structure. The semiconductor structure includes: a first wafer, including a first substrate and a first dielectric layer on the first substrate, a plurality of through-silicon via (TSV) structures in an array arrangement are formed in the first substrate, and the TSV structures extend through the first substrate along a direction from the first substrate to the first dielectric layer and extend into a partial thickness of the first dielectric layer; and an isolation ring structure, arranged in the first substrate around the plurality of TSV structures and extending through the first substrate along the direction from the first substrate to the first dielectric layer.

Abstract: The disclosure discloses an air-coupled ultrasonic detection method and device based on a defect probability reconstruction algorithm.

Abstract: An ultrasonic phased array transducer device with a two-dimensional hinge array structure belongs to equipment in the technical field of ultrasonic detection. A connecting rod is fixedly connected to a fixed support and a two-dimensional hinge array respectively. Voice coil motors are symmetrically arranged in a shape of the British “Union Jack” with the connecting rod as a center, and are fixedly connected to the fixed support. Force output rods are respectively connected to voice coil motor coils and the upper surfaces of array units. Piezoelectric array elements are fixedly connected to the lower surfaces of all the array units. The numbers of the voice coil motors and the force output rods are 2N (N=4, 8, 12, 16, 20), the number of the piezoelectric array elements is 2N+1, and different N values are selected according to the sizes of workpieces to be detected.

Abstract: An ultrasonic phased array transducer device with a two-dimensional hinge array structure belongs to equipment in the technical field of ultrasonic detection. A connecting rod is fixedly connected to a fixed support and a two-dimensional hinge array respectively. Voice coil motors are symmetrically arranged in a shape of the British “Union Jack” with the connecting rod as a center, and are fixedly connected to the fixed support. Force output rods are respectively connected to voice coil motor coils and the upper surfaces of array units. Piezoelectric array elements are fixedly connected to the lower surfaces of all the array units. The numbers of the voice coil motors and the force output rods are 2N (N=4, 8, 12, 16, 20), the number of the piezoelectric array elements is 2N+1, and different N values are selected according to the sizes of workpieces to be detected.