Patents by Inventor Binh K. Le

Binh K. Le has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular semiconductor package
    Patent number: 10015882
    Abstract: Embodiments described herein relate generally to a microelectronic packaging and the manufacture thereof. A carrier may have a die attached to a top face thereof. A printed circuit board may be attached to the top face of the carrier. The printed circuit board may have a hole in which the die is disposed. A lid may be attached to the printed circuit board opposite the carrier so that the die is enclosed by the carrier, the printed circuit board, and the lid. The printed circuit board may form a seal ring around the die. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: July 3, 2018
    Assignee: Qorvo US, Inc.
    Inventors: Dylan Murdock, Binh K. Le, Michael J. Arnold, Walid Meliane