Abstract: Methodologies and a device for simulating individual process steps and producing parameters representing each individual process signal profile are provided. Embodiments include collecting, by way of a programmed processor, wafer level data in the form of electrical signatures during processing steps in the production of a semiconductor device; converting the electrical signatures during each of the processing steps into signal matrix (MS) modeling parameters; comparing the MS modeling parameters to predefined MS modeling parameters; and adjusting at least one processing step based on a result of the comparing step for process control.