Abstract: An automated laser shock peening (LSP) process equipment system for an aero-engine blade, including: a base, where a loading and unloading manipulator, working manipulator, reverse engineering mechanism, coating apparatus, and LSP apparatus are disposed; the loading and unloading manipulator is configured to grab a blade and place it on the reverse engineering mechanism, which includes a reverse engineering instrument and controller that are connected, the instrument can generate three-dimensional digital data of the blade, and the controller generates a working path for coating and LSP according to the data, and transmits the path to the working manipulator; the loading and unloading manipulator places the blade into the pallet, and the working manipulator drives the blade to a corresponding position according to the path. Independent locating and clamping systems of the pallet and the blade and the pallet and the manipulator fix a position of the blade relative to the manipulator.

Abstract: The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad Laminate (CCL) whose copper foil surface has been removed. Next, an electro-less copper layer is plated on the substrate for forming a plurality of plated through holes. After a wire pattern is formed on the substrate, a solder preventive layer is formed on top of the wire pattern. Next, a plurality of openings is created in between the solder preventive layer for exposing the contact pads. Finally, a protective layer is plated on top of the contact pads.

Abstract: The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad Laminate (CCL) whose copper foil surface has been removed. Next, an electro-less copper layer is plated on the substrate for forming a plurality of plated through holes. After a wire pattern is formed on the substrate, a solder preventive layer is formed on top of the wire pattern. Next, a plurality of openings is created in between the solder preventive layer for exposing the contact pads. Finally, a protective layer is plated on top of the contact pads.

Abstract: The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad Laminate (CCL) whose copper foil surface has been removed. Next, an electro-less copper layer is plated on the substrate for forming a plurality of plated through holes. After a wire pattern is formed on the substrate, a solder preventive layer is formed on top of the wire pattern. Next, a plurality of openings is created in between the solder preventive layer for exposing the contact pads. Finally, a protective layer is plated on top of the contact pads.