Patents by Inventor Birgit Beck

Birgit Beck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11396706
    Abstract: An electroless copper plating bath for depositing a copper or copper alloy layer on a surface of a substrate, including copper ions; a reducing agent; a complexing agent for copper ions; wherein the bath further includes at least one compound according to formula (1): in which Z1 and Z2 are independently selected from the group consisting of hydrogen; carboxylic acid; carboxylate; sulfonic acid; sulfonate; carboxamide; nitrile; nitro; trialkylammonium; 2-carboxyvinyl; 2-vinylcarboxylate; 2-(trialkylammonium)vinyl; hydroxamic acid; and oxime; provided at least one of Z1 and Z2 is not hydrogen; and in which R1, R2, R3 and R4 are: i. R1, R2, R3 and R4 are hydrogen; or ii. R1 with R2 form together an aromatic ring, R3 and R4 are hydrogen; or iii. R3 with R4 form together an aromatic ring, R1 and R2 are hydrogen; or iv. both R1 with R2 and R3 with R4 form together an aromatic ring, respectively.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: July 26, 2022
    Assignee: Atotech Deutschland GmbH
    Inventors: Roman-David Kulko, Sebastian Zarwell, Kilian Klaeden, Anna Peter, Birgit Beck
  • Publication number: 20210246559
    Abstract: An electroless copper plating bath for depositing a copper or copper alloy layer on a surface of a substrate, including copper ions; a reducing agent; a complexing agent for copper ions; wherein the bath further includes at least one compound according to formula (1): in which Z1 and Z2 are independently selected from the group consisting of hydrogen; carboxylic acid; carboxylate; sulfonic acid; sulfonate; carboxamide; nitrile; nitro; trialkylammonium; 2-carboxyvinyl; 2-vinylcarboxylate; 2-(trialkylammonium)vinyl; hydroxamic acid; and oxime; provided at least one of Z1 and Z2 is not hydrogen; and in which R1, R2, R3 and R4 are: i. R1, R2, R3 and R4 are hydrogen; or ii. R1 with R2 form together an aromatic ring, R3 and R4 are hydrogen; or iii. R3 with R4 form together an aromatic ring, R1 and R2 are hydrogen; or iv. both R1 with R2 and R3 with R4 form together an aromatic ring, respectively.
    Type: Application
    Filed: June 5, 2019
    Publication date: August 12, 2021
    Inventors: Roman-David KULKO, Sebastian ZARWELL, Kilian KLAEDEN, Anna PETER, Birgit BECK
  • Patent number: 9822034
    Abstract: The present invention discloses a method for electroless plating of a metal or metal alloy onto a metal or a metal alloy structure comprising a metal such as molybdenum or titanium and alloys containing such metals. The method comprises the steps of activation, treatment in an aqueous solution comprising at least one nitrogen-containing compound or a hydroxy carboxylic acid and electroless plating of a metal or metal alloy.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: November 21, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Frank Brüning, Birgit Beck, Bexy Dosse, Johannes Etzkorn
  • Patent number: 9650718
    Abstract: The invention relates to an electroless aqueous copper plating solution, comprising: a source of copper ions, a reducing agent or a source of a reducing agent, and a combination of complexing agents comprising i) polyamino disuccinic acid, polyamino monosuccinic acid, or a combination thereof, and ii) one or more of ethylenediamine tetraacetic acid, N?-(2-Hydroxyethyl)-ethylenediamine-N,N,N?-triacetic acid, and N,N,N?,N?-Tetrakis (2-hydroxypropyl)ethylenediamine, as well as methods for electroless copper plating utilizing the solution and uses of the solution for the plating of various substrates.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: May 16, 2017
    Assignee: ATOTECH DEUTSCHLAND GMBH
    Inventors: Frank Brüning, Elisa Langhammer, Michael Merschky, Christian Lowinski, Jörg Schulze, Johannes Etzkorn, Birgit Beck
  • Publication number: 20160273112
    Abstract: The invention relates to an electroless aqueous copper plating solution, comprising a source of copper ions, a reducing agent or a source of a reducing agent, and a combination comprising i) N,N,N?,N?-Tetrakis (2-hydroxypropyl)ethylenediamine or a salt thereof, and ii) N?-(2-Hydroxyethyl)-ethylenediamine-N,N,N?-triacetic acid or a salt thereof, as complexing agents, as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates.
    Type: Application
    Filed: March 25, 2014
    Publication date: September 22, 2016
    Inventors: Frank BRÜNING, Birgit BECK, Elisa LANGHAMMER, Johannes ETZKORN, Michael MERSCHKY, Jörg SCHULZE, Christian LOWINSKI
  • Publication number: 20160053379
    Abstract: The invention relates to an electroless aqueous copper plating solution, comprising—a source of copper ions, —a reducing agent or a source of a reducing agent, and—a combination of i) at least one polyamino disuccinic acid, or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid, and ii) one or more of a compound which is selected from the group consisting of ethylenediamine tetraacetic acid, N?-(2-Hydroxyethyl)-ethylenediamine-N,N,N?-triacetic acid, and N,N,N?,N?-Tetrakis(2-hydroxypropyl)ethylenediamine, as complexing agents, as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates.
    Type: Application
    Filed: March 25, 2014
    Publication date: February 25, 2016
    Inventors: Frank BRÜNING, Elisa LANGHAMMER, Michael MERSCHKY, Christian LOWINSKI, Jörg SCHULZE, Johannes ETZKORN, Birgit BECK
  • Publication number: 20140113158
    Abstract: The present invention discloses a method for electroless plating of a metal or metal alloy onto a metal or a metal alloy structure comprising a metal such as molybdenum or titanium and alloys containing such metals. The method comprises the steps of activation, treatment in an aqueous solution comprising at least one nitrogen-containing compound or a hydroxy carboxylic acid and electroless plating of a metal or metal alloy.
    Type: Application
    Filed: April 17, 2012
    Publication date: April 24, 2014
    Applicant: Atotech Deutschland GmbH
    Inventors: Frank Brüning, Birgit Beck, Bexy Dosse, Johannes Etzkorn